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BU-65171V2-310

产品描述Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, 1.900 INCH, CERAMIC, DFP-70
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共47页
制造商Data Device Corporation
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BU-65171V2-310概述

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, 1.900 INCH, CERAMIC, DFP-70

BU-65171V2-310规格参数

参数名称属性值
最高工作温度70 °C
最低工作温度
筛选级别MIL-PRF-38534
Country Of OriginTaiwan, USA
Is SamacsysN
YTEOL7
Objectid1989595241
包装说明DFP, FL70,1.0
Reach Compliance CodeCompliant
通信协议MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
数据编码/解码方法NRZ; BIPH-LEVEL(MANCHESTER)
最大供电电压5.5 V
技术CMOS
温度等级COMMERCIAL
边界扫描NO
低功率模式YES
串行 I/O 数2
最小供电电压4.5 V
其他特性LG-MAX; WD-MAX
最大时钟频率16 MHz
最大数据传输速率0.125 MBps
外部数据总线宽度16
标称供电电压5 V
表面贴装YES
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
地址总线宽度16
JESD-30 代码R-CDFP-F70
JESD-609代码e4
认证状态Not Qualified
长度48.26 mm
座面最大高度3.81 mm
宽度25.4 mm
封装形状RECTANGULAR
端子面层GOLD OVER NICKEL
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
端子数量70
封装等效代码FL70,1.0
封装形式FLATPACK
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP

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BU-65170/61580 AND BU-61585
MIL-STD-1553A/B NOTICE 2 RT
AND BC/RT/MT, ADVANCED
COMMUNICATION ENGINE (ACE)
Make sure the next
Card you purchase
has...
®
FEATURES
Fully Integrated MIL-STD-1553
Interface Terminal
Flexible Processor/Memory Interface
Standard 4K x 16 RAM and Optional
12K x 16 or 8K x 17 RAM Available
Optional RAM Parity Generation/
Checking
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Flexible RT Data Buffering
Programmable
Illegalization
Selective Message Monitor
Simultaneous RT/Monitor Mode
DESCRIPTION
DDC's BU-65170, BU-61580 and BU-61585 Bus Controller / Remote
Terminal / Monitor Terminal (BC/RT/MT) Advanced Communication
Engine (ACE) terminals comprise a complete integrated interface
between a host processor and a MIL-STD-1553 A and B or STANAG
3838 bus.
The ACE series is packaged in a 1.9 -square-inch, 70-pin, low-profile,
cofired MultiChip Module (MCM) ceramic package that is well suited
for applications with stringent height requirements.
The BU-61585 ACE integrates dual transceiver, protocol, memory
management, processor interface logic, and a total of 12K words of
RAM in a choice of DIP or flat pack packages. The BU-61585 requires
+5 V power and either -15 V or -12 V power.
The BU-61585 internal RAM can be configured as 12K x 16 or 8K x
17. The 8K x 17 RAM feature provides capability for memory integrity
checking by implementing RAM parity generation and verification on
all accesses. To minimize board space and “glue” logic, the ACE pro-
vides ultimate flexibility in interfacing to a host processor and internal/
external RAM.
The advanced functional architecture of the ACE terminals provides
software compatibility to DDC's Advanced Integrated Multiplexer
(AIM) series hybrids, while incorporating a multiplicity of architectural
enhancements. It allows flexible operation while off-loading the host
processor, ensuring data sample consistency, and supports bulk data
transfers.The ACE hybrids may be operated at either 12 or 16 MHz.
Wire bond options allow for programmable RT address (hardwired is
standard) and external transmitter inhibit inputs.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7771
All trademarks are the property of their respective owners.
©
1992, 1999 Data Device Corporation
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