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AS8ERLC128K32SQB-250/883C

产品描述EEPROM, 128KX32, 250ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68
产品类别存储    存储   
文件大小550KB,共18页
制造商Micross
官网地址https://www.micross.com
下载文档 详细参数 选型对比 全文预览

AS8ERLC128K32SQB-250/883C概述

EEPROM, 128KX32, 250ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68

AS8ERLC128K32SQB-250/883C规格参数

参数名称属性值
零件包装代码QFP
包装说明GQFF,
针数68
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
最长访问时间250 ns
JESD-30 代码S-CQFP-F68
JESD-609代码e4
长度22.352 mm
内存密度4194304 bit
内存集成电路类型EEPROM
内存宽度32
功能数量1
端子数量68
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织128KX32
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码GQFF
封装形状SQUARE
封装形式FLATPACK, GUARD RING
并行/串行PARALLEL
编程电压3 V
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度5.969 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层PALLADIUM GOLD
端子形式FLAT
端子节距1.27 mm
端子位置QUAD
宽度22.352 mm
Base Number Matches1

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PRELIMINARY
SPECIFICATION
Austin Semiconductor, Inc.
128K x 32 Radiation Tolerant EEPROM
AVAILABLE AS MILITARY SPECIFICATIONS
MIL-STD-883, para 1.2.1 compliant
• SPACE Level Process Flow
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
EEPROM
AS8ERLC128K32
(Top View)
68 Lead CQFP
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
10
60
11
59
12
58
13
57
14
56
15
55
16
54
17
53
18
52
19
51
20
50
21
49
22
48
23
47
24
46
25
45
26
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
Vcc
A11
A12
A13
*A15
*A14
A16
CS1\
OE\
CS2\
NC
WE2\
WE3\
WE4\
NC
NC
RDY
RES\
A0
A1
A2
A3
A4
A5
CS3\
GND
CS4\
WE1\
A6
A7
A8
A9
A10
Vcc
PIN ASSIGNMENT
FEATURES
Access time of 250ns , 300ns
• Operation with single
3.3V (+ .3V)
supply
• LOW Power Dissipation:
Active(Worst case):
300mW
(MAX), Max Speed Operation
Standby(Worst case):
7.2mW(MAX),
Battery Back-up Mode
• Automatic Byte Write: 15 ms (MAX)
• Automatic Page Write (128 bytes): 15 ms (MAX)
• Data protection circuit on power -on/off
• Low power CMOS MONOS cell Technology
• 10
4
Erase/Write cycles (in Page Mode)
• Software data protection
• TTL Compatible Inputs and Outputs
• Data Retention: 10 years
• Ready/Busy\ and Data Polling Signals
• Write protection by RES\ pin
• Radiation Tolerant: Proven total dose 40K to 100K RADS*
• Shielded Package for Best Radiation Immunity
• Operating Temperature Ranges:
Military: -55
o
C to +125
o
C
Industrial: -40
o
C to +85
o
C
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
*Pin #'s 31 and 32, A15 and A14 respectively, are reversed from the AS8E128K32. Correct
use of these address lines is required for operation of the SDP mode to work properly.
PIN NAME
A0 to A16
I/O0 to I/O31
OE\
CE\
WE\
V
CC
FUNCTION
Address Input
Data Input/Output
Output Enable
Chip Enable
Write Enable
Power Supply
OPTIONS
• Timing
150 ns
200 ns
250 ns
• Package
Ceramic Quad Flat pack w/ formed leads
Ceramic Quad Flat pack w/ tie bar
Shielded Ceramic Quad Flat pack
Shielded Ceramic Quad Flat pack
MARKINGS
-150
-200
-250
Q
QB
SQ
SQB
No. 703Q
No. 703QB
No. 703SF
No. 703SQB
Ground
V
SS
RDY/BUSY\ Ready Busy
RES\
Reset
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8ERLC128K32 is a 4 Mega-
bit Radiation Tolerant EEPROM Module organized as 128K x 32 bit.
User configurable to 256K x16 or 512Kx 8. The module achieves high
speed access, low power consumption and high reliability by
employing advanced CMOS memory technology.
The military grade product is manufactured in compliance to
MIL-STD 883, making the AS8ERLC128K32 ideally suited for mili-
tary or space applications.
The module is offered as a 68 lead 0.880 inch square ceramic
quad flat pack. It has a max. height of 0.200 inch (non-shielded). This
package design is targeted for those applications which require low
profile SMT Packaging.
* contact factory for test reports. ASI does not guarantee or warrant
these performance levels, but references these third party reports.
AS8ERLC128K32
Rev. 1.5 06/05
FUNCTIONAL BLOCK DIAGRAM
For more products and information
please visit our web site at
www.austinsemiconductor.com
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1

AS8ERLC128K32SQB-250/883C相似产品对比

AS8ERLC128K32SQB-250/883C AS8ERLC128K32QB-250/883C AS8ERLC128K32SQB-300/883C AS8ERLC128K32Q-250/883C AS8ERLC128K32Q-300/883C AS8ERLC128K32SQ-250/883C AS8ERLC128K32QB-300/883C AS8ERLC128K32SQ-300/883C
描述 EEPROM, 128KX32, 250ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68 EEPROM, 128KX32, 250ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68 EEPROM, 128KX32, 300ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68 EEPROM, 128KX32, 250ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68 EEPROM, 128KX32, 300ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68 EEPROM, 128KX32, 250ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68 EEPROM, 128KX32, 300ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68 EEPROM, 128KX32, 300ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 GQFF, GQFF, GQFF, QFP, QFP, CERAMIC, QFP-68 GQFF, CERAMIC, QFP-68
针数 68 68 68 68 68 68 68 68
Reach Compliance Code compliant unknown unknown compliant unknown compliant unknown compliant
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
最长访问时间 250 ns 250 ns 300 ns 250 ns 300 ns 250 ns 300 ns 300 ns
JESD-30 代码 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CQFP-F68 S-CQFP-G68
JESD-609代码 e4 e0 e4 e0 e0 e4 e0 e4
长度 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm
内存密度 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 32 32 32 32 32 32 32 32
功能数量 1 1 1 1 1 1 1 1
端子数量 68 68 68 68 68 68 68 68
字数 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
字数代码 128000 128000 128000 128000 128000 128000 128000 128000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 GQFF GQFF GQFF QFP QFP QFP GQFF QFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, GUARD RING FLATPACK, GUARD RING FLATPACK, GUARD RING FLATPACK FLATPACK FLATPACK FLATPACK, GUARD RING FLATPACK
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
座面最大高度 5.969 mm 4.826 mm 5.969 mm 5.08 mm 5.08 mm 5.969 mm 4.826 mm 5.969 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 PALLADIUM GOLD TIN LEAD PALLADIUM GOLD TIN LEAD TIN LEAD PALLADIUM GOLD TIN LEAD PALLADIUM GOLD
端子形式 FLAT FLAT FLAT GULL WING GULL WING GULL WING FLAT GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
宽度 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm
厂商名称 - Micross - - Micross Micross Micross Micross
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