DAD SERIES
SLIDE AUTO INSERTING “SMT” TYPE
Interconnect
x
Features
• Same size with IC, can be assembled by any automatic IC inserter.
• Molded .300” integrated circuit packing outline allowing automatic insertion.
• Smaller size makes better heat convection during PC board reflow wave soldering.
• Top tape sealed to withstand wave soldering, board washing.
• All plastics are UL 94V-0 grade fire retardant.
• Gold plated contact to ensure low contact resistance and tin plated
terminals to prevent contamination during soldering (
tin/gold
).
x
Specifications
x
Applications
• Numerical setting for computer terminal equipment.
• Price setting for vending machines.
: 25mA, 24 VDC
: 100mA
: 50mΩ Max.
: 100mΩ Max.
: 1000MΩ. Min. at 100 VDC.
: 500 VDC Min. for 1 min.
: 5pF Max.
• Programming for game machines
• Programming for industrial equipment and measuring instruments.
1
. ELECTRICAL
1-1 Contact rating
switching
non-switching
1-2 Contact resistance
initial
after life test
1-3 Insulation resistance
1-4 Dielectric strength
1-5 Capacitance between
adjacent switches
2
. MECHANICAL and ENVIRONMENTAL
2-1 Temperature rating
Operating
Storage
2-2 Operation force
2-3 Mechanical life
2-4 Humidity
2-5 Vibration
2-6 Solderability
2-7 Soldering temperature
through hole wave soldering
SMT reflow soldering
: 260°C max. for 5 seconds.
: 210°C for 20 seconds, 230°C peak for 3 sec.
: -25°C to +70°C
: -40°C to +85°C
: 800g Max.
: 2000 operations
: 95% RH, 40°C for 96 Hrs.
: Per MIL-STD-202F, method 204D
: 95% coverage after 230°C +/- 5 for 5 sec.
14
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
