I
NTEGRATED
C
IRCUITS
D
IVISION
Characteristics
Parameter
Blocking Voltage
Load Current, T
A
=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case,
JC
2.45
1
1.25
0.3
A
DC
°C/W
1000V Single-Pole, Normally Open
DC-Only Power Relay
Description
CPC1788
Rating
1000
Units
V
P
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this new family, the CPC1788 single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500V
rms
of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500V
rms
isolation, but also very low junction-to-case
thermal resistance (0.3 °C/W).
Features
•
•
•
•
•
•
•
•
•
•
2.45A
DC
Load Current with 5°C/W Heat Sink
Low 1.25 On-Resistance
1000V
P
Blocking Voltage
2500V
rms
Input/Output Isolation
Low Thermal Resistance:
JC
= 0.3 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Transportation Equipment
•
Aerospace/Defense
Ordering Information
Part
CPC1788J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
I
F
90%
Approvals
•
UL 508 Certified Component: File E69938
Pin Configuration
1
+
2
-
3
-
4
+
I
LOAD
t
on
10%
t
off
e
3
DS-CPC1788-R06
www.ixysic.com
1
I
NTEGRATED
C
IRCUITS
D
IVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
Ratings
1000
5
100
1
150
2500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
DC
mW
V
rms
CPC1788
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
°C
°C
1.2 Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current
1
Peak
Continuous
Continuous
Continuous
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance, Input-to-Output
1
2
Conditions
Symbol
Minimum
Typical
Maximum
Units
t10ms
No Heat Sink
T
C
=25°C
T
C
=99°C
I
F
=10mA, I
L
=1A
V
L
=1000V
P
12
I
L
I
L(99)
R
ON
I
LEAK
t
on
t
off
C
out
I
F
I
F
V
F
I
R
-
-
-
-
-
-
0.6
0.9
-
-
1
-
2.85
0.11
640
-
-
1.2
-
1
-
-
1
10.3
1.2
1.25
1
20
5
-
10
-
1.4
10
-
A
P
A
DC
A
I
F
=20mA, V
L
=10V
V
L
=25V, f=1MHz
I
L
=1A
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
A
pF
C
I/O
Higher load currents possible with proper heat sinking.
Measurement taken within 1 second of on-time.
3
For applications requiring high temperature operation (T > 60ºC) an LED drive current of 20mA is recommended.
C
R06
www.ixysic.com
2
I
NTEGRATED
C
IRCUITS
D
IVISION
2 Thermal Characteristics
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
2.1 Thermal Management
Conditions
-
Free Air
-
Symbol
JC
JA
CPC1788
Rating
0.3
33
-40 to +100
Units
°C/W
°C/W
°C
T
J
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
θ
CA
=
(T
J
- T
A
) I
L(99)2
I
L
2
•
P
D(99)
-
θ
JC
T
J
= Junction Temperature (°C), T
J
≤
100°C *
T
A
= Ambient Temperature (°C)
I
L(99)
= Load Current
with
Case Temperature @ 99°C (A
DC
)
I
L
= Desired Operating Load Current (A
DC
), I
L
≤
I
L(MAX)
θ
JC
= Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
θ
CA
= Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D(99)
= Maximum power dissipation
with
case temperature held at 99ºC = 3.33W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE:
The exposed surface of the DCB substrate is not to
be
soldered.
3
www.ixysic.com
R06
I
NTEGRATED
C
IRCUITS
D
IVISION
3 Performance Data @ 25°C (Unless Otherwise Noted)
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA)
35
30
35
30
CPC1788
Typical Turn-On Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
Device Count (N)
25
20
15
10
5
0
1.30
1.31
1.32
1.33
1.34
LED Forward Voltage (V)
Device Count (N)
25
20
15
10
5
0
2.15
2.50
2.85
3.20
3.55
3.90
Turn-On (ms)
0.065
0.080
0.095
0.110
0.125
0.140
Turn-Off (ms)
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
0.900
0.925
0.950
0.975
1.000
1.025
On-Resistance (Ω)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
12
11
10
9
8
7
6
5
4
3
2
1
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=250mA
DC
)
0.145
0.140
0.135
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=250mA
DC
)
Turn-On (ms)
Turn-On (ms)
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
0.130
0.125
0.120
0.115
0.110
0.105
0.100
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
1.4
I
F
=50mA
1.2
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
I
F
=20mA
I
F
=10mA
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=250mA
DC
)
7
6
Turn-On (ms)
5
4
3
2
1
Typical Turn-On Time vs. Temperature
(I
L
=250mA
DC
)
0.24
Typical Turn-Off Time vs. Temperature
(I
L
=250mA
DC
)
I
F
=10mA
Turn-Off (ms)
0.21
0.18
0.15
0.12
0.09
0.06
0.03
LED Current (mA)
I
F
=20mA
I
F
=20mA
I
F
=10mA
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
R06
www.ixysic.com
4
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC1788
1.8
1.6
On-Resistance (Ω)
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=250mA
DC
)
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
1.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=Max Rated)
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0
0.1
Typical Load Current
vs. Load Voltage
(I
F
=10mA)
On-Resistance (Ω)
-40
-20
0
20
40
60
80
100
0.2
0.3
0.4
0.5
0.6
Temperature (ºC)
Load Voltage (V)
Maximum Load Current
vs. Temperature
(With Heat Sink)
6
Blocking Voltage vs. Temperature
1160
Blocking Voltage (V
P
)
0.7
0.6
Leakage (μA)
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(V
L
=1000V
P
)
Load Current (A
DC
)
5
4
3
2
1
0
1ºC/W
1140
1120
1100
1080
1060
1040
1020
1000
-40
-20
0
20
40
60
80
100
0.5
0.4
0.3
0.2
0.1
0
-40
-20
0
20
40
60
80
100
5ºC/W
10ºC/W
Free Air
0
20
40
60
Temperature (ºC)
80
100
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
Free Air, No Heat Sink
15.0
13.5
12.0
10.5
9.0
7.5
6.0
4.5
3.0
1.5
0
10µs 100µs 1ms 10ms 100ms
Time
Load Current (A)
1s
10s
100s
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
www.ixysic.com
R06
电子竞赛
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
