counter shift registers 8bit 7V 1circ
参数名称 | 属性值 |
Source Url Status Check Date | 2013-06-14 00:00:00 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | QFN |
包装说明 | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 |
针数 | 14 |
制造商包装代码 | SOT762-1 |
Reach Compliance Code | compliant |
Base Number Matches | 1 |
74HC164BQ,115 | 74HC164N,652 | 74HC164PW,112 | 74HC164DB,118 | 74HC164D,652 | 74HCT164DB,112 | 74HCT164DB,118 | 74HCT164D,652 | |
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描述 | counter shift registers 8bit 7V 1circ | counter shift registers 8-bit SI-PO shift register | counter shift registers 8-bit SI-PO shift | counter shift registers 8-bit SI-PO shift | counter shift registers 8-bit SI-PO shift | counter shift registers 8-bit SI-PO shift | counter shift registers 8-bit SI-PO shift | counter shift registers 8-bit shift register |
Brand Name | NXP Semiconductor | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconductor |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | QFN | DIP | TSSOP | SSOP1 | SOIC | SSOP1 | SSOP1 | SOIC |
包装说明 | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | DIP, DIP14,.3 | TSSOP, TSSOP14,.25 | 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 | SOP, SOP14,.25 | SSOP, SSOP14,.3 | 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 | 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 |
针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
制造商包装代码 | SOT762-1 | SOT27-1 | SOT402-1 | SOT337-1 | SOT108-1 | SOT337-1 | SOT337-1 | SOT108-1 |
Reach Compliance Code | compliant | compli | compli | compli | compli | compli | compli | compliant |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
计数方向 | - | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT |
系列 | - | HC/UH | HC/UH | HC/UH | HC/UH | HCT | HCT | HCT |
JESD-30 代码 | - | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609代码 | - | e4 | e4 | e4 | e4 | e4 | e4 | - |
长度 | - | 19.025 mm | 5 mm | 6.2 mm | 8.65 mm | 6.2 mm | 6.2 mm | 8.65 mm |
负载电容(CL) | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | - | SERIAL IN PARALLEL OUT | SERIAL IN PARALLEL OUT | SERIAL IN PARALLEL OUT | SERIAL IN PARALLEL OUT | SERIAL IN PARALLEL OUT | SERIAL IN PARALLEL OUT | SERIAL IN PARALLEL OUT |
最大频率@ Nom-Su | - | 24000000 Hz | 24000000 Hz | 24000000 Hz | 24000000 Hz | 18000000 Hz | 22000000 Hz | - |
位数 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出极性 | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | DIP | TSSOP | SSOP | SOP | SSOP | SSOP | SOP |
封装等效代码 | - | DIP14,.3 | TSSOP14,.25 | SSOP14,.3 | SOP14,.25 | SSOP14,.3 | SSOP14,.3 | SOP14,.25 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | - | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V | 5 V |
传播延迟(tpd) | - | 255 ns | 255 ns | 255 ns | 255 ns | 54 ns | 54 ns | 54 ns |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 4.2 mm | 1.1 mm | 2 mm | 1.75 mm | 2 mm | 2 mm | 1.75 mm |
最大供电电压 (Vsup) | - | 6 V | 6 V | 6 V | 6 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | 2 V | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | - | NO | YES | YES | YES | YES | YES | YES |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
端子形式 | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | - | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
触发器类型 | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | - | 7.62 mm | 4.4 mm | 5.3 mm | 3.9 mm | 5.3 mm | 5.3 mm | 3.9 mm |
最小 fmax | - | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 18 MHz | 18 MHz | 18 MHz |
湿度敏感等级 | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
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