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MAX1005CEE+

产品描述RF wireless misc IF undersampler
产品类别模拟混合信号IC    信号电路   
文件大小94KB,共8页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX1005CEE+概述

RF wireless misc IF undersampler

MAX1005CEE+规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Maxim(美信半导体)
零件包装代码SOIC
包装说明SSOP, SSOP16,.25
针数16
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time6 weeks
模拟集成电路 - 其他类型ANALOG CIRCUIT
JESD-30 代码R-PDSO-G16
JESD-609代码e3
长度4.89 mm
湿度敏感等级1
功能数量1
端子数量16
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码SSOP
封装等效代码SSOP16,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度)260
电源3/5 V
认证状态Not Qualified
座面最大高度1.75 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.7 V
表面贴装YES
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.635 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度3.9 mm

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19-1291; Rev 0; 9/97
IF Undersampler
_______________General Description
The MAX1005 is a combined digitizer and reconstruc-
tion integrated circuit designed to work in systems that
demodulate and modulate communications signals. It
integrates IF undersampling and signal synthesis func-
tions into a single, low-power circuit. Its analog-to-
digital converter (ADC) is used to directly sample or
undersample a downconverted RF signal, while its
digital-to-analog converter (DAC) recreates the IF sub-
carrier and transmission data. The MAX1005’s ADC is
ideal for undersampling applications, due to the analog
input amplifier’s wide (15MHz) bandwidth. The DAC
has very low glitch energy, which minimizes the trans-
mission of unwanted spurious signals. An on-chip
reference provides for low-noise ADC and DAC conver-
sions.
The MAX1005 provides a high level of signal integrity
from a low power budget. It operates from a single
power supply, or from separate analog and digital sup-
plies with independent voltages ranging from +2.7V to
+5.5V. The MAX1005 can operate with an unregulated
analog supply of 5.5V and a regulated digital supply
down to 2.7V. This flexible power-supply operation
saves additional power in complex digital systems.
The MAX1005 has three operating modes: transmit
(DAC active), receive (ADC active), and shutdown
(ADC and DAC inactive). In shutdown mode, the total
supply current drops below 1µA. The device requires
only 2.4µs to wake up from shutdown mode. The
MAX1005 is ideal for hand-held, as well as base-station
applications. It is available in a tiny 16-pin QSOP pack-
age specified for operation over both the commercial
and extended temperature ranges.
____________________________Features
o
Differential-Input, 5-Bit ADC
o
Differential-Output, 7-Bit DAC
o
15Msps Min Conversion Rate
o
25MHz -1dB Full-Power Bandwidth
o
44dB SFDR for ADC
39dB at 10.7MHz SFDR (Imaged) for DAC
o
Internal Voltage Reference
o
Parallel Logic Interface
o
Single-Supply Operation (+2.7V to +5.5V)
o
0.1µA Low-Power Shutdown Mode
MAX1005
______________Ordering Information
PART
MAX1005CEE
MAX1005EEE
TEMP. RANGE
0°C to +70°C
-40°C to +85°C
PIN-PACKAGE
16 QSOP
16 QSOP
__________________Pin Configuration
TOP VIEW
VCCD 1
16 CLK
15 D0
14 D1
________________________Applications
PWT1900
PHS/P
Wireless Loops
PCS/N
DGND 2
RXEN 3
AIO+ 4
AIO- 5
TXEN 6
AGND 7
VCCA 8
MAX1005
13 D2
12 D3
11 D4
10 D5
9
D6
QSOP
Functional Diagram appears at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 408-737-7600 ext. 3468.

MAX1005CEE+相似产品对比

MAX1005CEE+ MAX1005CEE+T MAX1005EEE+T
描述 RF wireless misc IF undersampler RF wireless misc IF undersampler RF wireless misc IF undersampler
是否无铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 SOIC SOIC SOIC
包装说明 SSOP, SSOP16,.25 SSOP, SSOP16,.25 SSOP, SSOP16,.25
针数 16 16 16
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
模拟集成电路 - 其他类型 ANALOG CIRCUIT ANALOG CIRCUIT ANALOG CIRCUIT
JESD-30 代码 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609代码 e3 e3 e3
长度 4.89 mm 4.89 mm 4.89 mm
湿度敏感等级 1 1 1
功能数量 1 1 1
端子数量 16 16 16
最高工作温度 70 °C 70 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP SSOP SSOP
封装等效代码 SSOP16,.25 SSOP16,.25 SSOP16,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260
电源 3/5 V 3/5 V 3/5 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.75 mm 1.75 mm 1.75 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
表面贴装 YES YES YES
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) TIN
端子形式 GULL WING GULL WING GULL WING
端子节距 0.635 mm 0.635 mm 0.635 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30
宽度 3.9 mm 3.9 mm 3.9 mm
Factory Lead Time 6 weeks 6 weeks -
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