ACT SERIES, 9-BIT PARITY GENERATOR/CHECKER, COMPLEMENTARY OUTPUT, CDFP14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL14,.3 |
| 针数 | 14 |
| Reach Compliance Code | not_compliant |
| 系列 | ACT |
| JESD-30 代码 | R-CDFP-F14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | PARITY GENERATOR/CHECKER |
| 位数 | 9 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 传播延迟（tpd） | 24 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 座面最大高度 | 2.92 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 300k Rad(Si) V |
| 宽度 | 6.285 mm |
| Base Number Matches | 1 |
| 5962F9672001VXC | 5962F9672001VCC | ACTS280K | ACTS280HMSR | |
|---|---|---|---|---|
| 描述 | ACT SERIES, 9-BIT PARITY GENERATOR/CHECKER, COMPLEMENTARY OUTPUT, CDFP14 | ACT SERIES, 9-BIT PARITY GENERATOR/CHECKER, COMPLEMENTARY OUTPUT, CDIP14 | ACT SERIES, 9-BIT PARITY GENERATOR/CHECKER, COMPLEMENTARY OUTPUT, CDFP14 | ACT SERIES, 9-BIT PARITY GENERATOR/CHECKER, COMPLEMENTARY OUTPUT, UUC13 |
| 包装说明 | DFP, FL14,.3 | DIP, DIP14,.3 | , | DIE, |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown |
| 系列 | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-CDFP-F14 | R-CDIP-T14 | R-CDFP-F14 | S-XUUC-N16 |
| 逻辑集成电路类型 | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER |
| 位数 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 16 |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | UNCASED CHIP |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | UPPER |
| 零件包装代码 | DFP | DIP | - | DIE |
| 针数 | 14 | 14 | - | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - |
| 封装代码 | DFP | DIP | - | DIE |
| 传播延迟（tpd） | 24 ns | 24 ns | - | 24 ns |
| 筛选级别 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | - | MIL-PRF-38535 Class V |
| 温度等级 | MILITARY | MILITARY | MILITARY | - |
| 总剂量 | 300k Rad(Si) V | 300k Rad(Si) V | - | 300k Rad(Si) V |
| Base Number Matches | 1 | 1 | 1 | - |
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