(1-Form-A) relay. This high performance, optically
isolated Solid State Relay provides one of the fastest
(0.125ms) switching times available along with a very
low off-state leakage current of 25nA.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Fast Switching Times: 0.125ms
Low Off-State Leakage Current: 25nA
3750V
rms
Input/Output Isolation
100% Solid State
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Small 6-Pin Package
Machine Insertable, Wave Solderable
Tape & Reel Version Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate # 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part Number
OMA160
OMA160S
OMA160STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Pin Configuration
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment - Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
+ Control
– Control
Do Not Use
AC/DC Configuration
1
6
2
3
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics
of Normally Open Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
Pb
DS-OMA160-R11
e
3
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1
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NTEGRATED
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
OMA160
Ratings
250
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
AC/DC Configuration
DC Configuration
Peak
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
L
=50mA
I
L
=80mA
V
L
=250V
P
I
F
=10mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=50mA
-
I
F
=10mA
V
R
=5V
-
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
50
15
-
50
80
±100
100
30
25
mA
rms
/ mA
DC
mA
DC
mA
P
nA
-
-
-
-
-
0.4
0.9
-
-
-
5
-
-
1.2
-
3
0.125
-
10
-
1.4
10
-
ms
pF
mA
mA
V
A
pF
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
30
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
OMA160
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA)
30
25
20
15
10
5
0
0.05
Typical Turn-On Time
(N=50, I
F
=10mA, I
L
=50mA
DC
)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=10mA, I
L
=50mA
DC
)
Device Count (N)
0.07
0.09
0.11
0.13
0.15
0.012
0.017
0.022
0.027
0.032
0.037
Turn-On Time (ms)
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=50mA
DC
)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=50mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=50mA
DC
)
Device Count (N)
1.625
2.075
2.525
2.975
3.425
3.875
Device Count (N)
1.625
2.075
2.525
2.975
3.425
3.875
42.5
43.5
44.5
45.5
46.5
47.5
LED Current (mA)
LED Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
367.5
374.5
381.5
388.5
395.5
402.5
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
0.18
0.16
Turn-On Time (ms)
0.12
0.10
0.08
0.06
0.04
0.02
0
0
5
0.14
Typical Turn-On Time
vs. LED Forward Current
(I
L
=50mA
DC
)
0.040
Turn-Off Time (ms)
0.035
0.030
0.025
0.020
0.015
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=50mA
DC
)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R11
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(I
L
=50mA
DC
)
Typical Turn-Off Time
vs. Temperature
(I
F
=10mA, I
L
=50mA
DC
)
OMA160
1.50
1.25
Turn-On Time (ms)
1.00
0.75
0.50
0.25
0
-40
-20
I
F
=10mA
I
F
=20mA
0
20
40
60
80
100
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-40
70
60
On-Resistance ( )
50
40
30
20
10
0
Typical On-Resistance vs. Temperature
(I
F
=5mA, I
L
=50mA
DC
)
Turn-Off Time (ms)
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=50mA
DC
)
Typical I
F
for Switch Dropout
vs. Temperature
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
50
40
30
20
10
0
-10
-20
-30
-40
-50
Typical Load Current vs. Load Voltage
(I
F
=10mA)
Load Current (mA)
LED Current (mA)
LED Current (mA)
-20
0
20
40
60
80
100
-3
-2
-1
0
1
2
3
Temperature (ºC)
Load Voltage (V)
Maximum Load Current
vs. Temperature
100
90
80
70
60
50
40
30
20
10
0
-40
-20
0
20
40
60
80
Temperature (ºC)
400
Blocking Voltage (V
P
)
395
Typical Blocking Voltage
vs. Temperature
0.014
0.012
Leakage ( A)
0.010
0.008
0.006
0.004
0.002
-40
-20
0
20
40
60
80
100
0
-40
Typical Leakage vs. Temperature
Measured Across Pins 4&6
Load Current (mA)
390
385
380
375
370
365
I
F
=30mA
I
F
=20mA
I
F
=10mA
100
120
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
0.45
0.40
Load Current (A)
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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IVISION
Manufacturing Information
Moisture Sensitivity
OMA160
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
OMA160 / OMA160S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
OMA160 / OMA160S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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