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3-FS032-49TG

产品描述IC Socket, PGA32, 32 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
产品类别连接器    插座   
文件大小146KB,共2页
制造商Advanced Interconnections Corp
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3-FS032-49TG概述

IC Socket, PGA32, 32 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

3-FS032-49TG规格参数

参数名称属性值
最高工作温度140 °C
是否Rohs认证No
Reach Compliance CodeCompliant
ECCN代码EAR99
Is SamacsysN
YTEOL0
Objectid1148486762
其他特性2.5 OZ. AVG. INSERTION FORCE
设备插槽类型IC SOCKET
使用的设备类型PGA32
主体宽度0.7 inch
主体深度0.095 inch
主体长度0.7 inch
插接触点节距0.1 inch
安装方式STRAIGHT
PCB接触模式RECTANGULAR
PCB触点行间距0.1 mm
触点的结构7X7
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点样式RND PIN-SKT
外壳材料GLASS FILLED EPOXY
联系完成配合AU ON NI
端接类型SOLDER
触点数32
端子节距2.54 mm
触点材料BE-CU
JESD-609代码e0

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Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Molded & FR-4 Low Insertion Force PGA Sockets
.100
(2.54)
.062
(1.57)
Molded
PC Board
FR-4
PC Board
Features:
• As low as 1 oz.(28.34 g) average insertion
force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% anti-
wicking of solder.
• Tapered entry for ease of insertion.
• To fit .100” (2.54 mm) grid.
• Easily customized to fit your application.
How To Order
1 oz. (28.34 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CIS - Standard Molded
HCIS - High Temp. Molded
FIS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
CIS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
How To Order
2.5 oz. (70.85 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CS - Standard Molded
HCS - High Temp. Molded
FS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Solder Preform:
63% Tin, 37% Lead
CS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Terminal Type
See next page
for terminal types
Sealant Options
RTV
Seal
Body Material:
CS/CIS -
Glass Filled Thermoplastic
Polyester (P.B.T.), U.L. Rated 94V-O,
-60˚C to 140˚C (-76˚F to 284˚F)
HCS/HCIS -
High Temp. Glass Filled
Thermoplastic (P.P.S.) , U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
FS/FIS -
FR-4 Fiberglass Epoxy Board,
U.L. Rated 94V-O, Index 140˚C (284˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Tape Sealed
To order: Add 3M to end of part #
Page 32
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)

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