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1N4689-1E3

产品描述Voltage Regulator _ DO-35
产品类别分立半导体    二极管   
文件大小169KB,共5页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
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1N4689-1E3概述

Voltage Regulator _ DO-35

1N4689-1E3规格参数

参数名称属性值
其他特性METALLURGICALLY BONDED
最大电压容差5%
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
端子面层MATTE TIN
端子形式WIRE
端子位置AXIAL
外壳连接ISOLATED
端子数量2
极性UNIDIRECTIONAL
标称参考电压5.1 V
元件数量1
二极管元件材料SILICON
二极管类型ZENER DIODE
最大功率耗散0.5 W
表面贴装NO
技术ZENER
工作测试电流0.05 mA
配置SINGLE
JEDEC-95代码DO-204AH
JESD-30 代码O-LALF-W2
JESD-609代码e3
最高工作温度175 °C
最低工作温度-65 °C
是否Rohs认证Yes
Factory Lead Time22 weeks
YTEOL24
Country Of OriginPhilippines, USA
ECCN代码EAR99
Is SamacsysN
Objectid4016570522
包装说明ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance CodeCompliant

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1N4678-1 thru 1N4717-1
Available on
commercial
versions
500 mW AXIAL-LEADED ZENER DIODES
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
The 1N4678-1 thru 1N4717-1 series of 0.5 watt Zener voltage regulators provides a selection
from 1.8 to 43 volts in standard 5% tolerances as well as tighter tolerances. These axial-
leaded glass DO-35 Zeners are available with an internal metallurgical bond similar to military
requirements for similar Zeners. Microsemi also offers numerous other Zener products to
meet higher and lower power applications.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
JEDEC registered 1N4678 thru 1N4717 series.
Internal metallurgical bond.
Tighter voltage tolerances of 2% and 1% are available.
Up-screening available in reference to MIL-PRF-19500.
(See
part nomenclature
for all available options).
RoHS compliant devices available (commercial grade only).
DO-35 (DO-204AH)
Package
Also available in:
DO-213AA
(surface mount)
1N4678UR-1 – 1N4717UR-1
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Guaranteed maximum voltage regulation 10 μA to 100 μA.
Voltage selection from 1.8 to 43 V.
Flexible axial-lead mounting terminals.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Minimal capacitance (see
Figure 3).
Inherently radiation hard as described in Microsemi’s “MicroNote
050”.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
(1)
Thermal Resistance Junction-to-Lead
(2)
Thermal Resistance Junction-to-Ambient
(3)
Steady-State Power Dissipation
Forward Voltage @ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +175
250
310
0.5
1.1
260
Unit
C
C/W
o
C/W
W
V
o
C
o
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. At 3/8 (10 mm) lead length from body.
2. When mounted on FR4 PC board (1 oz Cu) with 4 mm
2
copper pads and track width 1 mm, length 25 mm.
3. At T
L
< 50
o
C 3/8 inch (10 mm) from body or 0.48 W at T
A
< 25
º
C when mounted on FR4 PC board as
described for thermal resistance (see
Figure 2
for derating).
T4-LDS-0240, Rev. 1 (112022)
©2011 Microsemi Corporation
Page 1 of 5

 
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