Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
The PLA140L also contains a built-in load current
limiting feature. This feature, combined with low
on-resistance and very high load current handling
capabilities, makes it suitable for a variety of high
performance switching applications.
Features
•
Current Limiting
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount Tape & Reel Version Available
•
Flammability Classification Rating of V-0
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
•
Automotive
Ordering Information
Part Number
PLA140L
PLA140LS
PLA140LSTR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
I
LOAD
10%
t
on
t
off
Pb
DS-PLA140L-R06
e
3
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
PLA140L
Ratings
400
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current (Continuous)
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Load Current Limit
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
F
=200mA
I
F
=350mA
V
L
=400V
P
I
L
I
LPK
-
-
-
-
-
-
-
-
240
-
-
0.4
0.9
-
-
-
-
-
10
3
-
-
-
-
65
-
0.7
1.2
-
3
200
350
±500
13
4
1
5
3
380
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
µA
R
ON
I
LEAK
t
on
t
off
I
CL
C
OUT
I
F
I
F
V
F
I
R
C
I/O
I
F
=5mA, V
L
=10V
I
F
=5mA, T
A
=25ºC
V
L
=50V, f=1MHz
I
L
=200mA
-
I
F
=5mA
V
R
=5V
-
ms
mA
pF
mA
mA
V
µA
pF
2
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
35
30
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
25
20
15
10
5
0
0.39
0.65
0.91
1.17
1.43
1.69
Turn-On Time (ms)
PLA140L
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=200mA
DC
)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=200mA
DC
)
Device Count (N)
0.18
0.30
0.42
0.54
0.66
0.78
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=200mA
DC
)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=200mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=200mA
DC
)
Device Count (N)
1.5
2.1
2.7
3.3
Device Count (N)
3.9
4.5
0.9
1.5
2.1
2.7
3.3
3.9
9.5
10.0
10.5
11.0
11.5
12.0
LED Current (mA)
LED Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
430
442
454
466
478
490
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=200mA
DC
)
Turn-Off Time (ms)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
0.5
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0
5
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=200mA
DC
)
10
15
20
25
30
35
40
45
50
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R06
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time
vs. Temperature
(I
L
=200mA
DC
)
0.7
0.6
Turn-Off Time (ms)
0.5
0.4
0.3
0.2
0.1
0
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
On-Resistance ( )
PLA140L
2.5
Turn-On Time (ms)
2.0
1.5
1.0
0.5
0
-40
-20
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=200mA
DC
)
I
F
=5mA
I
F
=10mA
I
F
=20mA
0
20
40
20
18
16
14
12
10
8
6
4
2
0
-40
-20
Typical On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=200mA
DC
)
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=200mA
DC
)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=200mA
DC
)
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
250
200
150
100
50
0
-50
-100
-150
-200
-250
-4.0 -3.0
Typical Load Current
vs. Load Voltage
(I
F
=5mA)
Load Current (mA)
LED Current (mA)
LED Current (mA)
-2.0
-1.0
0
1.0
2.0
3.0
4.0
Temperature (ºC)
Temperature (ºC)
Load Voltage (V)
Maximum Load Current
vs. Temperature
300
Load Current (mA)
250
200
150
100
50
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Blocking Voltage (V
P
)
485
480
Typical Blocking Voltage
vs. Temperature
0.12
0.10
Leakage ( A)
0.08
0.06
0.04
0.02
0
-40
-20
0
20
40
60
80
100
-40
Typical Leakage vs. Temperature
Measured across Pins 4&6
475
470
465
460
455
450
445
Temperature (ºC)
I
F
=20mA
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
80
100
Temperature (ºC)
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
1s
10s
100s
4
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Manufacturing Information
Moisture Sensitivity
PLA140L
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA140L / PLA140LS
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA140L / PLA140LS
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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