Freescale Semiconductor
Data Sheet: Technical Data
An Energy-Efficient Solution from Freescale
Document Number: MCF51MM256
Rev. 5, 07/2012
MCF51MM256/128
The MCF51MM256 series devices are members of the
low-cost, low-power, high-performance ColdFire V1 family of
32-bit microcontrollers (MCUs) designed for handheld metering
devices.
Not all features are available in all devices or packages; see
Table 1
for a comparison of features by device.
32-Bit ColdFire V1 Central Processor Unit (CPU)
• Up to 50.33 MHz ColdFire CPU above 2.4 V and 40 MHz CPU
above 2.1V and 20 MHz CPU above 1.8 V across temperature
range of -40°C to 105°C.
• ColdFire Instruction Set Revision C (ISA_C).
• 32-bit multiply and accumulate (MAC) supports signed or
unsigned
integer or signed fractional inputs.
2.0. Allows control, bulk, interrupt and isochronous transfers.
•
SCIx
— Two serial communications interfaces with optional 13-bit
break; option to connect Rx input to PRACMP output on SCI1 and
SCI2; High current drive on Tx on SCI1 and SCI2; wake-up from
stop3 on Rx edge.
•
SPI1
— Serial peripheral interface with 32-bit FIFO buffer; 16-bit or
8-bit data transfers; full-duplex or single-wire bidirectional;
double-buffered transmit and receive; master or slave mode;
MSB-first or LSB-first shifting.
•
SPI2
— Serial peripheral interface with full-duplex or single-wire
bidirectional; Double-buffered transmit and receive; Master or Slave
mode; MSB-first or LSB-first shifting.
•
IIC
— Up to 100 kbps with maximum bus loading; Multi-master
operation; Programmable slave address; Interrupt driven
byte-by-byte data transfer; supports broadcast mode and 11-bit
addressing.
•
CMT
— Carrier Modulator timer for remote control communications.
Carrier generator, modulator and driver for dedicated infrared out
(IRO). Can be used as an output compare timer.
•
TPMx
— Two 4-channel Timer/PWM Module; Selectable input
capture, output compare, or buffered edge- or center-aligned PWM
on each channel; external clock input/pulse accumulator.
•
Mini-FlexBus
— Multi-function external bus interface with user
programmable chip selects and the option to multiplex address and
data lines.
•
PRACMP
— Analog comparator with selectable interrupt; compare
option to programmable internal reference voltage; operation in
stop3.
80-LQFP
12mm x 12mm
81-BGA
10mm x 10mm
100-LQFP
14mm x 14mm
104-BGA
10mm x 10mm
On-Chip Memory
• 256 K Flash comprised of two independent 128 K flash arrays;
read/program/erase over full operating voltage and temperature;
allows interrupt processing while programming.
• 32 KB System Random-access memory (RAM).
• Security circuitry to prevent unauthorized access to RAM and
Flash
contents.
Power-Saving Modes
• Two ultra-low power stop modes. Peripheral clock enable register
can disable clocks to unused modules to reduce currents.
• Time of Day (TOD) — Ultra low-power 1/4 sec counter with up to
64 sec timeout.
• Ultra-low power external oscillator that can be used in stop modes to
provide accurate clock source to the TOD. 6 µs typical wake up
time from stop3 mode.
Clock Source Options
• Oscillator (XOSC1) — Loop-control Pierce oscillator; 32.768 kHz
crystal
or ceramic resonator dedicated for TOD operation.
• Oscillator (XOSC2) for high frequency crystal input for MCG
reference to be used for system clock and USB operations.
• Multipurpose Clock Generator (MCG) — PLL and FLL; precision
trimming of internal reference allows 0.2% resolution and typical
+0.5%
to -1% deviation over temperature and voltage; supports CPU
frequencies from 4 kHz to 50 MHz.
Measurement Engine
•
ADC16
— 16-bit successive approximation ADC with up to 4
dedicated differential channels and 8 single-ended channels; range
compare function; 1.7 mV/×C temperature sensor; internal bandgap
reference channel; operation in stop3; fully functional from 3.6 V to
1.8 V, Configurable hardware trigger for 8 Channel select and result
registers.
•
PDB
— Programmable delay block with 16-bit counter and modulus
and prescale to set reference clock to bus divided by 1 to bus divided
by 2048; 8 trigger outputs for ADC module provides periodic
coordination of ADC sampling sequence with sequence completion
interrupt; Back-to-Back mode and Timed mode.
•
DAC
— 12-bit resolution DAC; configurable settling time.
•
OPAMPx
— 2 flexible operational amplifiers configurable for general
operations; Low offset and temperature drift.
•
TRIAMPx
— 2 trans-impedance amplifiers dedicated for converting
current inputs into voltages.
System Protection
• Watchdog computer operating properly (COP) reset with option to
run from dedicated 1 kHz internal clock source or bus clock.
• Low-voltage detection with reset or interrupt; selectable trip points;
separate low voltage warning with optional interrupt; selectable
trip
points.
• Illegal opcode and illegal address detection with reset.
• Flash block protection for each array to prevent accidental write /
erasure.
• Hardware CRC to support fast cyclic redundancy checks.
Development Support
• Integrated ColdFire DEBUG_Rev_B+ interface with single wire
BDM
connection supports same electrical interface used by the
S08
family debug modules.
• Real-time debug with 6 hardware breakpoints (4 PC, 1 address
and 1 data).
• On-chip trace buffer provides programmable start/stop
recording conditions.
Input/Output
•
•
•
•
•
Up to 68 GPIOs and 1 output-only pin.
Voltage Reference output (VREFO).
Dedicated infrared output pin (IRO)with high current sink capability.
Up to 16 KBI pins with selectable polarity.
Up to 16 pins of rapid general purpose I/O
(RGPIO).
Peripherals
•
USB
— Dual-role USB On-The-Go (OTG) device, supports USB in
either device, host or OTG configuration. On-chip transceiver and 3.3V
regulator help save system cost, fully compliant with USB Specification
© Freescale Semiconductor, Inc., 2009-2012. All rights reserved.
Table of Contents
1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Pinouts and Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.1 104-Pin MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.2 100-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
2.3 81-Pin MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
2.4 80-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.5 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
3.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . .17
3.2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .17
3.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .18
3.4 ESD Protection Characteristics. . . . . . . . . . . . . . . . . . .20
3.5 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
3.6 Supply Current Characteristics . . . . . . . . . . . . . . . . . . .23
3.7 PRACMP Electrical Parameters . . . . . . . . . . . . . . . . . .26
3.8 12-Bit DAC Electrical Parameters . . . . . . . . . . . . . . . . .26
3.9 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .28
3.10 MCG and External Oscillator (XOSC) Characteristics .35
3.11 Mini-FlexBus Timing Specifications . . . . . . . . . . . . . . .38
3.12 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.13 SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
3.14 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .45
3.15 USB Electricals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
3.16 VREF Electrical Specifications . . . . . . . . . . . . . . . . . . .47
3.17 TRIAMP Electrical Parameters . . . . . . . . . . . . . . . . . . .49
3.18 OPAMP Electrical Parameters . . . . . . . . . . . . . . . . . . .50
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
4.1 Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
4.2 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . .52
4.3 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . .52
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Figure 15.SPI Master Timing (CPHA = 0) . . . . . . . . . . . . . . . . .
Figure 16.SPI Master Timing (CPHA = 1) . . . . . . . . . . . . . . . . .
Figure 17.SPI Slave Timing (CPHA = 0) . . . . . . . . . . . . . . . . . .
Figure 18.SPI Slave Timing (CPHA = 1) . . . . . . . . . . . . . . . . . .
Figure 19.Typical VREF Output vs. Temperature . . . . . . . . . . . .
Figure 20.Typical VREF Output vs. V
DD
. . . . . . . . . . . . . . . . . . .
44
44
45
45
48
48
3
List of Tables
Table 1. MCF51MM256/128 Features by MCU and Package . . 3
Table 2. MCF51MM256/128 Functional Units . . . . . . . . . . . . . . . 6
Table 3. Package Pin Assignments . . . . . . . . . . . . . . . . . . . . . 12
Table 4. Parameter Classifications . . . . . . . . . . . . . . . . . . . . . . 17
Table 5. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . 18
Table 6. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . 19
Table 7. ESD and Latch-up Test Conditions . . . . . . . . . . . . . . . 20
Table 8. ESD and Latch-Up Protection Characteristics. . . . . . . 20
Table 9. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 10.Supply Current Characteristics . . . . . . . . . . . . . . . . . . 23
Table 11.Typical Stop Mode Adders. . . . . . . . . . . . . . . . . . . . . . 24
Table 12.PRACMP Electrical Specifications . . . . . . . . . . . . . . . 26
Table 13.DAC 12LV Operating Requirements . . . . . . . . . . . . . . 26
Table 14.DAC 12-Bit Operating Behaviors . . . . . . . . . . . . . . . . . 27
Table 15.16-bit ADC Operating Conditions . . . . . . . . . . . . . . . . 28
Table 16.16-bit SAR ADC Characteristics full operating range
(VREFH = VDDA > 1.8, VREFL = VSSA
8 Hz, -40
o
C to
85
o
C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 17.16-bit SAR ADC Characteristics full operating range
(VREFH = VDDA
2.7 V, VREFL = VSSA, f
ADACK
4 MHz,
ADHSC=1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 18.MCG (Temperature Range = –40
o
C to 105
o
C Ambient)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 19.XOSC Specifications (Temperature Range = –40
o
C to
105
o
C Ambient) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 20.Mini-FlexBus AC Timing Specifications . . . . . . . . . . . . 38
Table 21.Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 22.TPM Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 23.SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 24.Flash Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 25.Internal USB 3.3 V Voltage Regulator Characteristics 46
Table 26.VREF Electrical Specifications . . . . . . . . . . . . . . . . . . 47
Table 27.VREF Limited Range Operating Behaviors . . . . . . . . . 47
Table 28.TRIAMP Electrical Characteristics 1.8-3.6 V, -40°C~105°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Table 29.OPAMP Characteristics 1.8-3.6 V . . . . . . . . . . . . . . . . 50
Table 30.Orderable Part Number Summary. . . . . . . . . . . . . . . . 51
Table 31.Package Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 32.Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
4
5
List of Figures
Figure 1. MCF51MM256/128 Block Diagram . . . . . . . . . . . . . . . . 6
Figure 2. 104-Pin MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3. 100-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 4. 81-Pin MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. 80-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Stop IDD versus Temperature. . . . . . . . . . . . . . . . . . . 25
Figure 7. Offset at Half Scale vs Temperature . . . . . . . . . . . . . . 28
Figure 8. ADC Input Impedance Equivalency Diagram . . . . . . . 30
Figure 9. Mini-FlexBus Read Timing . . . . . . . . . . . . . . . . . . . . . 39
Figure 10.Mini-FlexBus Write Timing . . . . . . . . . . . . . . . . . . . . 39
Figure 11.Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 12.IRQ/KBIPx Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 13.Timer External Clock . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 14.Timer Input Capture Pulse . . . . . . . . . . . . . . . . . . . . 42
MCF51MM256/128, Rev. 5
2
Freescale Semiconductor
Features
1
Features
Table 1. MCF51MM256/128 Features by MCU and Package
MCF51MM256
262144
32K
104
yes
yes
yes
yes
yes
16
69
14
8
yes
yes
yes
yes
yes
yes
yes
4
4
yes
yes
yes
yes
16
yes
4
8
yes
yes
yes
yes
100
yes
yes
yes
yes
yes
16
65
14
8
yes
yes
yes
yes
yes
yes
yes
4
4
yes
yes
yes
yes
16
yes
4
8
yes
yes
yes
yes
81
yes
yes
yes
yes
yes
16
48
14
8
yes
yes
yes
yes
yes
yes
yes
4
4
yes
yes
yes
DATA
2
9
yes
4
8
yes
yes
yes
yes
80
yes
yes
yes
yes
yes
16
47
14
8
yes
yes
yes
yes
yes
yes
yes
4
4
yes
yes
yes
DATA
2
9
yes
4
8
yes
yes
yes
yes
81
yes
yes
yes
yes
yes
16
48
14
8
yes
yes
yes
yes
yes
yes
yes
4
4
yes
yes
yes
DATA
2
9
yes
4
8
yes
yes
yes
yes
Feature
MCF51MM128
131072
32K
80
yes
yes
yes
yes
yes
16
47
14
8
yes
yes
yes
yes
yes
yes
yes
4
4
yes
yes
yes
DATA
2
9
yes
4
8
yes
yes
yes
yes
The following table provides a cross-comparison of the features of the MCF51MM256/128 according to
package.
FLASH Size (bytes)
RAM Size (bytes)
Pin Quantity
Programmable Analog Comparator (PRACMP)
Debug Module (DBG)
Multipurpose Clock Generator (MCG)
Inter-Integrated Communication (IIC)
Interrupt Request Pin (IRQ)
Keyboard Interrupt (KBI)
Digital General Purpose I/O
1
Dedicated Analog Input Pins
Power and Ground Pins
Time Of Day (TOD)
Serial Communications (SCI1)
Serial Communications (SCI2)
Serial Peripheral Interface (SPI1(FIFO))
Serial Peripheral Interface(SPI2)
Carrier Modulator Timer Pin (IRO)
TPM Input Clock Pin (TPMCLK)
TPM1 Channels
TPM2 Channels
XOSC1
XOSC2
USB On-the-Go
Mini-FlexBus
Rapid GPIO
Programmable Delay Block (PDB)
16-Bit SAR ADC Differential Channels
3
16-Bit SAR ADC Single-Ended Channels
DAC Ouput Pin (DACO)
Voltage Reference Output Pin (VREFO)
General Purpose Operational Amplifier (OPAMP)
Trans-Impedance Amplifier (TRIAMP)
1
2
3
MEASUREMENT ENGINE
Port I/O count does not include BLMS, BKGD and IRQ. BLMS and BKGD are Output only, IRQ is input only.
The 80/81 pin packages contain the Mini-FlexBus data pins to support an 8-bit data bus interface to external peripherals.
Each differential channel is comprised of 2 pin inputs.
MCF51MM256/128, Rev. 5
Freescale Semiconductor
3
VDDA/VSSA
VREFH/VREFL
VREFO
DADP/M [3:0]
AD[11:4]
COCOx
HWTS[H:A]
DADP/M[3:0]
PDB
HWTS[H:A]
Dtrig
PTA7/INP1+
PTA6
PTA5
PTA4/INP0+
PTA3/KBI1P2/FB_D6/ADP5
PTA2/KBI1P1/RX1/ADP4
PTA1/KBI1P0/TX1/FB_D1
PTA0/FB_D2/SS1
PTB7/KBI1P4/RGPIOP1/FB_AD0
PTB6/KBI1P3/RGPIOP0/FB_AD17
PTB5/XTAL2
PTB4/EXTAL2
PTB3/XTAL1
PTB2/EXTAL1
PTB1/BLMS
PTB0
PTC7/KBI2P2/CLKOUT/ADP11
PTC6/KBI2P1/PRACMPO/ADP10
PTC5/KBI2P0/CMPP1/ADP9
PTC4/KBI1P7/CMPP0/ADP8
PTC3/KBI1P6/SS2/ADP7
PTC2/KBI1P5/SPSCK2/ADP6
PTC1/MISO2/FB_D0/FB_AD1
PTC0/MOSI2/FB_OE_b/FB_CS0
PTD7/USB_PULLUP(D+)/RX1
PTD6/USB_ALTCLK/TX1
PTD5/SCL/RGPIOP11/TPM1CH3
PTD4/SDA/RGPIOP10/TPM1CH2
PTD3/USB_PULLUP(D+)/RGPIOP9/
TPM1CH1
PTD2/USB_ALTCLK/RGPIOP8/
TPM1CH0
PTE7/USB_VBUSVLD/TPM2CH3
PTE6/FB_RW_b/USB_SESSEND/RX2
PTE5/FB_D7/USB_SESSVLD/TX2
PTE3/KBI2P6/FB_AD8
PTE2/KBI2P5/RGPIOP14/FB_AD7
PTE1/KBI2P4/RGPIOP13/FB_AD6
PTE0/KBI2P3/FB_ALE/FB_CS1
PTF7/MISO1
PTF6/MOSI1
PTF5/KBI2P7/FB_D3/FB_AD9
PTF4/SDA/FB_D4/FB_AD10
PTF3/SCL/FB_D5/FB_AD11
PTF2/TX2/USB_DM_DOWN/TPM2CH0
PTF1/RX2/USB_DP_DOWN/TPM2CH1
PTF0/USB_ID/TPM2CH2
PTG7/FB_AD18
PTG6/FB_AD19
PTG5/FB_RW_b
PTG4/USB_SESSVLD
PTG3/USB_DP_DOWN
PTG2/USB_DM_DOWN
PTG1/USB_SESSEND
PTG0/SPSCK1
PTH7/RGPIOP7/FB_D2
PTH6/RGPIOP6/FB_D3
PTH5/RGPIOP5/FB_D4
PTH4/RGPIOP4/FB_D5
PTH3/RGPIOP3/FB_D6
PTH2/RGPIOP2/FB_D7
PTH1/FB_D0
PTH0/FB_OE_b
PTJ7/FB_AD13
PTJ6/FB_AD14
PTJ5/FB_AD15
PTJ4/RGPIOP15/FB_AD16
PTJ3/RGPIOP12/FB_AD5
PTJ2/FB_AD4
PTJ1/FB_AD3
PTJ0/FB_AD2
ADC16
VDDA/VSSA
VREFH/VREFL
VREFO
Dtrig
ACMPO
DACO
VDDA/VSSA
VREFH/VREFL
OUT0
INP0–
DACO
PRACMP
OPAMP1
Port B
Port J
Port H
Port G
Port F
control
control
Port E
Port D
Port C
INP0-
INP0+
OUT0
INP1-
INP1+
OUT1
VINP0
VINN0
ACMPO
RX1
TX1
SCI1
OUT1
INP1–
TRIOUT0
VINN0/VINP0
OPAMP2
SCI2
RX2
TX2
TRIAMP1
TRIOUT0
VINP1
VINN1
TRIOUT1
VINN1/VINP1
IIC
KBI1 &
KBI2
SDA
SCL
TRIAMP2
VREF
TRIOUT1
KBI1P[7:0]
KBI2P[7:0]
VREFO
IRO
CMT
Hardware CRC
BDM
BKGD/MS
PTD0/BKGD/MS
IRO
TPM1 (4-Ch)
TPM1CH [3:0]
TPMCLK
DBG
INTC
RGPIO
RGPIO[15:8]
Port A:
RGPIO[7:0]
TPM2 (4-Ch)
TPM2CH [3:0]
TPMCLK
MCG
REF CLK
IRCLK
V1 ColdFire Core
with MAC
SPI1
MOSI1 SS1
MISO1 SPSCK1
Clock Check
& Select
PTD1/CMPP2/
RESET
SPI2
SIM
MINIFLEX
BUS
MOSI2
SS2
MISO2 SPSCK2
PTE4/CMPP3/
TPMCLK/IRQ
XOSC2
COP
LVD IRQ
FB_D[7:0]
FB_AD[19:0]
CLKO
FB_AD12
EXTAL1
XTAL1
FLASH1
128/64 KB
FLASH2
128/64 KB
Robust
Update
Manager
USBOTG
RAM
32KB
VREG
USB_DM
USB_DP
USB_ALTCLK
USB_PULLUP(D+)
USB_DM_DOWN
USB_DP_DOWN
USB_VBUSVLD
USB_ID
USB_SESSVLD
USB_SESSEND
XOSC1
CLKO
TOD
VDD1,2,3
VSS1,2,3
USB_DM
USB_DP
VUSB33
VBUS
Green
—
pins not available on the 100, 81 or 80-pin package
Blue
— pins not available on the 81 or 80-pin package
Red
—
pin not available on the 80-pin package
Figure 1. MCF51MM256 Series Block Diagram
MCF51MM256/128, Rev. 5
4
Freescale Semiconductor
Port A
Features
The following table describes the functional units of the MCF51MM256/128.
Table 2. MCF51MM256/128 Functional Units
Unit
Function
DAC (digital to analog converter) — Used to output voltage levels.
16-BIT SAR ADC (analog-to-digital converter) — Measures analog
voltages at up to 16 bits of resolution. The ADC has up to four differential
and 8 single-ended inputs.
Measurement Engine
OPAMP — General purpose op amp used for signal filtering or
amplification.
TRIAMP —- Transimpedance amplifier optimized for converting small
currents into voltages.
Measurement Engine PDB — The measurement engine PDB is used to
precisely trigger the DAC and the ADC modules to complete sensor
biasing and measuring.
Mini-FlexBus
USB On-the-Go
CMT (Carrier Modulator Timer)
MCG (Multipurpose Clock Generator)
Provides expansion capability for off-chip memory and peripherals.
Supports the USB On-the-Go dual-role controller.
Infrared output used for the Remote Controller operation.
Provides clocking options for the device, including a phase-locked loop
(PLL) and frequency-locked loop (FLL) for multiplying slower reference
clock sources.
Provides single pin debugging interface (part of the V1 ColdFire core).
Executes programs and interrupt handlers.
Analog comparators for comparing external analog signals against
each other, or a variety of reference levels.
Software Watchdog.
Single-pin high-priority interrupt (part of the V1 ColdFire core).
High-speed CRC calculation.
Provides debugging and emulation capabilities (part of the V1 Co ldFire.
core)
Provides storage for program code, constants, and variables.
Supports standard IIC communications protocol and SMBus.
Controls and prioritizes all device interrupts.
Keyboard Interfaces 1 and 2.
Provides an interrupt to theColdFire V1 CORE in the event that the
supply voltage drops below a critical value. The LVD can also be
programmed to reset the device upon a low voltage event.
The Voltage Reference output is available for both on- and off-chip use.
Provides stack and variable storage.
Allows for I/O port access at CPU clock speeds. RGPIO is used to
implement GPIO functionality.
BDM (Background Debug Module)
CF1 CORE (V1 ColdFire Core)
PRACMP
COP (Computer Operating Properly)
IRQ (Interrupt Request)
CRC (Cyclic Redundancy Check)
DBG (Debug)
FLASH (Flash Memory)
IIC (Inter-integrated Circuits)
INTC (Interrupt Controller)
KBI1 & KBI2
LVD (Low-voltage Detect)
VREF (Voltage Reference)
RAM (Random-Access Memory)
RGPIO (Rapid General-purpose
Input/output)
MCF51MM256/128, Rev. 5
Freescale Semiconductor
5
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