Freescale Semiconductor
Data Sheet: Technical Data
Document Number: K11P121M50SF4
Rev. 4, 08/2013
K11 Sub-Family
K11P121M50SF4
Supports the following:
MK11DX128VMC5, MK11DX256VMC5,
MK11DN512VMC5
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Tamper detect and secure storage
– Hardware random-number generator
– Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– General-purpose input/output
• Analog modules
– 16-bit SAR ADC
– 12-bit DAC
– Two analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel general purpose timers, one with
quadrature decoder functionality
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB Device Charger detect
– Two SPI modules
– Two I2C modules
– Four UART modules
– I2S module
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 50 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB of program flash for devices without
FlexNVM.
– Up to 256 KB program flash for devices with
FlexNVM.
– 64 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 64 KB RAM
– Serial programming interface (EzPort)
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– 16-channel DMA controller, supporting up to 63
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012–2013 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
2.5 Small package marking.....................................................4
3 Terminology and guidelines......................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5 General.....................................................................................10
5.1 AC electrical characteristics..............................................11
5.2 Nonswitching electrical specifications...............................11
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
Voltage and current operating requirements.........11
LVD and POR operating requirements.................12
Voltage and current operating behaviors..............13
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............14
EMC radiated emissions operating behaviors.......18
Designing with radiated emissions in mind...........19
Capacitance attributes..........................................19
6.8.6
6.8.2
6.8.3
6.8.4
6.8.5
5.4 Thermal specifications.......................................................20
5.4.1
5.4.2
Thermal operating requirements...........................21
Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................22
6.1 Core modules....................................................................22
6.1.1
JTAG electricals....................................................22
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1
6.3.2
6.3.3
MCG specifications...............................................25
Oscillator electrical specifications.........................27
32 kHz oscillator electrical characteristics.............29
6.4 Memories and memory interfaces.....................................30
6.4.1
6.4.2
Flash electrical specifications................................30
EzPort switching specifications.............................33
6.5 Security and integrity modules..........................................34
6.5.1
DryIce Tamper Electrical Specifications................34
6.6 Analog...............................................................................34
6.6.1
6.6.2
6.6.3
6.6.4
ADC electrical specifications.................................34
CMP and 6-bit DAC electrical specifications.........38
12-bit DAC electrical characteristics.....................41
Voltage reference electrical specifications............44
6.7 Timers................................................................................45
6.8 Communication interfaces.................................................45
6.8.1
DSPI switching specifications (limited voltage
range)....................................................................45
DSPI switching specifications (full voltage range).47
I2C switching specifications..................................49
UART switching specifications..............................49
Normal Run, Wait and Stop mode performance
over the full operating voltage range.....................49
VLPR, VLPW, and VLPS mode performance
over the full operating voltage range.....................51
7 Dimensions...............................................................................53
7.1 Obtaining package dimensions.........................................53
8 Pinout........................................................................................53
8.1 K11 Signal Multiplexing and Pin Assignments..................53
8.2 K11 Pinouts.......................................................................58
9 Revision History........................................................................59
5.3 Switching specifications.....................................................19
5.3.1
5.3.2
Device clock specifications...................................19
General switching specifications...........................20
K11 Sub-Family Data Sheet, Rev. 4, 08/2013.
2
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
freescale.com
and perform a part number search for the
following device numbers: PK11 and MK11 .
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
Qualification status
Kinetis family
Key attribute
Flash memory type
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K11
• D = Cortex-M4 w/ DSP
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K11 Sub-Family Data Sheet, Rev. 4, 08/2013.
Freescale Semiconductor, Inc.
3
Part identification
Field
FFF
Description
Program flash memory size
•
•
•
•
•
•
•
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
2M0 = 2 MB
Values
R
Silicon revision
• Z = Initial
• (Blank) = Main
• A = Revision after main
• V = –40 to 105
• C = –40 to 85
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
LH = 64 LQFP (10 mm x 10 mm)
MP = 64 MAPBGA (5 mm x 5 mm)
LK = 80 LQFP (12 mm x 12 mm)
LL = 100 LQFP (14 mm x 14 mm)
MC = 121 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
5 = 50 MHz
7 = 72 MHz
10 = 100 MHz
12 = 120 MHz
15 = 150 MHz
18 = 180 MHz
T
PP
Temperature range (°C)
Package identifier
CC
Maximum CPU frequency (MHz)
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MK11DN512VMC5
2.5 Small package marking
In an effort to save space, small package devices use special marking on the chip. These
markings have the following format:
Q ## C F T PP
This table lists the possible values for each field in the part number for small packages
(not all combinations are valid):
K11 Sub-Family Data Sheet, Rev. 4, 08/2013.
4
Freescale Semiconductor, Inc.
Terminology and guidelines
Field
Q
C
F
Qualification status
Speed
Flash memory configuration
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• G = 50 MHz
• G = 128 KB + Flex
• H = 256 KB + Flex
• 9 = 512 KB
• V = –40 to 105
• MC = 121 MAPBGA
T
PP
Temperature range (°C)
Package identifier
This tables lists some examples of small package marking along with the original part
numbers:
Original part number
MK11DX128VLK5
MK11DX256VMC5
M11GGVLK
M11GHVMC
Alternate part number
3 Terminology and guidelines
3.1 Definition: Operating requirement
An
operating requirement
is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
3.1.1 Example
This is an example of an operating requirement:
Symbol
V
DD
Description
1.0 V core supply
voltage
0.9
Min.
1.1
Max.
V
Unit
K11 Sub-Family Data Sheet, Rev. 4, 08/2013.
Freescale Semiconductor, Inc.
5
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