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BU-64743G3-570

产品描述Serial IO/Communication Controller, CMOS, CQFP80
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共95页
制造商Data Device Corporation
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BU-64743G3-570概述

Serial IO/Communication Controller, CMOS, CQFP80

BU-64743G3-570规格参数

参数名称属性值
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QFP
封装形状SQUARE
封装形式FLATPACK
端子数量80
封装等效代码QFP80,1.1SQ,40
端子形式GULL WING
端子节距1 mm
端子位置QUAD
最高工作温度85 °C
最低工作温度-40 °C
筛选级别MIL-STD-883 Class B (Modified)
YTEOL7.25
零件包装代码QFP
针数80
Reach Compliance CodeCompliant
Country Of OriginTaiwan, USA
Objectid1154986304
包装说明QFP, QFP80,1.1SQ,40
Is SamacsysN
地址总线宽度16
最大时钟频率20 MHz
最大数据传输速率1 MBps
外部数据总线宽度16
标称供电电压3.3 V
表面贴装YES
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
最大供电电压3.6 V
最小供电电压3 V
技术CMOS
温度等级INDUSTRIAL
边界扫描NO
通信协议ASYNC, BIT
数据编码/解码方法BIPH-LEVEL (MANCHESTER)
串行 I/O 数2
JESD-30 代码S-CQFP-G80
认证状态Not Qualified
长度22.35 mm
座面最大高度3.302 mm
宽度22.35 mm

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has...
®
BU-6474X/6484X/6486X
MINI-ACE
®
MARK3/MICRO-ACE
®
*-TE
FEATURES
Fully Integrated 3.3 or 5.0 Volt, 1553
A/B Notice 2 Terminal
World’s First all 3.3 Volt Terminal
Transceiver Power-Down Options
World’s Smallest CQFP MIL-STD-1553
Device
80-pin Ceramic Flat/Gull Wing
Package or 324-Ball BGA Package
Enhanced Mini-ACE Architecture
Multiple Configurations:
- RT-only, 4K RAM
- BC/RT/Monitor, 4K RAM
DESCRIPTION
The Mini-ACE Mark3 and Micro-ACE-TE are the world's first MIL-STD-1553
terminals which can be powered entirely by +3.3 volts, thus eliminating the
need for a +5 volt power supply. With a package body of 0.880 inches square
and a gull wing "toe-to-toe" dimension of 1.110 inches, the Mini-ACE Mark3
is the industry's smallest ceramic gull-lead 1553 terminal. At 0.815 inches
square, the Micro-ACE-TE (BGA package) provides the smallest industry
footprint, enabling its use in applications where PC board space is at a pre-
mium.
These devices integrate dual 3.3 or 5 volt transceivers, 3.3 or 5.0 volt protocol
logic, and either 4K or 64K words of internal RAM. The architecture is identi-
cal to that of the Enhanced Mini-ACE, and most features are functionally and
software compatible with the previous Mini-ACE (Plus) and ACE genera-
tions.
A salient feature of the Mini-ACE Mark3 and Micro-ACE-TE is the advanced
bus controller architecture. This provides methods to control message sched-
uling, the means to minimize host overhead for asynchronous message
insertion, facilitate bulk data transfers and double buffering, and support
various message retry and bus switching strategies.
The remote terminal architecture provides flexibility in meeting all common
MIL-STD-1553 protocols. The choice of RT data buffering and interrupt
options provides robust support for synchronous and asynchronous messag-
ing, while ensuring data sample consistency and supporting bulk data trans-
fers. The monitor mode provides true message monitoring, and supports fil-
tering on an RT address/T-R bit/subaddress basis.
The Mini-ACE Mark3 and Micro-ACE-TE incorporate fully autonomous built-
in self-tests of internal protocol logic and RAM. The terminals provide
the
same flexibility in host interface configurations as the ACE/Mini-ACE, along
with a reduction in the host processor's worst case holdoff time.
- BC/RT/Monitor, 64K RAM
Supports 1553A/B Notice 2, McAir,
STANAG 3838 Protocols
MIL-STD-1553, McAir, and MIL-
STD-1760 Transceiver Options
Highly Flexible Host Side Interface
Compatible With Mini-ACE and ACE
Generations
Highly Autonomous BC with Built-In
Message Sequence Controller
Choice of Single, Double, and
Circular RT Buffering Options
Selective Message Monitor
Comprehensive Built-In Self-Test
Choice Of 10, 12, 16, or 20 MHz Clock
Inputs
Software Libraries and Drivers
available for Windows® 9x/2000/XP,
Windows NT®, VxWorks® and Linux
Available with Full Military
Temperature Range and Screening
FOR MORE INFORMATION CONTACT:
Technical Support:
1-800-DDC-5757 ext. 7771
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
subject to one or more patents pending.
All trademarks are the property of their respective owners.
© 2002 Data Device Corporation
*
The technology used in DDC’s Micro-ACE series of products may be
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