电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

17H281124LF

产品描述D Subminiature Connector
产品类别连接器    连接器   
文件大小80KB,共1页
制造商Amphenol(安费诺)
官网地址http://www.amphenol.com/
标准
下载文档 详细参数 全文预览

17H281124LF概述

D Subminiature Connector

17H281124LF规格参数

参数名称属性值
联系完成配合GOLD (15) OVER NICKEL (50)
连接器类型D SUBMINIATURE CONNECTOR
联系完成终止GOLD OVER NICKEL
触点材料PHOSPHOR BRONZE
JESD-609代码e4
是否Rohs认证Yes
Is SamacsysN
Objectid1333818759
Reach Compliance CodeUnknown
ECCN代码EAR99

文档预览

下载PDF文档
Amphenol
D Subminiature Interconnects
17H/G17H
Materials
Housing
Contacts
Shell
Board-locks
Screw-locks
– 94V-0 thermoplastic
– P/B with 50µ” Ni
– Carbon steel
– P/B
– Brass
– 5A
– 250VAC/rms 60Hz
DSub Stacked Right Angle PCB Mount
Durability
Gold Flash
15µ” Gold
30µ” Gold
– 75 cycles
– 125 cycles
– 250 cycles
Specifications
According to Mil-C-24308/NFC93425/HE507
8.38
±0.38
(.330±.015)
Electrical
Current
Voltage
Approvals
UL
CSA
– File E64911
– File LR57744
2.84 (.112)
POSITION #1
Part Number System:
XXXX X XX XXXX X
Stacked DSub R/A PCB
17H: Supplied from Europe
G17H: Supplied from Asia
SPACING BETWEEN PORTS
See F* on drawing
1: 15.88mm
2: 19.05mm
3: 22.86mm
TOP CONNECTOR TYPE
BOTTOM CONNECTOR TYPE
1: 9 Position male
2: 9 Position female
3: 15 Position male
4: 15 Position female
5: 25 Position male
6: 25 Position female
7: 15 Position HI DENSITY female
8: 50 Position SCSI-2 female
CONTACT FINISH
0: Gold Flash
1: 15µ” Gold
2: 30µ” Gold
3: Full gold flash
PNS-17H Rev.F
Suffix may be added to Part Number.
This Suffix is for Internal use mainly.
Additional Suffix ‘EU’ or ‘LF’ may be
added for RoHS compliant product.
10°
2.77 (.109)
BOARD MOUNT OPTION
0:
∅3.05mm
clear hole (x4)
1: #4-40 threaded hole (x4)
2: Dual Arrowhead board-lock
3: Quad Arrowhead board-lock
FRONT SHELL FINISH
0: Zinc chromate
1: Tin/Lead over Nickel
2: Nickel
8.08 (.318±.01)
2.84 (.112)
3.81 (.150)
2.84 (.112)
Recommanded P.C.B. Layout
1.27 (.050)
B±0.13 (.005)
E±0.05 (.002)
2.77 (.109)
ø3.05 (.120)
3.3
±0.13
(.130±.005)
FLANGE MOUNTING OPTION
0: #4-40 threaded hole
1: #4-40 threaded screw-lock
installed
2: #4-40 threaded hole with
#4-40 threaded screw-lock
bulk-packed
3:
∅3.05mm
clear hole
4: M3 threaded hole
5: M3 screw-lock installed
6: #4-40 threaded hole with
M2.6 screw-lock bulk-packed
7: #4-40 threaded screw-lock
clinch-mounted installed
16.08 (.633)
7.9
±0.13
(.311±.015)
8
(.315)
2.84 (.112)
8.08 (.318)
E±0.05 (.002)
G**
3.81 (.150)
F*
No. of
Positions
9
15
25
15 HI DENSITY
A
30.84
39.24
53.04
30.84
B
24.99
33.32
47.04
24.99
Dimensions
C
16.92
24.70
38.96
16.92
D
16.24
24.56
38.38
16.24
E
11.09
19.39
33.24
10.31
2.84 (.112)
only for quad boardlock
ø1.02 (.040)
G17ZC
DSub Shield Can for Over-moulding
Materials
Can
– Cold rolled steel tin plated
Shielding can used in conjunction with a over-
moulding process
Part Number System:
G17ZC XX XXX
DSub PCB Shield
For over-molding
NUMBER OF POSITIONS
Standard & (High Density)
09: 9 Position (15)
15: 15 Position (26)
25: 25 Position (44)
37: 37 Position (62)
50: 50 Position (78)
Serial No.
001
002
003
001
002
003
AMTA/ASF-D
SERIAL NUMBER
See table
Suffix may be added to Part Number.
This Suffix is for Internal use mainly.
Additional Suffix ‘EU’ or ‘LF’ may be
added for RoHS compliant product.
G17ZC.pdf
No. of Positions
9
9
9
15
15
15
Dim. A
7.2
9.5
10.8
7.2
9.5
10.8
Serial No.
001
002
003
001
001
002
No. of Positions
25
25
25
37
50
50
Dim. A
7.2
9.5
10.8
14
11
13
Typical Product for
15 Position Standard D-Sub
26 Position High Density D-Sub
8 (.315)
25.7 (1.01)
5.9 (.232)
6.1 (.240)
25.5 (1)
12.55
±0.38
(.494±.015)
A±0.38 (.015)
B±0.13 (.005)
C±0.13 (.005)
D±0.13 (.005)
F-8
MaixSense R329开发板Tina系统的部署
本帖最后由 x1816 于 2021-8-30 21:47 编辑 安装串口驱动 板子上的USB转串口是CH340方案,先装一下驱动。 驱动可以从这里下载;https://api.dl.sipeed.com/shareURL/MAIX/tools/ch340_ch34 ......
x1816 国产芯片交流
职位空缺,全球十大半导体公司之一
朋友公司是全球IC公司巨头,在全球拥有超过40000的员工,他们公司的工程师有300多人,因为公司想把这个研发中心建成全球最大的研发中心,所以现在有一些职位空缺。。和大家分享一下!Senior Sta ......
cindysweety 测试/测量
两个listctrl之间控制的问题
我在dialog上放两个listctrl:分别是List1,Llist2; 我的目的是点List1的某个Item的时候,List2刷新,并显示相应的列表; 比如:点List1中的“广东省”,则List2列表显示“广州”、“深圳” ......
akumax 嵌入式系统
5G无线接入网成为通信服务商面临的最大挑战
5G,即第五代无线通信,正在全球范围内扩展开来,通信服务提供商(CSP)都在争先恐后地在各自市场上提供完整的5G服务。虽然风险很大,但潜在的商业利益也很大。5G技术可提供更快的网络连接速度、 ......
zqy1111 机器人开发
AVR开发工具及基本知识
PDF页面干净整洁,确实是对新手的。开头第一句话为:“首先,请放松,我们首先要做的只是下载AVR开发软件和相关的资料。下载前确保这些软件有效,下载的时间取决于你连接互联网的速度。” 分 ......
电子制作 Microchip MCU
SAMR21中的SPI中断处理函数
请教下,SPI的callback和poll例程如何运行啊?在callback例程中我没有找到SPi中断处理函数啊,哪位高手指点下...
gsnuaa2003 Microchip MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1112  2269  1783  859  723  23  46  36  18  15 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved