Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MKW2xDxxx
Rev. 1, 11/2013
Supports MKW24D512V,
MKW22D512V, MKW21D512V, and
MKW21D256V Products
Features
• The MKW2x is a low power, compact integrated
device consisting of a high-performance 2.4 GHz IEEE
802.15.4 compliant radio transceiver and a powerful
ARM Cortex-M4 MCU system with connectivity and
precision mixed signal analog peripherals.
• Part of the large Kinetis MCU portfolio, the MKW2x
family of devices are used to easily enable connectivity
based on the ZigBee Pro network stack and application
profiles for Smart Energy 1.x, Home Automation,
Healthcare, and RF4CE, as well as the ZigBee IP
network stack and the Smart Energy 2.0 application
profile. Typical applications include Home Area
Networks consisting of meters, gateways, in-home
displays, and connected appliances, and also networked
Building Control and Home Automation applications
with lighting control, HVAC, and security.
• The MCU system of MKW2x includes a 50 MHz
Cortex-M4 CPU with DSP capabilities, up to 512 KB
of Flash memory, 64 KB of SRAM, and 64 KB of Flex
Memory (available only on the MKW21D256V), plus
a wide array of peripherals including USB,
Cryptographic Acceleration, 16-bit ADC, and flexible
timers.
• The radio transceiver of the MKW2x has excellent
performance, with up to -102 dBm receiver sensitivity,
+8 dBm maximum transmit output power, and up to 58
dBm channel rejection. Current consumption is
minimized with peak transmit current of 17 mA at 0
dBm output power, and peak receive current of 15 mA
in Low Power Preamble Search mode.
• The MKW2x is packaged in an 8 x 8 mm LGA with 63
total contacts, and operates between 1.8 V and 3.6 V in
an ambient temperature range from -40°C to 105°C.
MKW2xDxxx Data Sheet
MKW2xDxxx
This document contains information on a new product. Specifications and
information herein are subject to change without notice.
© 2013 Freescale Semiconductor, Inc.
Table of Contents
1
2
Ordering information...............................................................3
Features..................................................................................3
2.1
2.2
2.3
3
Block diagram................................................................3
Radio features...............................................................4
Microcontroller features.................................................5
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.3.6
8.3.7
8.3.8
8.4
Voltage and current operating requirements.....23
LVD and POR operating requirements.............24
Voltage and current operating behaviors..........25
Power mode transition operating behaviors......25
Power consumption operating behaviors..........26
EMC radiated emissions operating behaviors. .30
Designing with radiated emissions in mind.......31
Capacitance attributes......................................31
Transceiver description...........................................................8
3.1
3.2
Key specifications..........................................................8
RF interface and usage.................................................9
3.2.1
3.3
Clock output feature..........................................9
Switching specifications................................................31
8.4.1
8.4.2
Device clock specifications...............................31
General switching specifications.......................32
Transceiver functions....................................................10
3.3.1
3.3.2
3.3.3
Receive.............................................................10
Transmit............................................................10
Clear channel assessment (CCA), energy
detection (ED), and link quality indicator (LQI). 10
3.3.4
3.3.5
Packet processor..............................................12
Packet buffering................................................13
8.6
8.5
Thermal specifications...................................................33
8.5.1
8.5.2
Thermal operating requirements.......................33
Thermal attributes.............................................33
Peripheral operating requirements and behaviors........34
8.6.1
8.6.2
8.6.3
8.6.4
8.6.5
8.6.6
8.6.7
8.6.8
Core modules....................................................34
System modules...............................................37
Clock modules..................................................37
Memories and memory interfaces.....................42
Security and integrity modules..........................46
Analog...............................................................47
Timers...............................................................53
Communication interfaces................................53
3.4
4
Dual PAN ID..................................................................13
System and power management............................................14
4.1
4.2
Modes of operation........................................................14
Power management......................................................15
5
Radio Peripherals....................................................................15
5.1
5.2
Clock output (CLK_OUT)..............................................15
General-purpose input output (GPIO)...........................16
5.2.1
5.2.2
Serial peripheral interface (SPI)........................17
Antenna diversity..............................................18
9
Transceiver Electrical Characteristics.....................................62
9.1
9.2
9.3
9.4
DC electrical characteristics..........................................62
AC electrical characteristics..........................................63
SPI timing: R_SSEL_B to R_SCLK...............................64
SPI timing: R_SCLK to R_MOSI and R_MISO.............65
6
7
MKW2x operating modes........................................................19
MKW2x electrical characteristics............................................20
7.1
7.2
Radio recommended operating conditions....................20
Ratings..........................................................................20
7.2.1
7.2.2
7.2.3
7.2.4
Thermal handling ratings..................................20
Moisture handling ratings..................................21
ESD handling ratings........................................21
Voltage and current operating ratings...............21
10 Crystal oscillator reference frequency.....................................65
10.1 Crystal oscillator design considerations........................65
10.2 Crystal requirements.....................................................65
11 Pin diagrams and pin assignments.........................................66
11.1 MKW21D256/MKW21D512 Pin Assignment.................66
11.2 MKW22/24D512V Pin Assignment................................67
11.3 Pin assignments............................................................67
12 Dimensions.............................................................................71
12.1 Obtaining package dimensions.....................................71
8
MCU Electrical characteristics................................................22
8.1
8.2
8.3
Maximum ratings...........................................................22
AC electrical characteristics..........................................23
Nonswitching electrical specifications...........................23
MKW2xDxxx Data Sheet Data Sheet, Rev. 1, 11/2013.
2
Freescale Semiconductor, Inc.
Ordering information
1 Ordering information
Device
MKW21D256VHA5(R)
Operating
Temp
Package
Range
(T
A
)
-40 to
105°C
Table 1. Orderable parts details
Memory
Options
32 KB
SRAM,
256 KB
flash
64 KB
SRAM,
512 KB
flash
64 KB
SRAM,
512 KB
flash
64 KB
SRAM,
512 KB
flash
Description
Additional FlexMemory with up to 64 KB FlexNVM and
up to 4 KB FlexRAM. No USB.
LGA (R: tape and
reel)
MKW21D512VHA5(R)
-40 to
105°C
LGA (R: tape and
reel)
Supports higher memory option and additional GPIO.
No USB. No FlexNVM or FlexRAM.
MKW22D512VHA5(R)
-40 to
105°C
LGA (R: tape and
reel)
Supports full speed USB 2.0. No FlexNVM or FlexRAM.
MKW24D512VHA5(R)
-40 to
105°C
LGA (R: tape and
reel)
Supports Smart Energy 2.0 and full-speed USB 2.0. No
FlexNVM or FlexRAM.
2 Features
This section provides a simplified block diagram and highlights MKW2x features.
MKW2xDxxx Data Sheet Data Sheet, Rev. 1, 11/2013.
Freescale Semiconductor, Inc.
3
Features
2.1 Block diagram
Core
ARM
®
Cortex
TM
–M4
50 MHz
System
Internal and
External
Watchdogs
Memories
Program Flash
(up to 512 KB)
FlexNVM
64 KB
4 KB FlexRAM
MKW21D256 only
SRAM
(up to 64 KB)
RF Transceiver
IEEE 802.15.4 2006
2.4 GHz
Debug
Interfaces
DSP
DMA
Antenna Diversity
Dual
PAN ID
Interrupt Controller
Low‐Leakage
Wake‐up Unit
Timers
FlexTimer
Programmable
Delay Block
Periodic Interrupt
Timers
Low‐Power
Timer
Independent
Real‐Time
Clock (RTC)
32 MHz
OSC
SPI
Security
and Integrity
Cyclic
Redundancy
Check (CRC)
Analog
16‐bit
ADC
High‐Speed
Comparator
with 6‐bit
DAC
Communication Interfaces
USB On‐the‐Go
(HS)
USB Device
Charger Detect
(DCD)
USB Voltage
Regulator
Clocks
Phase‐Locked
Loop
Frequency
Locked Loop
Low/High
Frequency
Oscillators
Internal
Reference
Clocks
I2C
Tamper Detect
Cryptography
Authentication
Unit
UART
(ISO 7816)
SPI
Random Number
Generator
Standard Feature
Optional
Figure 1. MKW2xDxxxV simplified block diagram
2.2 Radio features
• Fully compliant 802.15.4 Standard transceiver supports 250 kbps data rate with O-
QPSK modulation in 5.0 MHz channels with direct sequence spread-spectrum
(DSSS) encode and decode
• Operates on one of 16 selectable channels in the 2.4 GHz frequency ISM band
• Programmable output power
• Supports 2.36 to 2.4 GHz Medical Band (MBAN) frequencies with same modulation
as IEEE 802.15.4
• Hardware acceleration for IEEE® 802.15.4 2006 packet processing
MKW2xDxxx Data Sheet Data Sheet, Rev. 1, 11/2013.
4
Freescale Semiconductor, Inc.
Features
• Random number generator
• Support for dual PAN mode
• 32 MHz crystal reference oscillator with on board trim capability to supplement
external load capacitors
• Programmable frequency clock output (CLK_OUT)
• Control port for Antenna Diversity mode
• Clocks
• 32 MHz crystal oscillator
• Internal 1 kHz low power oscillator
• DC to 32 MHz external square wave input clock
• Small RF footprint
• Differential input/output port used with external balun
• Integrated transmit/receive switch
• Supports single ended and diversity antenna options
• Low external component count
• Supports external PA and LNA
2.3 Microcontroller features
• Core:
• ARM Cortex-M4 Core at 50 MHz (1.25 MIPS/MHz
• Supports DSP instructions
• Nested vectored interrupt controller (NVIC)
• Asynchronous wake-up interrupt controller (AWIC)
• Debug and trace capability
• 2-pin serial wire debug (SWD)
• IEEE 1149.1 Joint Test Action Group (JTAG)
• IEEE 1149.7 compact JTAG (cJTAG)
MKW2xDxxx Data Sheet Data Sheet, Rev. 1, 11/2013.
Freescale Semiconductor, Inc.
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