Application Specification
Modular Jacks with Integral
Light Emitting Diode (LED)
NOTE
114–2154
26 AUG 03
Rev A
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 .
Figures and illustrations are for identification only and are not drawn to scale.
_
1. INTRODUCTION
This specification covers the requirements for application of modular jacks with integral LED. The jacks are
available in standard, inverted, and light pipe. The jacks are available shielded and unshielded with up to 8
ports. These jacks are designed for mounting onto a printed circuit (pc) board and panel.
When corresponding with personnel, use the terminology provided in this specification to facilitate your
inquiries for information. Basic terms and features of this product are provided in Figure 1.
Standard Modular Jack
Single Port
Panel
Ground Tab
Multiport (1 4 Shown)
LED Solder
Tines
PC Board
Ground Tab
Contact
Solder Tines
Boardlock
Multiport (1 8 Shown)
Inverted Modular Jack
Single Port
Panel
Ground Tab
Boardlock
LED Solder
Contact
PC Board
Tines
Solder Tines
Ground Tab
Light Pipe Modular Jack
Multiport (1 4 Shown)
Single Port
Panel
Ground Tab
Light Pipe
Boardlock
LED Solder
Tines
Figure 1
Note:
Note to Scale
Contact
Solder Tines
PC Board
Ground Tab
E
2003 Tyco Electronics Corporation, Harrisburg, PA
This controlled document is subject to change.
For latest revision, call the FAX/PRODUCT INFO number.
All International Rights Reserved
AMP and Tyco are trademarks. *Trademark
Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1–800–722–1111
FAX/PRODUCT INFO 1–800–522–6752
For Regional Customer Service, visit our website at
www.tycoelectronics.com
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LOC B
Modular Jacks with Integral LED
114–2154
Shielded modular jacks feature tin–lead plated brass shells which provide continuity for electromagnetic
compatibility (EMC).
When mated with corresponding shielded modular plugs, shielding and grounding continuity are achieved.
When the shield solder tines are soldered to the pc board, they provide electrical continuity to any ground path
on the pc board and, if applicable, panel ground tabs on the shield provide electrical continuity to any ground
path through the equipment panel.
2. REFERENCE MATERIAL
2.1. Revision Summary
Revisions to this application specification per EC 0990–1178–03 include:
S
S
S
S
S
S
Updated document to corporate requirements
Added titles to Figures 2 and 3
Added finished hole diameter for standard modular jack LED solder tine to Figure 4
Removed NOTE from Paragraph 3.5.B
Replaced temperature and exposure time in Paragraph 3.5.B with Figure 6
Added standard modular jack to Figure 10
2.2. Customer Assistance
Reference Product Base Part Number 406549 and Product Code 1977 are representative of modular jacks
with integral LED. Use of these numbers will identify the product line and expedite your inquiries through a
service network established to help you obtain product and tooling information. Such information can be
obtained through a local Representative (Field Service Engineer, Field Applications Engineer, etc.) or, after
purchase, by calling PRODUCT INFO at the number at the bottom of page 1.
2.3. Drawings
Customer Drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the Customer Drawings and this specification or with any other technical
documentation supplied, call PRODUCT INFO at the number at the bottom of page 1.
2.4. Manuals
Manual 402–40 can be used as a guide to soldering. This manual provides information on various flux types
and characteristics with the commercial designation and flux removal procedures. A checklist is included in the
manual as a guide for information on soldering problems.
2.5. Specifications
Product Specifications 108–1163–3 (light pipe modular jacks) and 108–1163–4 (inverted modular jacks) provide
product performance and test information.
2.6. Instructional Material
Instruction Sheets (408–series) provide product assembly instructions or tooling setup and operation
procedures and Customer Manuals (409–series) provide machine setup and operation procedures. There are
no documents that pertain to this product.
3. REQUIREMENTS
3.1. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the modular jack
housings.
B. Shelf Life
The modular jacks should remain in the shipping containers until ready for use to prevent damage. The
modular jacks should be used on a first in, first out basis to avoid storage contamination that could
adversely affect signal transmissions.
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Rev
A
Modular Jacks with Integral LED
C. Chemical Exposure
114–2154
Do not store modular jacks near any chemicals listed below as they may cause stress corrosion cracking
in the contacts.
Alkalies
Ammonia
Citrates
Phosphates Citrates
Sulfur Compounds
Amines
Carbonates
Nitrites
Sulfur Nitrites
Tartrates
3.2. LED Operating Requirements
The LED operating requirements for these modular jacks are given in Figures 2 and 3.
STANDARD AND INVERTED MODULAR JACKS
DESCRIPTION
CR PT ON
Wavelength At Peak Emission I
F
= 20 mA
Lens Type
Luminous Intensity—Minimum (I
F
= 10 mA)
Luminous Intensity—Maximum
Forward Voltage (Typ) I
F
= 20 mA
Forward Voltage (Max) I
F
= 20 mA
Reverse Voltage (V
R
)
Forward Current (I
F
) (1/10 Duty Cycle, 0.1 ms Pulse Width)
Forward Current (Peak)
Reverse Current V
R
= 5 V
Power Dissipation
Low Current Application:
Forward Voltage (Typ) I
F
= 2 mA
Forward Voltage (Max) I
F
= 2 mA
Forward Current (I
F
) (1/10 Duty Cycle, 0.1 ms Pulse Width)
Forward Current (Peak)
Power Dissipation
1.9
2.2
7
150
24
1.8
2.1
7
150
25
1.7
2.0
7
150
26
V
V
mA
mA
mW
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
_
C [77
_
F])
GREEN
565
Diffused
5
20
2.2
2.5
5
25
150
10
105
YELLOW
590
Diffused
3.2
12.5
2.1
2.5
5
30
150
10
105
ORANGE
610
Diffused
5
20
2.0
2.6
5
30
150
10
105
UNIT
nm
—
mcd
mcd
V
V
V
mA
mA
m
A
mW
Figure 2
LIGHT PIPE MODULAR JACK
DESCRIPTION
CR PT ON
Wavelength At Peak Emission I
F
= 20 mA
Lens Type
Luminous Intensity—Minimum (I
F
= 10 mA)
Luminous Intensity—Maximum
Forward Voltage (Typ) I
F
= 20 mA
Forward Voltage (Max.) I
F
= 20 mA
Reverse Voltage (V
R
)
Forward Current (I
F
) (1/10 Duty Cycle, f = 1.0 KHz
Forward Current (Peak)
Reverse Current V
R
= 5 V
Power Dissipation
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
_
C [77
_
F])
GREEN
565
Clear Tint
2.5
10
2.1
2.8
5
30
160
10
100
YELLOW
585
Clear Tint
2.5
10
2.0
2.8
5
30
160
10
85
UNIT
nm
—
mcd
mcd
V
V
V
mA
mA
m
A
mW
Figure 3
Rev
A
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Modular Jacks with Integral LED
3.3. PC Board
A. Material and Thickness
114–2154
The pc board material shall be glass epoxy (FR–4 or G–10). The pc board thickness shall be 1.57 [.062].
B. Hole Dimensions
Plated through holes must be used for contact and LED solder tines and, for shielded modular jacks,
shield solder tines. The drilled hole size, plating types, and plating thickness are dependent on the
application requirements. The finished hole size must be as stated to provide unrestricted insertion, proper
retention in the pc board, and to ensure adequate application of solder to the tines. See Figure 4.
C. Layout
The holes in the pc board must be precisely located to ensure proper placement and optimum
performance of the modular jack. The pc board layout must be designed using the dimensions provided on
the customer drawing for the specific modular jack.
Contact Solder Tine Hole
Finished Annular Ring Pad
(As Required)
PC Board
Trace Width
(As Required)
Finished Hole Diameter
(After Plating) SEE TABLE
Drilled Hole Diameter
(As Required)
Boardlock Hole
Drilled Hole Diameter
(Use No. 30 (3.25 [.128]) Drill Bit.
DO NOT Use 3.18 [.125 (
1
/
8
)] Drill Bit
FINISHED HOLE DIAMETER (After Plating)
LED SOLDER TINE
CONTACT
SOLDER TINE
0.89 [.035]
SHIELD
H L
SOLDER TINE
1.57 [.062]
Standard
Modular Jacks
1.19 [.047]
Light Pipe
Modular Jack
1.22 [.048]
Inverted
Modular Jack
0.89 [.035]
Figure 4
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Modular Jacks with Integral LED
3.4. Placement
CAUTION
114–2154
The modular jacks should be handled only by the housing to avoid deformation, contamination, or damage to the
solder tines.
A. Alignment
The modular jack number one position must be aligned with the number one position board hole. When
placing modular jacks on the pc board, the solder tines and boardlocks must be aligned with matching
holes before placing the jack onto the pc board. All solder tines and boardlocks must be started into the
holes, then gently pressed downward.
B. Seating
The modular jack shall be flush and evenly seated on the pc board.
3.5. Soldering
NOTE
A hold–down may be used to hold the modular jack in place during the soldering process.
A. Flux Selection
Solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will
depend on the type of pc board and other components mounted on the board. Additionally, the flux must
be compatible with the wave solder line, manufacturing, health, and safety requirements. Call PRODUCT
INFO at the number at the bottom of page 1 for consideration of other types of flux. Flux that is compatible
with these connectors are provided in Figure 5.
FLUX TYP
FLU TYPE
RMA
ACTIVITY
ACT TY
Mild
RESIDUE
R
U
Noncorrosive
COMMERCIAL DESIGNATION
KESTER
186
ALPHA
611
Figure 5
B. Process
The modular jacks can be soldered using wave soldering or equivalent soldering techniques. It is
recommended using SN60 or SN62 solder for these modular jacks. The temperature and exposure time
must be as specified in Figure 6.
Reflow Soldering Process Cycle
Peak Dwell
20 Seconds Max
230
_
C [446
_
F]
160
_
C [320
_
F]
110
_
C [230
_
F]
Ambient Rate
Ambient Rate
20
_
C [68
_
F]
Ramp–Up
30 Seconds
3
_
C [37.4
_
F]
Per Second
Equalization
100 Seconds
0.5
_
C [33
_
F]
Per Second
Reflow
45 Seconds
3
_
C [37.4
_
F]
Per Second
Cool–Down
More Than 3 Minutes
3
_
C [37.4
_
F]
Per Second
Pre–Heat
Figure 6
Soldering
Solidification
Rev
A
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