HCPL-270L/070L/273L/073L
Low Input Current, High Gain, LVTTL/LVCMOS Compatible Optocouplers
Data Sheet
Description
These high gain series couplers use a Light Emitting Di-
ode and an integrated high gain photodetector to pro-
vide extremely high current transfer ratio between input
and output. Separate pins for the photodiode and out-
put stage result in LVTTL compatible saturation voltages
and high speed operation. Where desired, the V
CC
and V
O
terminals may be tied together to achieve conventional
photo-darlington operation. A base access terminal al-
lows a gain bandwidth adjustment to be made.
These optocouplers are for use in LVTTL/LVCMOS or
other low power applications. A 400% minimum current
transfer ratio is guaranteed over 0 to +70˚C operating
range for only 0.5 mA of LED current.
The HCPL-070L and HCPL-073L are surface mount de-
vices packaged in an industry standard SOIC-8 footprint.
The SOIC-8 does not require "through holes" in a PCB.
This package occupies approximately one-third the foot-
print area of the standard dual-in-line package. The lead
profile is designed to be compatible with standard sur-
face mount processes.
Features
•
3.3V/5V Dual Supply Voltages
•
Low power consumption
•
High current transfer ratio
•
Low input current requirements – 0.5 mA
•
LVTTL/LVCMOS compatible output
•
Performance guaranteed over temperature 0°C to +70°C
•
Base access allows gain bandwidth adjustment
•
High output current – 60 mA
•
Safety approval, UL, IEC/EN/DIN EN 60747-5-2, CSA
Applications
•
Ground isolate most logic families – LVTTL/LVCMOS
•
Low input current line receiver
•
High voltage insulation
•
EIA RS-232C line receiver
•
Telephone ring detector
•
V AC line voltage status indicator – low input power
dissipation
•
Low power systems – ground isolation
Functional Diagram
HCPL-270L/070L
NC 1
ANODE 2
CATHODE 3
NC 4
8
7
V
CC
V
B
ANODE
1
1
CATHODE
1
2
CATHODE
2
3
ANODE
2
4
SHIELD
HCPL-273L/073L
8
7
V
CC
V
O1
6 V
O
5 GND
6 V
O2
5 GND
TRUTH TABLE
LED
V
O
ON
OFF
LOW
HIGH
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
HCPL-270L, HCPL-273L, HCPL-070L and HCPL-073L are UL Recognized with 3750 Vrms for 1 minute per UL1577 and
are approved under CSA Component Acceptance Notice #5, File CA 88324.
Option
Part
Number
RoHS
Compliant
-000E
HCPL-270L -300E
HCPL-273L -500E
-060E
-560E
-000E
HCPL-070L -500E
HCPL-073L -060E
-560E
non RoHS
Compliant
no option
-300
-500
-060
-560
no option
-500
-060
-560
Package
300 mil DIP-8
Surface
Mount
X
X
Gull
Wing
X
X
Tape
& Reel
UL 5000 Vrms/
1 Minute rating
IEC/EN/DIN
EN 60747-5-2
Quantity
50 per tube
50 per tube
X
X
1000 per reel
100 per tube
1500 per reel
100 per tube
X
SO-8
X
X
X
X
X
X
X
X
X
X
X
1500 per reel
100 per tube
1500 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-273L-500E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with
IEC/EN/DIN EN 60747-5-2 Safety Approval and RoHS compliant.
Example 2:
HCPL-273L to order product of 300 mil DIP package in Tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since July 15, 2001 and
RoHS compliant will use ‘–XXXE.’
2
Selection Guide
8-Pin DIP (300 Mil)
Single Channel
Package HCPL-
270L
Small Outline SO-8
Dual Channel
Package HCPL-
273L
Single Channel
Package HCPL-
070L
Dual Channel
Package HCPL-
073L
Minimum Input
ON Current (I
F
)
0.5 mA
Minimum CTR
400%
Schematic
V
CC
1
I
CC
2
+
V
F
CATHODE
-
3
I
O
6
V
O
3
5
SHIELD
-
GND
V
F2
VB
7
+
4
5
SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED
GND
I
F
V
F1
-
2
+
I
F1
I
CC
8
8
V
CC
ANODE
I
O1
7
V
O1
I
F2
I
O2
6
V
O2
I
B
HCPL-270L/HCPL-070L
HCPL-273L/HCPL-073L
3
Package Outline Drawings
8-Pin DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
5
OPTION CODE*
DATE CODE
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
1.78 (0.070) MAX.
+ 0.076
- 0.051
+ 0.003)
(0.010 - 0.002)
0.254
5
°
TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
Small Outline SO-8 Package
TYPE NUMBER
(LAST 3 DIGITS)
8
7
6
5
LAND PATTERN RECOMMENDATION
OPTION 060 CODE
3.937 ± 0.127
(0.155 ± 0.005)
1
2
XXXV
YWW
5.994 ± 0.203
(0.236 ± 0.008)
DATE CODE
PIN ONE
0.406 ± 0.076
(0.016 ± 0.003)
3
4
7.49 (0.295)
1.270 BSC
(0.050)
1.9 (0.075)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
7
°
45¡ X
0.432
(0.017)
1.524
(0.060)
0 ~ 7
°
0.228 ± 0.025
(0.009 ± 0.001)
0.203 ± 0.102
(0.008 ± 0.004)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
4
Solder Reflow Temperature Profile
300
PREHEATING RATE 3
°
C + 1
°
C/-0.5
°
C/SEC.
REFLOW HEATING RATE 2.5
°
C ± 0.5
°
C/SEC.
PEAK
TEMP.
245
°
C
PEAK
TEMP.
240
°
C
200
TEMPERATURE (
°
C)
160
°
C
150
°
C
140
°
C
3
°
C + 1
°
C/-0.5
°
C
PEAK
TEMP.
230
°
C
2.5
°
C ± 0.5
°
C/SEC.
30
SEC.
30
SEC.
SOLDERING
TIME
200
°
C
100
PREHEATING TIME
150
°
C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
TIME (SECONDS)
150
200
250
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60to180SEC.
25
t
L
60 to 150 SEC.
260 +0/-5
°
C
217
°
C
150 - 200
°
C
RAMP-UP
3
°
C/SEC. MAX.
RAMP-DOWN
6
°
C/SEC. MAX.
TIMEWITHIN 5
°
C of ACTUAL
PEAKTEMPERATURE
20-40 SEC.
t 25
°
C to PEAK
TIME
NOTES:
THE TIME FROM 25
°
C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200
°
C, T
smin
= 150
°
C
Note: Non-halide flux should be used.
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL Approval under UL 1577, Component Recognition Program, File E55361.
CSA Approval under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (Option 060 only)
5
FPGA/CPLD
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