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74AUP1T98GW,125: 产品描述logic gates 3V 1G lpow conf; 产品类别逻辑逻辑; 文件大小207KB，共20页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74AUP1T98GW,125概述

logic gates 3V 1G lpow conf

74AUP1T98GW,125规格参数

参数名称	属性值
Brand Name	NXP Semiconductor
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	TSSOP
包装说明	PLASTIC, SOT-363, SC-88, PACKAGE-6
针数	6
制造商包装代码	SOT363
Reach Compliance Code	compliant
系列	AUP/ULP/V
JESD-30 代码	R-PDSO-G6
JESD-609代码	e3
长度	2 mm
负载电容（CL）	30 pF
逻辑集成电路类型	LOGIC CIRCUIT
最大I（ol）	0.004 A
湿度敏感等级	1
功能数量	1
端子数量	6
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP6,.08
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法	TAPE AND REEL
峰值回流温度（摄氏度）	260
电源	2.5/3.3 V
Prop。Delay @ Nom-Sup	11.9 ns
认证状态	Not Qualified
施密特触发器	YES
座面最大高度	1.1 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.3 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	Tin (Sn)
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	1.25 mm

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74AUP1T98

Low-power configurable gate with voltage-level translator

Rev. 4 — 15 august 2012

Product data sheet

1. General description

The 74AUP1T98 provides low-power, low-voltage configurable logic gate functions. The

output state is determined by eight patterns of 3-bit input. The user can choose the logic

functions MUX, AND, OR, NAND, NOR, inverter and buffer. All inputs can be connected to

or GND.

This device ensures a very low static and dynamic power consumption across the entire

range from 2.3 V to 3.6 V.

The 74AUP1T98 is designed for logic-level translation applications with input switching

levels that accept 1.8 V low-voltage CMOS signals, while operating from either a single

2.5 V or 3.3 V supply voltage.

The wide supply voltage range ensures normal operation as battery voltage drops from

3.6 V to 2.3 V.

This device is fully specified for partial power-down applications using I

OFF

The I

OFF

circuitry disables the output, preventing the damaging backflow current through

the device when it is powered down.

Schmitt trigger inputs make the circuit tolerant to slower input rise and fall times across

the entire V

range.

2. Features and benefits



Wide supply voltage range from 2.3 V to 3.6 V



High noise immunity



ESD protection:



HBM JESD22-A114F Class 3A exceeds 5000 V



MM JESD22-A115-A exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Low static power consumption; I

= 1.5

A

(maximum)



Latch-up performance exceeds 100 mA per JESD 78 Class II



Inputs accept voltages up to 3.6 V



Low noise overshoot and undershoot < 10 % of V



OFF

circuitry provides partial power-down mode operation



Multiple package options



Specified from

40 C

to +85

C

and

40 C

to +125

C

74AUP1T98GW,125相似产品对比

	74AUP1T98GW,125	74AUP1T98GN,132	74AUP1T98GF,132	74AUP1T98GM,132	74AUP1T98GM,115	74AUP1T98GS,132
描述	logic gates 3V 1G lpow conf	logic gates config 4.6 V 20 mA	logic gates 3V 1G lpow conf	logic gates 3V 1G lpow conf	logic gates 3V 1G lpow conf	logic gates config 4.6 V 20 mA
Brand Name	NXP Semiconductor	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
是否Rohs认证	符合	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
包装说明	PLASTIC, SOT-363, SC-88, PACKAGE-6	0.90 X 1.0 MM, 0.35 MM HEIGHT, SOT-1115, XSON-6	1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6	1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, XSON-6
制造商包装代码	SOT363	SOT1115	SOT891	SOT886	SOT886	SOT1202
Reach Compliance Code	compliant	compli	compli	compli	compli	compli
零件包装代码	TSSOP	SON	SON	SON	SON	-
针数	6	6	6	6	6	-
系列	AUP/ULP/V	-	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	-
JESD-30 代码	R-PDSO-G6	-	S-PDSO-N6	S-PDSO-N6	S-PDSO-N6	-
JESD-609代码	e3	-	e3	e3	e3	-
长度	2 mm	-	1 mm	1.45 mm	1.45 mm	-
负载电容（CL）	30 pF	-	30 pF	30 pF	30 pF	-
逻辑集成电路类型	LOGIC CIRCUIT	-	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT	-
最大I（ol）	0.004 A	-	0.004 A	0.004 A	0.004 A	-
湿度敏感等级	1	-	1	1	1	-
功能数量	1	-	1	1	1	-
端子数量	6	-	6	6	6	-
最高工作温度	125 °C	-	125 °C	125 °C	125 °C	-
最低工作温度	-40 °C	-	-40 °C	-40 °C	-40 °C	-
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装代码	TSSOP	-	VSON	VSON	VSON	-
封装等效代码	TSSOP6,.08	-	SOLCC6,.04,14	SOLCC6,.04,20	SOLCC6,.04,20	-
封装形状	RECTANGULAR	-	SQUARE	SQUARE	SQUARE	-
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	-
包装方法	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	-
峰值回流温度（摄氏度）	260	-	260	260	260	-
电源	2.5/3.3 V	-	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	-
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-
施密特触发器	YES	-	YES	YES	YES	-
座面最大高度	1.1 mm	-	0.5 mm	0.5 mm	0.5 mm	-
最大供电电压 (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	-
最小供电电压 (Vsup)	2.3 V	-	2.3 V	2.3 V	2.3 V	-
标称供电电压 (Vsup)	3 V	-	3 V	3 V	3 V	-
表面贴装	YES	-	YES	YES	YES	-
技术	CMOS	-	CMOS	CMOS	CMOS	-
温度等级	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-
端子面层	Tin (Sn)	-	Tin (Sn)	Tin (Sn)	Tin (Sn)	-
端子形式	GULL WING	-	NO LEAD	NO LEAD	NO LEAD	-
端子节距	0.65 mm	-	0.35 mm	0.5 mm	0.5 mm	-
端子位置	DUAL	-	DUAL	DUAL	DUAL	-
处于峰值回流温度下的最长时间	30	-	30	30	30	-
宽度	1.25 mm	-	1 mm	1 mm	1 mm	-

74AUP1T98GW,125

74AUP1T98GW,125概述

74AUP1T98GW,125规格参数

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74AUP1T98GW,125相似产品对比

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