The MAX3518ETP+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
.....Attachments
I. Device Description
A. General
The MAX3518 is an integrated CATV upstream amplifier IC designed to meet the DOCSIS 3.0 requirements, while dissipating only 1.25W. The
amplifier covers a 5MHz to 85MHz input frequency range (275MHz, 3dB bandwidth), and is capable of transmitting four QPSK modulated carriers,
each at +58dBmV, simultaneously within this range. Both input and output ports are differential, requiring that an external balun be used at the output
port. The gain is controlled in 1dB steps over a 63dB range using a SPI(tm) 3-wire interface. The MAX3518 operates from a single +5V supply. Four
power codes are provided to allow maximum supply current to be reduced as determined by distortion requirements. In addition, for each power code,
supply current is automatically reduced as gain is reduced while maintaining distortion performance. For DOCSIS 3.0 applications, the MAX3518
draws 300mA at 33dB gain, dropping to 250mA at 31dB gain. The MAX3518 supply current drops to 5mA between bursts to minimize power
dissipation in transmit-disable mode. Control logic levels are 3.3V CMOS. The MAX3518 is available in a 20-pin thin QFN package, and operates over
the extended industrial temperature range (-40°C to +85°C).
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
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MAX3518
II. Manufacturing Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
SiO
2
Wafer Saw
59 X 59 mils
BCB
Al with top layer 100% Cu
None
0.35µm
0.35µm
20L TQFN 5x5
Copper
100% matte Tin
'conductive
Au (1 mil dia.)
Epoxy with silica filler
#05-9000-3499 / A
Class UL94-V0
1
47°C/W
2°C/W
29°C/W
2°C/W
DOCSIS 3.0 Upstream Amplifier
MB3
9118
California
Taiwan, Thailand
January 23, 2009
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Page 3/5
MAX3518
V. Quality Assurance Information
A. Quality Assurance Contacts:
Richard Aburano (Manager, Reliability Engineering)
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
< 50 ppm
Mil-Std-105D
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate:
D. Sampling Plan:
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
= ___1___
MTTF
=
_______1.83_______ (Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.9 x 10
-9
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the MB3 Process results in a FIT Rate of 0.08 @ 25C and 1.33 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot STIXAQ002A D/C 1105)
The WG61-2 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500V per
JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250mA and overvoltage per
JEDEC JESD78.
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Page 4/5
MAX3518
Table 1
Reliability Evaluation Test Results
MAX3518ETP+
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
Static Life Test
(Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
DC Parameters
& functionality
48
0
STIZAQ001C, D/C 0849
Note 1: Life Test Data may represent plastic DIP qualification lots.
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