Any Pin to Any Pin ESD Rating ............................... ±2kV (HBM)
Operating Temperature Range ........................ -40NC to +125NC
Maximum Junction Temperature.....................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Package Thermal Characteristics (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (B
JA
) ......... 41NC/W
Junction-to-Case Thermal Resistance (B
JC
) ................ 9NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
PARAMETER
Operating Voltage Range
IN Supply Current
Undervoltage Lockout
UVLO Hysteresis
Overvoltage Protection on IN
OVP Hysteresis
Switching Frequency
Ramp P-P Voltage
FB Average Voltage
Transconductance
No-Load Gain
COMP Sink Current
COMP Source Current
Power Switch On-Resistance
Switch Leakage Current
DRAIN Rise Time
DRAIN Fall Time
SOURCE Limit Threshold
(V
IN
= 12V; V
EXT
= V
SOURCE
= V
FB
= V
GND
= 0V; COMP, REFI, and DRAIN = open; T
A
= T
J
= -40NC to +125NC, unless otherwise
noted. Typical values are at T
A
= +25NC.) (Note 2)
SYMBOL
V
IN
When MOSFET fully on
I
IN
UVLO
IN
V
OVP
When MOSFET switching, V
COMP
= 2V,
drain to 5V through 50I
IN rising
IN rising
5
43.6
270
T
A
= +25NC
-40°C
P
T
A
P
+125NC
g
m
A
I
SINK
I
SOURCE
R
DSON
I
LEAK
t
RDRAIN
t
FDRAIN
V
COMP
= 2V, V
FB
= 0.65V
V
COMP
= 2V, V
FB
= 0V
I
DS
= 1A
V
DRAIN
= 48V, V
COMP
= 0V
I
DS
= 1A
I
DS
= 1A
0.66
10
10
0.72
0.78
150
70
196
190
550
75
250
115
0.1
350
160
0.2
25
CONDITIONS
MIN
6.5
1
1.5
5.6
200
46
1.2
300
2
200
204
210
330
48
TYP
MAX
48
2
3
6.1
mA
V
mV
V
V
kHz
V
mV
FS
dB
FA
FA
I
FA
ns
ns
V
UNITS
V
V
SOURCETH
SOURCE connected to FB
www.maximintegrated.com
Maxim Integrated │
2
MAX16840
LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps
Electrical Characteristics (continued)
(V
IN
= 12V; V
EXT
= V
SOURCE
= V
FB
= V
GND
= 0V; COMP, REFI, and DRAIN = open; T
A
= T
J
= -40NC to +125NC, unless otherwise
noted. Typical values are at T
A
= +25NC.) (Note 2)
PARAMETER
SOURCE Current-Limit
Comparator Propagation Delay
FB Input Bias Current
FB Current-Limit Comparator
Leading-Edge Blanking
REFI Source Current
Foldback Kick in Threshold
FB Average Voltage During
Foldback
FB Average Voltage to REFI
Gain
EXT Drive Current
EXT Pulldown Resistance
Thermal-Shutdown Temperature
Thermal Shutdown Hysteresis
Temperature rising
V
REFI
= 1.224V
Falling on REFI
V
REFI
= 1.15V
V
REFI
= 1V
V
REFI
= 0.8V
V
REFI
= 1V
V
IN
= 2V, V
EXT
= 1V
12.5
5
47.5
1.135
178
153
120
I
FB
V
FB
= 0V and V
FB
= 0.3V
-1
50
50
1.2
189
164.5
132
6.075
40
10
165
15
20
mA
kI
NC
NC
52.5
1.255
201
176
143
mV
SYMBOL
CONDITIONS
MIN
TYP
25
+1
MAX
UNITS
ns
FA
ns
FA
V
Note 2:
All devices are 100% tested at T
A
= T
J
= +25NC. Limits over temperature are guaranteed by design.
www.maximintegrated.com
Maxim Integrated │
3
MAX16840
LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps
Typical Operating Characteristics
(T
A
= +25°C, unless otherwise noted.)
V
FB
vs. DUTY CYCLE FOR BUCK-BOOST
MAX16840 toc01
IQ vs. TEMPERATURE
1.4
1.2
1.0
IQ (mA)
IQ (mA)
0.8
0.6
0.4
0.5
1.0
MAX16840 toc02
IQ vs. V
IN
MAX16840 toc03
210
200
190
V
FB
(mV)
180
170
160
150
30
40
50
60
70
80
90
1.6
2.0
1.5
0.2
0
100
DUTY CYCLE (%)
10
35
60
85
110
0
5
10 15 20 25 30 35 40 45 50
V
IN
(V)
TEMPERATURE (°C)
OSCILLATOR FREQUENCY
vs. TEMPERATURE
MAX16840 toc04
ULVO
IN
vs. TEMPERATURE
5.7
V
IN
RISING AND FALLING
5.6
5.5
5.4
5.3
5.2
5.1
5.0
V
IN
RISING
V
IN
FALLING
MAX16840 toc05
300
250
200
f
SW
(kHz)
150
100
50
0
10
35
60
85
110
TEMPERATURE (°C)
5.8
10
35
60
85
110
TEMPERATURE (°C)
V
FB
vs. TEMPERATURE-
COMPATIBILITY MODE
MAX16840 toc06
V
FB
vs. V
REFI
MAX16840 toc07
200
195
190
185
V
FB
(mV)
175
170
165
160
155
150
10
35
60
85
110
TEMPERATURE (°C)
180
250
200
150
V
FB
(mV)
100
50
0
0.2
0.4
0.6
0.8
V
REFI
(V)
1.0
1.2
1.4
1.6
www.maximintegrated.com
Maxim Integrated │ 4
MAX16840
LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps
Pin Configuration
TOP VIEW
DRAIN
DRAIN
IN
EXT
COMP
1
2
3
4
5
+
10
9
SOURCE
SOURCE
FB
GND
REFI
MAX16840
8
7
EP
6
TDFN
Pin Description
PIN
1, 2
3
4
5
NAME
DRAIN
IN
EXT
COMP
Drain of the Internal Switching MOSFET
Input. Connect to LED string anode in boost and buck-boost configuration to get OVP protection
during open LED. Bypass it with a sufficient capacitor not to allow IN to go below 6.5V in buck
applications.
Base Drive for External Bipolar Until Internal Driver Starts Switching for the First Time After Power-Up
Compensation Component Connection for the Switching Stage. Connect a suitable RC network to
ground. This is the output of the g
m
amplifier
Analog Dimming and Thermal Foldback. The IC sources 50µA current out of this pin. Whenever this
pin voltage is > 1.2V, the FB voltage is regulated to internal 200mV reference. Whenever this pin
voltage < 1.2V, the FB voltage is regulated to V
REFI
/6. Leave this pin unconnected to disable this
foldback feature.
Ground
Current-Sense. This pin includes a 5kI/4pF RC filter at its input to average the current information
over the switching cycle. Connect this pin directly to SOURCE.
Source of the Internal Switching MOSFET
Exposed Pad. Connect EP to the ground plane for heatsinking. Do not use the EP as the only
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