Product Data Sheet
Industrial
MICRO SD Memory Card
S-300u Series
SPI, SD and SDHC compliant
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.01
S-300u_data_sheet_SD-NxBW_Rev101.doc
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S-300u Series
MICRO SD Memory Card
1
Feature summary
Highly-integrated memory controller
o
Fully compliant with SD Memory Card specification SD1.01, SD1.1, SD2.0
and SD3.01 and MICRO SD Memory Card Addendum 4.00
Standard MICRO SD Memory Card form factor
o
15.0mm x 11.0mm x 0.7mm
Operating voltage 2.7…3.6V
Low-power CMOS technology
High reliability
o
MTBF:
> 3,000,000 hours
o
Number of insertions: > 10,000
o
Extended Temperature range -25° up to 85°C
o
Industrial Temperature range -40° up to 85°C
Hot swappable
High performance
o
Speed class
2GB Card class 6
4GB to 8GB class 10
o
SD burst up to 25MB/s
o
SD Low speed 0…25MHz clock rate
o
SD High speed 25…50MHz clock rate
o
Flash burst up to 40MB/s
o
Flash Bus interleave
Operating bus modes: SD 1 & 4bit and SPI
Error Correction up to 24bit/1KB BCH ECC
Wear Leveling: equal wear leveling of static and dynamic data
The wear leveling assures that dynamic data as well as static data is balanced evenly across the memory.
With that the maximum write endurance of the device is guaranteed.
Write Endurance: Due to advanced wear leveling an even use of the entire flash is guaranteed, regardless
how much “static” (OS) data is stored. Example: If the average file size is 10MByte and the total capacity is
8GByte, 48Mio write cycles can be performed.
Available densities
o
2, 4 and 8GBytes (SLC NAND Flash)
Controlled BOM
Life Cycle Management
2
Order Information
2.1 Standard product list
Table 1: Standard Product List
Density
Part Number
2GB
SFSD2048NgBW1MT-t-ME-1x1-STD
4GB
SFSD4096NgBW1MT-t-DF-1x1-STD
8GB
SFSD8192NgBW1MT-t-QG-1x1-STD
g defines the product generation
x defines the FW
t defines the temperature range (E=-25°C to +85°C, I=-40°C to +85°C)
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.01
S-300u_data_sheet_SD-NxBW_Rev101.doc
Page
22 of 23
2.2 Current product generation
Table 2: Standard Product List
Density
Part Number
2GB
SFSD2048N1BW1MT-E-ME-111-STD
4GB
SFSD4096N1BW1MT-E-DF-111-STD
8GB
SFSD8192N1BW1MT-E-QG-111-STD
2GB
SFSD2048N1BW1MT-I-ME-111-STD
4GB
SFSD4096N1BW1MT-I-DF-111-STD
8GB
SFSD8192N1BW1MT-I-QG-111-STD
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.01
S-300u_data_sheet_SD-NxBW_Rev101.doc
Page
22 of 23
3
Contents
1
FEATURE SUMMARY
..................................................................................................................................................................... 2
2
ORDER INFORMATION
.................................................................................................................................................................. 2
2.1 S
TANDARD PRODUCT LIST
.......................................................................................................................................................... 2
2.2 C
URRENT PRODUCT GENERATION
................................................................................................................................................ 3
3
CONTENTS
.................................................................................................................................................................................... 4
4
PRODUCT SPECIFICATION
............................................................................................................................................................. 5
4.1 S
YSTEM
P
ERFORMANCE
............................................................................................................................................................ 5
4.2 E
NVIRONMENTAL
S
PECIFICATIONS
.............................................................................................................................................. 6
4.2.1 Recommended Operating Conditions
............................................................................................................... 6
4.2.2 Recommended Storage Conditions
................................................................................................................... 6
4.2.3 Humidity & ESD
.................................................................................................................................................... 6
4.2.4 Environmental Conditions
................................................................................................................................. 6
4.3 P
HYSICAL
D
IMENSIONS
............................................................................................................................................................ 6
4.4 R
ELIABILITY
.......................................................................................................................................................................... 6
5
CAPACITY SPECIFICATION
............................................................................................................................................................. 6
6
CARD PHYSICAL
........................................................................................................................................................................... 7
6.1 P
HYSICAL DESCRIPTION
............................................................................................................................................................ 7
7
ELECTRICAL INTERFACE
................................................................................................................................................................ 8
7.1 E
LECTRICAL DESCRIPTION
........................................................................................................................................................... 8
7.2 DC
CHARACTERISTICS
............................................................................................................................................................... 9
7.3 S
IGNAL
L
OADING
.................................................................................................................................................................... 9
7.4 AC
CHARACTERISTICS
..............................................................................................................................................................10
8
HOST ACCESS SPECIFICATION
......................................................................................................................................................12
8.1 SD
AND
SPI B
US
M
ODES
.......................................................................................................................................................12
8.1.1 SD Bus Mode Protocol
.........................................................................................................................................12
8.1.2 SPI Bus Mode Protocol
........................................................................................................................................13
8.1.3 Mode Selection
....................................................................................................................................................13
8.2 C
ARD
R
EGISTERS
...................................................................................................................................................................14
9
DECLARATION OF CONFORMITY
..................................................................................................................................................17
10
ROHS AND WEEE UPDATE FROM SWISSBIT
...............................................................................................................................18
11
PART NUMBER DECODER
...........................................................................................................................................................20
11.1 M
ANUFACTURER
...................................................................................................................................................................20
11.2 M
EMORY
T
YPE
.....................................................................................................................................................................20
11.3 P
RODUCT
T
YPE
.....................................................................................................................................................................20
11.4 C
APACITY
............................................................................................................................................................................20
11.5 P
LATFORM
..........................................................................................................................................................................20
11.6 G
ENERATION
.......................................................................................................................................................................20
11.7 M
EMORY
O
RGANIZATION
........................................................................................................................................................20
11.8 T
ECHNOLOGY
.......................................................................................................................................................................20
11.9 C
HANNELS
..........................................................................................................................................................................20
11.10 F
LASH
C
ODE
......................................................................................................................................................................20
11.11 T
EMP
. O
PTION
....................................................................................................................................................................21
11.12 DIE C
LASSIFICATION
............................................................................................................................................................21
11.13 PIN M
ODE
........................................................................................................................................................................21
11.14 C
ONFIGURATION
XYZ
...........................................................................................................................................................21
11.15 O
PTION
.............................................................................................................................................................................21
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.01
S-300u_data_sheet_SD-NxBW_Rev101.doc
Page
22 of 23
12
SWISSBIT LABEL SPECIFICATION
................................................................................................................................................22
12.1 F
RONT SIDE MARKING
............................................................................................................................................................22
12.2 B
ACK SIDE MARKING
.............................................................................................................................................................22
13
REVISION HISTORY.....................................................................................................................................................................23
4
Product Specification
The MICRO SD Memory Card is a small form factor non-volatile memory card which provides high capacity data
storage. Its aim is to capture, retain and transport data, audio and images, facilitating the transfer of all types of
digital information between a large variety of digital systems.
The card operates in two basic modes:
SD/SDHC card mode
SPI mode
The MICRO SD Memory Card also supports SD High Speed mode with up to 50MHz clock frequency.
The cards are compliant with
SD Memory card Specification Part 1, Physical layer Specification V3.01
SD Memory card Specification Part 2, File System Specification V3.00
SD Memory card Specification Part 3, Security Specification V3.00
MICRO SD Memory Card Addendum V4.00
Simplified specifications are available at
https://www.sdcard.org/downloads/pls/simplified_specs/
The Card has an internal intelligent controller which manages interface protocols, data storage and retrieval as
well as hardware BCH Error Correction Code (ECC), defect handling, diagnostics and clock control.
The advanced wear leveling mechanism assures an equal usage of the Flash memory cells to extend the life time.
The hardware BCH-code ECC allows to detect and correct up to 24 defect bits per 1kByte.
The card has a power-loss management feature to prevent data corruption after power-down. The power
consumption is very low.
The cards are RoHS compliant and lead-free.
4.1 System Performance
Table 3: Performance
System Performance
Burst Data transfer Rate (max SD clock 50MHz)
Sustained Sequential Read
Sustained Sequential Write
2GB
4…8GB
2GB
4…8GB
typ
19
(1)(2)
19
(1)(2)
11
(1)(2)
17
(1)(2)
max
25
(1)(3)
24
(1)(3)
24
(1)(3)
12
(1)(3)
22
Unit
MB/s
1.
All values refer to Micron Flash 8Gb MICRO SD Memory Card in SD mode 50MHz, cycle time 20ns,
2.
Sustained Speed measured with USB-SD Memory Card reader. It depends on burst speed, flash number, and file size.
3.
Maximum values were measured with Testmetrix tester.
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.01
S-300u_data_sheet_SD-NxBW_Rev101.doc
Page
22 of 23