电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

KIS146-49TT

产品描述IC Socket, PGA146, 146 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
产品类别连接器    插座   
文件大小175KB,共2页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

KIS146-49TT概述

IC Socket, PGA146, 146 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

KIS146-49TT规格参数

参数名称属性值
Is SamacsysN
YTEOL5.7
Objectid2102953598
Reach Compliance CodeCompliant
Country Of OriginUSA
ECCN代码EAR99
其他特性1.0 OZ. AVG. INSERTION FORCE
设备插槽类型IC SOCKET
使用的设备类型PGA146
主体宽度1.5 inch
主体深度0.095 inch
主体长度1.5 inch
联系完成配合TIN LEAD OVER NICKEL
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
外壳材料POLYAMIDE
安装方式STRAIGHT
PCB接触模式RECTANGULAR
PCB触点行间距0.1 mm
端接类型SOLDER
触点的结构15X15
插接触点节距0.1 inch
触点样式RND PIN-SKT
端子节距2.54 mm
触点材料BE-CU
触点数146
JESD-609代码e0
最高工作温度400 °C
最低工作温度-269 °C
是否Rohs认证No

文档预览

下载PDF文档
Low Insertion Force
Peel-A-Way
®
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Peel-A-Way
®
Low Insertion Force PGA Sockets
Polyimide Film
.005
(.13)
Features:
• Disposable carriers peel away after
soldering.
• Peel-A-Way
®
tabs and full grid wafer
supplied on all Peel-A-Way
®
PGA sockets.
• Maximum air flow under PGA for greater
cooling.
• Better flux rinse and cleaning.
• Allows inspection of solder joints on both
sides of PCB.
• Lowest profile with use of type -210
terminal.
• Peel-A-Way
®
disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
1
Footprint Dash #
If Applicable*
How To Order
KS
068
-85
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Body Type
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Polyimide Film
Polyimide Film
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Solder Preform:
63% Tin, 37% Lead
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Sealant Options
RTV
Seal
Body Material:
KS/KIS -
Polyimide Film
-269˚C to 400˚C (-452˚F to 752˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Peel-A-Way
®
covered by patent rights issued and/or pending.
Tape Sealed
To order: Add 3M to end of part #
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 34

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2342  2444  1498  774  242  48  50  31  16  5 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved