buffers & line drivers hex invert W/common enable 3-S
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOP |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| 制造商包装代码 | SOT109-1 |
| Reach Compliance Code | compliant |
| 其他特性 | WITH DUAL OUTPUT ENABLE |
| 控制类型 | ENABLE LOW |
| 系列 | HCT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 9.9 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.006 A |
| 湿度敏感等级 | 1 |
| 位数 | 6 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 36 ns |
| 传播延迟（tpd） | 36 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| 74HCT366D,653 | 74HC366D,652 | 74HC366D,653 | 74HCT366D,652 | 74HC366PW,118 | 74HCT366PW,112 | 74HCT366DB,112 | |
|---|---|---|---|---|---|---|---|
| 描述 | buffers & line drivers hex invert W/common enable 3-S | buffers & line drivers hex inv buff/drvr | buffers & line drivers hex invert W/common enable 3-S | buffers & line drivers hex buff/drvr 3st | buffers & line drivers 5V hex buff/line | buffers & line drivers 5V hex buf/LD inv | buffers & line drivers hex invert W/common |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SOP | SOP | SOP | SOP | TSSOP | TSSOP | SSOP1 |
| 包装说明 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | SSOP, SSOP16,.3 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | SOT109-1 | SOT109-1 | SOT109-1 | SOT109-1 | SOT403-1 | SOT403-1 | SOT338-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 系列 | HCT | HC/UH | HC/UH | HCT | HC/UH | HCT | HCT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm | 5 mm | 5 mm | 6.2 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | TSSOP | TSSOP | SSOP |
| 封装等效代码 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | SSOP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 2/6 V | 2/6 V | 5 V | 2/6 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 36 ns | 30 ns | 30 ns | 36 ns | 30 ns | 36 ns | 36 ns |
| 传播延迟（tpd） | 36 ns | 150 ns | 150 ns | 36 ns | 150 ns | 36 ns | 36 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.1 mm | 1.1 mm | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | 6 V | 5.5 V | 6 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | 2 V | 4.5 V | 2 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 4.4 mm | 4.4 mm | 5.3 mm |
| 包装方法 | TAPE AND REEL | BULK PACK | TAPE AND REEL | - | TAPE AND REEL | TUBE | TUBE |
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