19-1320; Rev 1; 3/98
UAL
IT MAN
TION K
A
ET
EVALU
TA SHE
WS DA
FOLLO
Low-Cost RF Up/Downconverter
with LNA and PA Driver
____________________________Features
o
Low-Cost Silicon Bipolar Design
o
Integrated Upconvert/Downconvert Function
o
Operates from Single +2.7V to +5.5V Supply
o
3.2dB Combined Receiver Noise Figure:
2.4dB (LNA)
9.8dB (Mixer)
o
Flexible Power-Amplifier Driver:
18dBm Output Third-Order Intercept (OIP3)
35dB Gain Control Range
o
LO Buffer for Low LO Drive Level
o
Low Power Consumption:
60mW Receive
90mW Full-Power Transmit
o
0.3µW Shutdown Mode
o
Flexible Power-Down Modes Compatible with
MAX2510/MAX2511 IF Transceivers
________________General Description
The MAX2410 performs the RF front-end transmit/receive
function in time-division-duplex (TDD) communication
systems. It operates over a wide frequency range and
is optimized for RF frequencies around 1.9GHz.
Applications include most popular cordless and PCS
standards.
The MAX2410 contains a low-noise amplifier (LNA), a
downconverter mixer, a local-oscillator (LO) buffer, an
upconverter mixer, and a variable-gain power-amplifier
(PA) driver in a low-cost, plastic surface-mount package.
The LNA has a 2.4dB (typical) noise figure and a
-10dBm input third-order intercept point (IP3). The down-
converter mixer has a low 9.8dB noise figure and a
3.3dBm IP3. Image and LO filtering are implemented off-
chip for maximum flexibility. The PA driver has 15dB of
gain, which can be reduced over a 35dB (typical) range.
Power consumption is only 60mW in receive mode or
90mW in transmit mode and drops to less than 0.3µW in
shutdown mode.
A similar part, the MAX2411A, features the same func-
tionality as the MAX2410 but offers a differential
bidirectional (transmit and receive) IF port. This allows
the use of a single IF filter for transmit (TX) and receive
(RX). For applications requiring a receive function only,
consult the data sheet for the MAX2406, a low-cost
downconverter with low-noise amplifier.
MAX2410
_______________Ordering Information
PART
MAX2410EEI
MAX2410E/D
TEMP. RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
28 QSOP
Dice*
*Dice
are specified at T
A
= +25°C, DC parameters only.
________________________Applications
PWT1900
DCS1800/PCS1900
PHS/PACS
DECT
ISM-Band Transceiver
Iridium Handsets
___________________Pin Configuration
TOP VIEW
GND 1
LNAIN 2
GND 3
28 GND
27 LNAOUT
26 GND
25 GND
24 RXMXIN
Functional Diagram
LNAOUT
RXMXIN
GND 4
V
CC
5
RXEN 6
LO 7
MAX2410
23 GND
22 IFIN
21 IFOUT
20 GND
19 TXMXOUT
18 GND
17 GND
16 PADRIN
15 GND
LNA
LNAIN
RXEN
TXEN
PADROUT
POWER
MANAGEMENT
RX MIXER
IFOUT
LO 8
TXEN 9
MAX2410
PA DRIVER
TX MIXER
LO
LO
V
CC
10
GC 11
GND 12
IFIN
PADROUT 13
GND 14
GC PADRIN
TXMXOUT
QSOP
________________________________________________________________
Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
Low-Cost RF Up/Downconverter
with LNA and PA Driver
MAX2410
ABSOLUTE MAXIMUM RATINGS
V
CC
to GND ..............................................................-0.3V to +6V
LNAIN Input Power.........................................................+15dBm
LO,
LO
Input Power........................................................+10dBm
PADRIN Input Power ......................................................+10dBm
RXMXIN Input Power ......................................................+10dBm
IFIN Input Power.............................................................+10dBm
RXEN, TXEN, GC Voltage...........................-0.3V to (V
CC
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
QSOP (derate 11mW/°C above +70°C) .......................909mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +165°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
CC
= 2.7V to 5.5V, V
GC
= 3.0V, RXEN = TXEN = 0.6V, IFOUT and PADROUT pulled up to V
CC
with 50Ω resistors, TXMXOUT pulled
up to V
CC
with 125Ω resistor, LNAOUT pulled up to V
CC
with 100Ω resistor, all other RF and IF inputs open, T
A
= -40°C to +85°C,
unless otherwise noted. Typical values are at T
A
= +25°C and V
CC
= 3.0V.)
PARAMETER
Supply Voltage Range
Digital Input Voltage High
Digital Input Voltage Low
RXEN Input Bias Current (Note 1)
TXEN Input Bias Current (Note 1)
GC Input Bias Current
Supply Current, Receive Mode
Supply Current, Transmit Mode
Supply Current, Standby Mode
Supply Current, Shutdown Mode
RXEN, TXEN pins
RXEN, TXEN pins
RXEN = 2V
TXEN = 2V
GC = 3V, TXEN = 2V
RXEN = 2V
TXEN = 2V
RXEN = 2V, TXEN = 2V
V
CC
= 3V
0.1
0.1
35
20
30
160
0.1
CONDITIONS
MIN
2.7
2.0
0.6
1
1
46
29.5
44.5
520
10
TYP
MAX
5.5
UNITS
V
V
V
µA
µA
µA
mA
mA
µA
µA
AC ELECTRICAL CHARACTERISTICS
(MAX2410 EV kit, V
CC
= 3.0V, V
GC
= 2.15V, RXEN = TXEN = low, f
LO
= 1.5GHz, P
LO
= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. T
A
= +25°C, unless otherwise noted.)
PARAMETER
LOW-NOISE AMPLIFIER
(RXEN = High)
Gain (Note 1)
Noise Figure
Input IP3
Output 1dB Compression
LO to LNAIN Leakage
RECEIVE MIXER
(RXEN = High)
Conversion Gain (Note 1)
Noise Figure
Input IP3
Input 1dB Compression
IFOUT Frequency
Minimum LO Drive Level
2
(Notes 1, 4)
(Note 5)
-17
T
A
= +25°C
T
A
= T
MIN
to T
MAX
Single sideband
(Note 3)
6.6
5.4
8.3
9.8
3.3
-8
450
9.8
10.8
dB
dB
dBm
dBm
MHz
dBm
RXEN = high or low
(Note 2)
T
A
= +25°C
T
A
= T
MIN
to T
MAX
14.2
12.6
16.2
2.4
-10
-5
-49
17.4
19.1
dB
dB
dBm
dBm
dBm
CONDITIONS
MIN
TYP
MAX
UNITS
_______________________________________________________________________________________
Low-Cost RF Up/Downconverter
with LNA and PA Driver
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2410 EV kit, V
CC
= 3.0V, V
GC
= 2.15V, RXEN = TXEN = low, f
LO
= 1.5GHz, P
LO
= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. T
A
= +25°C, unless otherwise noted.)
PARAMETER
TRANSMIT MIXER
(TXEN = high)
Conversion Gain (Note 1)
Output IP3
Output 1dB Compression Point
LO Leakage
Noise Figure
IFIN Frequency
Intermod Spurious Response
(Note 7)
Single sideband
(Notes 1, 4)
f
OUT
= 2LO-2IF = 2.2GHz
f
OUT
= 2LO-3IF = 1.8GHz
f
OUT
= 3LO-6IF = 2.1GHz
POWER AMPLIFIER DRIVER
(TXEN = high)
Gain (Note 1)
Output IP3
Output 1dB Compression Point
Gain-Control Range
Gain-Control Sensitivity
Input Relative VSWR Normalized to
Standby-Mode Impedance
Receiver Turn-On Time
Transmitter Turn-On Time
Note 1:
Note 2:
Note 3:
Note 4:
(Note 8)
Receive (TXEN = Low)
Transmit (RXEN = Low)
(Notes 1, 9)
(Notes 1, 10)
LOCAL OSCILLATOR INPUTS
(RXEN = TXEN = high)
1.10
1.02
0.5
0.3
2.5
2.5
µs
µs
T
A
= +25°C
T
A
= T
MIN
to T
MAX
(Note 3)
13
12.3
18
6.3
35
12
15
16.4
17
dB
dBm
dBm
dB
dB/V
-44
-74
-90
T
A
= +25°C
T
A
= T
MIN
to T
MAX
(Note 6)
8.6
7.3
-0.3
-11.4
-52
8.2
450
10
11.1
11.8
dB
dBm
dBm
dBm
dB
MHz
dBc
dBc
dBc
CONDITIONS
MIN
TYP
MAX
UNITS
MAX2410
POWER MANAGEMENT
(RXEN = TXEN = low)
Guaranteed by design and characterization.
Two tones at 1.9GHz and 1.901GHz at -32dBm per tone
Two tones at 1.9GHz and 1.901GHz at -22dBm per tone
Mixer operation guaranteed to this frequency. For optimum gain, adjust output match. See the
Typical Operating
Characteristics
for graphs of IFIN and IFOUT Impedance vs. IF Frequency.
Note 5:
At this LO drive level the mixer conversion gain is typically 1dB lower than with -10dBm LO drive.
Note 6:
Two tones at 400MHz and 401MHz at -32dBm per tone.
Note 7:
Transmit mixer output at -17dBm.
Note 8:
Calculated from measurements taken at V
GC
= 1.0V and V
GC
= 1.5V.
Note 9:
Time from RXEN = low to RXEN = high transition until the combined receive gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on LNAIN and LNAOUT.
Note 10:
Time from TXEN = low to TXEN = high transition until the combined transmit gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on PADRIN and PADROUT.
_______________________________________________________________________________________
3
Low-Cost RF Up/Downconverter
with LNA and PA Driver
MAX2410
__________________________________________Typical Operating Characteristics
(MAX2410 EV kit, V
CC
= 3.0V, V
GC
= 2.15V, RXEN = TXEN = low, f
LO
= 1.5GHz, P
LO
= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. T
A
= +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
TRANSMIT-MODE SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-01
RECEIVE-MODE SUPPLY CURRENT
vs. TEMPERATURE
RECEIVE-MODE SUPPLY CURRENT (mA)
RXEN = V
CC
V
CC
= 5.5V
MAX2410-02
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
SHUTDOWN SUPPLY CURRENT (µA)
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
V
CC
= 5.5V
V
CC
= 4.0V
V
CC
= 3.0V
V
CC
= 2.7V
-40
-15
10
35
60
85
RXEN = TXEN = GND
MAX2410-03
MAX2410-06
38
TRANSMIT-MODE SUPPLY CURRENT (mA)
36
TXEN = V
CC
V
CC
= 5.5V
24
23
22
21
20
19
18
17
0.10
34
V
CC
= 4.0V
32
30
28
V
CC
= 2.7V
26
-40
-15
10
35
60
85
TEMPERATURE (°C)
V
CC
= 3.0V
V
CC
= 4.0V
V
CC
= 3.0V
V
CC
= 2.7V
-40
-15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
STANDBY SUPPLY CURRENT
vs. TEMPERATURE
RXEN = TXEN = 2.0V
MAX2410-04
LNA INPUT IMPEDANCE
vs. FREQUENCY
120
IMAGINARY
REAL IMPEDANCE (Ω)
REAL IMPEDANCE (Ω)
RXEN = V
CC
80
60
40
REAL
20
0
-40
-80
-120
-160
-200
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
IMAGINARY IMPEDANCE (Ω)
100
0
200
MAX2410-05
LNA OUTPUT IMPEDANCE
vs. FREQUENCY
40
250
RXEN = V
CC
IMAGINARY IMPEDANCE (Ω)
-25
IMAGINARY
150
-50
0
500
STANDBY SUPPLY CURRENT (µA)
400
V
CC
= 5.5V
300
V
CC
= 4.0V
200
100
REAL
-75
100
V
CC
= 2.7V
0
-40
-15
10
V
CC
= 3.0V
50
-100
0
0
0.5
1.0
1.5
2.0
2.5
FREQUENCY (GHz)
35
60
85
-125
3.0
TEMPERATURE (°C)
LNA GAIN vs. FREQUENCY
1pF SHUNT CAPACITOR AT LNA INPUT
USING EV KIT MATCHING CIRCUIT (OPTIMIZED
FOR 1.9GHz)
RXEN = V
CC
LNA GAIN (dB)
LNA GAIN (dB)
20
15
10
5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
MAX2410-07
LNA GAIN vs. TEMPERATURE
MAX2410-08
LNA INPUT IP3 vs. TEMPERATURE
-6
-7
INPUT IP3 (dBm)
RXEN = V
CC
V
CC
= 3.0V
MAX2410-09
30
25
20
RXEN = V
CC
19
18
17
16
15
14
13
-40
-15
10
35
60
V
CC
= 2.7V
V
CC
= 3.0V
V
CC
= 5.5V
V
CC
= 4.0V
-5
-8
-9
-10
-11
-12
-13
-14
-15
V
CC
= 2.7V
V
CC
= 4.0V
V
CC
= 5.5V
85
-40
-20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
4
_______________________________________________________________________________________
Low-Cost RF Up/Downconverter
with LNA and PA Driver
_____________________________Typical Operating Characteristics (continued)
(MAX2410 EV kit, V
CC
= 3.0V, V
GC
= 2.15V, RXEN = TXEN = low, f
LO
= 1.5GHz, P
LO
= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. T
A
= +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
LNA NOISE FIGURE vs. FREQUENCY
MAX2410-10
MAX2410
LNA OUTPUT 1dB COMPRESSION POINT
vs. SUPPLY VOLTAGE
MAX2410-11
PA DRIVER INPUT IMPEDANCE
vs. FREQUENCY
160
TXEN = V
CC
140
REAL IMPEDANCE (Ω)
120
100
80
60
40
REAL
IMAGINARY
30
-10
-50
-90
-130
-170
-210
-250
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
IMAGINARY IMPEDANCE (Ω)
MAX2410-12
5.0
4.5
4.0
NOISE FIGURE (dB)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
100
480
860
1240
1620
RXEN = V
CC
0
OUTPUT 1dB COMPRESSION POINT (dBm)
RXEN = V
CC
-1
-2
-3
-4
-5
-6
70
20
0
2.7
3.2
3.7
4.2
4.7
5.2
SUPPLY VOLTAGE (V)
2000
FREQUENCY (MHz)
PA DRIVER OUTPUT IMPEDANCE
vs. FREQUENCY
200
TXEN = V
CC
175
REAL IMPEDANCE (Ω)
150
125
100
75
50
25
0
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
REAL
IMAGINARY
0
IMAGINARY IMPEDANCE (Ω)
-50
-100
-150
-200
-250
-300
-350
25
MAX2410-13
PA DRIVER GAIN vs. FREQUENCY
MAX2410-14
PA DRIVER GAIN AND OUTPUT IP3
vs. GAIN-CONTROL VOLTAGE
15
GAIN (dB) OR OUTPUT IP3 (dBm)
10
5
0
-5
-10
-15
-20
-25
GAIN
IP3
TXEN = V
CC
MAX2410-15
50
30
USING EV KIT MATCHING NETWORK
(OPTIMIZED FOR 1.9GHz)
TXEN = V
CC
20
20
GAIN (dB)
15
10
5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
-30
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
GAIN-CONTROL VOLTAGE (V)
PA DRIVER OUTPUT IP3
vs. TEMPERATURE
MAX2410-16
PA DRIVER GAIN vs. TEMPERATURE
MAX2410-17
PA DRIVER OUTPUT 1dB COMPRESSION
POINT vs. SUPPLY VOLTAGE
OUTPUT 1dB COMPRESSION POINT (dBm)
MAX2410-18
21
TXEN = V
CC
20
OUTPUT IP3 (dBm)
19
18
V
CC
= 4.0V
17
16
15
14
-40
-20
0
20
40
60
80
V
CC
= 3.0V
V
CC
= 2.7V
V
CC
= 5.5V
18
TXEN = V
CC
17
PA DRIVER GAIN (dB)
16
15
14
13
12
V
CC
= 2.7V
V
CC
= 5.5V
V
CC
= 4.0V
8
6
4
TXEN = V
CC
2
0
-2
V
GC
= 1.0V
-4
2.7
3.2
3.7
4.2
4.7
5.2
V
GC
= 2.15V
V
CC
= 3.0V
100
-40
-15
10
35
60
85
5.7
TEMPERATURE (°C)
TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
_______________________________________________________________________________________
5
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