flash 128mb 3V 104mhz serial nor flash
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | SPANSION |
| 零件包装代码 | SOIC |
| 包装说明 | 0.300 INCH, LEAD FREE, PLASTIC, MS-013DAA, SOP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.1.A |
| 最大时钟频率 (fCLK) | 104 MHz |
| 数据保留时间-最小值 | 20 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 长度 | 10.3 mm |
| 内存密度 | 134217728 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 字数 | 16777216 words |
| 字数代码 | 16000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 16MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 电源 | 3/3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.00001 A |
| 最大压摆率 | 0.038 mA |
| 最大供电电压 (Vsup) | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 类型 | NOR TYPE |
| 宽度 | 7.5 mm |
| 最长写入周期时间 (tWC) | 50 ms |
| 写保护 | HARDWARE/SOFTWARE |
| S25FL129P0XMFI001 | S25FL129P0XMFI000 | S25FL129P0XNFI011 | S25FL129P0XMFI010 | S25FL129P0XNFI010 | |
|---|---|---|---|---|---|
| 描述 | flash 128mb 3V 104mhz serial nor flash | flash 128m cmos 3V 104mhz serial nor flash | flash 128mb 3V 104mhz serial nor flash | flash 128m cmos 3V 104mhz serial nor flash | flash 128mb 3V 104mhz serial nor flash |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION |
| 零件包装代码 | SOIC | SOIC | SON | SOIC | SON |
| 包装说明 | 0.300 INCH, LEAD FREE, PLASTIC, MS-013DAA, SOP-16 | 0.300 INCH, LEAD FREE, PLASTIC, MS-013DAA, SOP-16 | 6 X 8 MM, LEAD FREE, PLASTIC, WSON-8 | 0.300 INCH, LEAD FREE, PLASTIC, MS-013DAA, SOP-16 | 6 X 8 MM, LEAD FREE, PLASTIC, WSON-8 |
| 针数 | 16 | 16 | 8 | 16 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| 最大时钟频率 (fCLK) | 104 MHz | 104 MHz | 104 MHz | 104 MHz | 104 MHz |
| 数据保留时间-最小值 | 20 | 20 | 20 | 20 | 20 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-N8 | R-PDSO-G16 | R-PDSO-N8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 10.3 mm | 10.3 mm | 8 mm | 10.3 mm | 8 mm |
| 内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 8 | 16 | 8 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16MX8 | 16MX8 | 16MX8 | 16MX8 | 16MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | HVSON | SOP | HVSON |
| 封装等效代码 | SOP16,.4 | SOP16,.4 | SOLCC8,.3 | SOP16,.4 | SOLCC8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.65 mm | 0.8 mm | 2.65 mm | 0.8 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI |
| 最大待机电流 | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A |
| 最大压摆率 | 0.038 mA | 0.038 mA | 0.038 mA | 0.038 mA | 0.038 mA |
| 最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 7.5 mm | 7.5 mm | 6 mm | 7.5 mm | 6 mm |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| 最长写入周期时间 (tWC) | 50 ms | - | 50 ms | 50 ms | 50 ms |
MEMS传感器
PCB设计
PCB设计
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工控电子
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