5082-0012
PIN Diode Chip for Hybrid MIC Switches/Attenuators
Data Sheet
Description
This PIN diode chip is silicon dioxide or nitride passi-
vated. The 5082-0012 has a planar construction. The
fabrication processes are optimized for long term
reliability and tightly controlled for uniformity in
electrical performance.
Features
• Low Series Resistance: 1.0
Ω
Typical
Applications
This general purpose PIN diode is intended for low
power switching applications such as duplexers,
antenna switching matrices, digital phase shifters, time
multiplex filters, TR switches, pulse and amplitude
modulators, limiters, leveling circuits, and attenuators.
Outline
D
DIMENSIONS
D
±0.03 (1)
X
X
±0.05 (2)
Y
±0.03 (1)
X
Top Contact
Bottom Contact
Y
0.10
(4)
0.38
(15)
0.23
(9.0)
Au. Cathode
Au. Anode
Maximum Ratings
Junction Operating and Storage
Temperature Range ............................. -65°C to +150°C
Soldering Temperature .......... +425°C for 1 min. max.
Dimensions in millimeters
(1/1000 inch)
Electrical Specifications at T
A
= 25°C
Chip
Part
Number
5082-
0012
Nearest
Equivalent
Packaged
Part No.
5082-
3001
Minimum
Breakdown
Voltage
V
BR
(V)
150
V
R
= V
BR
Measure
I
R
≤
10 mA
Maximum
Junction
Capacitance
C
j
(pF)
0.12
V
R
= 50 V
f = 1 MHz
Typical Parameters
Typical
Series
Resistance
R
S
(Ω)
Ω
1.0
I
F
= 100 mA
f = 100 MHz
Typical
Reverse
Recovery
Time
t
rr
(ns)
100
I
F
= 20 mA
V
R
= 10 V
90% Recovery
Typical
Lifetime
τ
(ns)
400
I
F
= 50 mA
I
R
= 250 mA
Test
Conditions
Assembly and Handling Procedures for
PIN Chips
1. Storage
Devices should be stored in a dry nitrogen purged
dessicator or equivalent.
2. Cleaning
If required, surface contamination may be removed
with electronic grade solvents. Typical solvents, such
as freon (T.F. or T.M.C.), acetone, deionized water, and
methanol, or their locally approved equivalents, can be
used singularly or in combinations. Typical cleaning
times per solvent are one to three minutes. DI water
and methanol should be used (in that order) in the final
cleans. Final drying can be accomplished by placing
the cleaned dice on clean filter paper and drying with
an infrared lamp for 5-10 minutes. Acids such as
hydrofluoric (HF), nitric (HNO
3
) and hydrochloric
(HCl) should not be used.
The effects of cleaning methods/solutions should be
verified on small samples prior to submitting the
entire lot.
Following cleaning, dice should be either used in
assembly (typically within a few hours) or stored in
clean containers in a reducing atmosphere or a vacu-
um chamber.
3. Die Attach
a. Eutectic
AuSn preform with stage temperature of 310°C for one
minute max. AuGe preform with stage temperature of
390°C for one minute max.
b. Epoxy
For epoxy die-attach, conductive silver-filled or gold-
filled epoxies are recommended. This method can be
used for all Avago PIN chips.
4. Wire Bonding
Either ultrasonic or thermocompression bonding tech-
niques can be employed. Suggested wire is pure gold,
0.7 to 1.5 mil diameter.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte.
in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
Obsoletes 5965-8880E
5989-4778EN February 23, 2006
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