MAX44284HAWT+放大器基础信息:
MAX44284HAWT+是一款OPERATIONAL AMPLIFIER。常用的包装方式为VFBGA,
MAX44284HAWT+放大器核心信息:
MAX44284HAWT+的最低工作温度是-40 °C,最高工作温度是125 °C。其峰值回流温度为260他的最大平均偏置电流为0.08 µA
MAX44284HAWT+的标称供电电压为3.3 V。而其供电电压上限为6 VMAX44284HAWT+的输入失调电压为28 µV(输入失调电压:使运算放大器输出端为0V(或接近0V)所需加于两输入端之间的补偿电压。)
MAX44284HAWT+的相关尺寸:
MAX44284HAWT+的宽度为:0.845 mm,长度为1.245 mmMAX44284HAWT+拥有6个端子.其端子位置类型为:BOTTOM。端子节距为0.4 mm。
MAX44284HAWT+放大器其他信息:
其温度等级为:AUTOMOTIVE。MAX44284HAWT+不符合Rohs认证。其对应的的JESD-30代码为:R-PBGA-B6。MAX44284HAWT+的封装代码是:VFBGA。MAX44284HAWT+封装的材料多为PLASTIC/EPOXY。
而其封装形状为RECTANGULAR。MAX44284HAWT+封装引脚的形式有:GRID ARRAY, VERY THIN PROFILE, FINE PITCH。其端子形式有:BALL。座面最大高度为0.69 mm。

MAX44284HAWT+放大器基础信息:
MAX44284HAWT+是一款OPERATIONAL AMPLIFIER。常用的包装方式为VFBGA,
MAX44284HAWT+放大器核心信息:
MAX44284HAWT+的最低工作温度是-40 °C,最高工作温度是125 °C。其峰值回流温度为260他的最大平均偏置电流为0.08 µA
MAX44284HAWT+的标称供电电压为3.3 V。而其供电电压上限为6 VMAX44284HAWT+的输入失调电压为28 µV(输入失调电压:使运算放大器输出端为0V(或接近0V)所需加于两输入端之间的补偿电压。)
MAX44284HAWT+的相关尺寸:
MAX44284HAWT+的宽度为:0.845 mm,长度为1.245 mmMAX44284HAWT+拥有6个端子.其端子位置类型为:BOTTOM。端子节距为0.4 mm。
MAX44284HAWT+放大器其他信息:
其温度等级为:AUTOMOTIVE。MAX44284HAWT+不符合Rohs认证。其对应的的JESD-30代码为:R-PBGA-B6。MAX44284HAWT+的封装代码是:VFBGA。MAX44284HAWT+封装的材料多为PLASTIC/EPOXY。
而其封装形状为RECTANGULAR。MAX44284HAWT+封装引脚的形式有:GRID ARRAY, VERY THIN PROFILE, FINE PITCH。其端子形式有:BALL。座面最大高度为0.69 mm。
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 包装说明 | VFBGA, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.08 µA |
| 标称共模抑制比 | 145 dB |
| 最大输入失调电压 | 28 µV |
| JESD-30 代码 | R-PBGA-B6 |
| 长度 | 1.245 mm |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) | 260 |
| 座面最大高度 | 0.69 mm |
| 供电电压上限 | 6 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | BALL |
| 端子节距 | 0.4 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 0.845 mm |
| Base Number Matches | 1 |

| MAX44284HAWT+ | MAX44284EAWT+ | MAX44284FAUT+ | MAX44284WAWT+ | MAX44284HAUT+ | MAX44284EAUT+ | MAX44284FAWT+ | MAX44284WAUT+ | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Operational Amplifier, 1 Func, 28uV Offset-Max, PBGA6, WLP-6 | Operational Amplifier, 1 Func, 46uV Offset-Max, PBGA6, WLP-6 | Operational Amplifier, 1 Func, 28uV Offset-Max, PDSO6, SOT-23, 6 PIN | Operational Amplifier, 1 Func, 38uV Offset-Max, PBGA6, WLP-6 | Operational Amplifier, 1 Func, 28uV Offset-Max, PDSO6, SOT-23, 6 PIN | Operational Amplifier, 1 Func, 46uV Offset-Max, PDSO6, SOT-23, 6 PIN | Operational Amplifier, 1 Func, 28uV Offset-Max, PBGA6, WLP-6 | Operational Amplifier, 1 Func, 38uV Offset-Max, PDSO6, SOT-23, 6 PIN |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 包装说明 | VFBGA, | VFBGA, | LSSOP, | VFBGA, | LSSOP, | LSSOP, | VFBGA, | LSSOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.08 µA | 0.08 µA | 0.08 µA | 0.08 µA | 0.08 µA | 0.08 µA | 0.08 µA | 0.08 µA |
| 标称共模抑制比 | 145 dB | 145 dB | 145 dB | 145 dB | 145 dB | 145 dB | 145 dB | 145 dB |
| 最大输入失调电压 | 28 µV | 46 µV | 28 µV | 38 µV | 28 µV | 46 µV | 28 µV | 38 µV |
| JESD-30 代码 | R-PBGA-B6 | R-PBGA-B6 | R-PDSO-G6 | R-PBGA-B6 | R-PDSO-G6 | R-PDSO-G6 | R-PBGA-B6 | R-PDSO-G6 |
| 长度 | 1.245 mm | 1.245 mm | 2.9 mm | 1.245 mm | 2.9 mm | 2.9 mm | 1.245 mm | 2.9 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | VFBGA | LSSOP | VFBGA | LSSOP | LSSOP | VFBGA | LSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 座面最大高度 | 0.69 mm | 0.69 mm | 1.45 mm | 0.69 mm | 1.45 mm | 1.45 mm | 0.69 mm | 1.45 mm |
| 供电电压上限 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | BALL | BALL | GULL WING | BALL | GULL WING | GULL WING | BALL | GULL WING |
| 端子节距 | 0.4 mm | 0.4 mm | 0.95 mm | 0.4 mm | 0.95 mm | 0.95 mm | 0.4 mm | 0.95 mm |
| 端子位置 | BOTTOM | BOTTOM | DUAL | BOTTOM | DUAL | DUAL | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 0.845 mm | 0.845 mm | 1.625 mm | 0.845 mm | 1.625 mm | 1.625 mm | 0.845 mm | 1.625 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Factory Lead Time | 6 weeks | 12 weeks | 6 weeks | 12 weeks | 6 weeks | 12 weeks | 12 weeks | - |
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