digital to analog converters - dac 12-bit 2ch precision dac
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | LCC |
| 包装说明 | PLASTIC, LCC-18 |
| 针数 | 18 |
| Reach Compliance Code | compliant |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | S-PQCC-J18 |
| JESD-609代码 | e3 |
| 最大线性误差 (EL) | 0.024% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC20,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 15 V |
| 认证状态 | Not Qualified |
| 标称安定时间 (tstl) | 0.6 µs |
| 最大压摆率 | 2 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| MX7541AJP+T | MX7541AKN+ | MX7541AJP+ | MX7541AJCWN+ | MX7541AKCWN+ | MX7541AJEWN+T | MX7541AJCWN+T | |
|---|---|---|---|---|---|---|---|
| 描述 | digital to analog converters - dac 12-bit 2ch precision dac | digital to analog converters - dac 12-bit 2ch precision dac | digital to analog converters - dac 12-bit 2ch precision dac | digital to analog converters - dac 12-bit 2ch precision dac | digital to analog converters - dac 12-bit 2ch precision dac | digital to analog converters - dac 12-bit 2ch precision dac | digital to analog converters - dac 12-bit 2ch precision dac |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | LCC | DIP | LCC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | PLASTIC, LCC-18 | DIP, DIP18,.3 | QCCJ, LDCC20,.4SQ | SOP, SOP18,.4 | SOP, SOP18,.4 | SOP, SOP18,.4 | SOP, SOP18,.4 |
| 针数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | compliant | compli | compli | compli | compli | compliant | compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | S-PQCC-J18 | R-PDIP-T18 | X-PQCC-J18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 最大线性误差 (EL) | 0.024% | 0.0122% | 0.0244% | 0.0244% | 0.0122% | 0.024% | 0.024% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | QCCJ | SOP | SOP | SOP | SOP |
| 封装等效代码 | LDCC20,.4SQ | DIP18,.3 | LDCC20,.4SQ | SOP18,.4 | SOP18,.4 | SOP18,.4 | SOP18,.4 |
| 封装形状 | SQUARE | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称安定时间 (tstl) | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs |
| 最大压摆率 | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN | MATTE TIN |
| 端子形式 | J BEND | THROUGH-HOLE | J BEND | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Factory Lead Time | - | 12 weeks | - | 13 weeks | 13 weeks | 12 weeks | 12 weeks |
| 长度 | - | 22.86 mm | 9.905 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm |
| 座面最大高度 | - | 4.572 mm | 4.57 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm |
| 宽度 | - | 7.62 mm | 9.9 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
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