HSSR-7110, HSSR-7111, HSSR-7112,
HSSR-711E, 5962-9314001, 5962-9314002
1
90V/1.0Ω, Hermetically Sealed, Power MOSFET
Optocoupler
Data Sheet
Description
The Broadcom® HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E
and SMD 5962-9314001, 5962-9314002 are single-channel
power MOSFET optocouplers, constructed in eight-pin,
hermetic, dual-in-line, ceramic packages. The devices operate
exactly like a solid-state relay.
The products are capable of operation and storage over the full
military temperature range and can be purchased as a
commercial product (HSSR-7110), with full MIL-PRF-38534
Class H testing (HSSR-7111 and HSSR- 7112), with
MIL-PRF-38534 Class E testing (Class K with exceptions)
(HSSR-711E) or from the DLA Standard Microcircuit Drawing
(SMD) 5962-93140. Details of the Class E program exceptions
are listed here:
1.
2.
Nondestructive Bond Pull, Test method 2023 of
MIL-STD-883 in device screening is not required.
Particle Impact Noise Detection (PIND), Test method 2020
of MIL-STD-883 in device screening and group C testing is
not required.
Die Shear Strength, Test method 2019 of MIL-STD-883 in
group B testing is not required.
Internal Water Vapor Content, Test method 1018 of
MIL-STD-883 in group C testing is not required.
Scanning Electron Microscope (SEM) inspections, Test
method 2018 of MIL-STD-883 in element evaluation is not
required.
Features
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
ac/dc signal and power switching
Compact solid-state bidirectional switch
Manufactured and tested on a MIL-PRF-38534 certified line
QML-38534,
Class H and Class E
Hermetically sealed 8-pin, dual-in-line package
Small size and weight
Performance guaranteed over –55°C to +125°C
Connection A 0.8A, 1.0Ω
Connection B 1.6A, 0.25Ω
1500 Vdc withstand test voltage
High transient immunity
5 Amp output surge current
Applications
3.
4.
5.
Military and space
High reliability systems
Standard 28 Vdc and 48 Vdc load driver
Standard 24 Vac load driver
Aircraft controls
ac/dc electromechanical and solid-state relay replacement
I/O modules
Harsh industrial environments
CAUTION
1.
See
Selection Guide – Lead Configuration Options
for available
extensions.
Broadcom
-1-
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation that may be induced by ESD.
HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002
Data Sheet
Functional Diagrams
Functional Diagrams
CONNECTION A
AC/DC CONNECTION
I
O
1 NC
I
F
+ 2
V
F
- 3
4 NC
6
5
7
V
O
-
V
F
- 3
4 NC
TRUTH TABLE
INPUT
H
L
OUTPUT
CLOSED
OPEN
CONNECTION B
DC CONNECTION
I
O
1 NC
I
F
+ 2
7
6
5
8
+
V
O
-
8
+
The devices feature logic level input control and very low
output on-resistance, making them suitable for both ac and dc
loads. Connection A, as shown in the
Functional Diagrams,
allows the device to switch either ac or dc loads. Connection B,
with the polarity and pin configuration as shown, allows the
device to switch dc loads only. The advantage of Connection B
is that the on-resistance is significantly reduced, and the
output current capability increases by a factor of two.
The devices are convenient replacements for mechanical and
solid-state relays where high component reliability with
standard footprint lead configuration is desirable. Devices may
be purchased with a variety of lead bend and plating options.
See
Selection Guide – Lead Configuration Options
table for
details. Standard microcircuit drawing (SMD) parts are available
for each package and lead style.
The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, and SMD
5962-9314001, 5962-9314002 are designed to switch loads on
28 Vdc power systems. They meet 80V surge and ±600V spike
requirements.
CAUTION
Maximum Switching Frequency – Care should be
taken during repetitive switching of loads so as
not to exceed the maximum output current,
maximum output power dissipation, maximum
case temperature, and maximum junction
temperature.
All devices are manufactured and tested on a MIL-PRF-38534
certified line, and Class H and Class E devices are included in
the DLA Qualified Manufacturers List, QML-38534 for Hybrid
Microcircuits. Each device contains an AlGaAs light-emitting
diode optically coupled to a photovoltaic diode stack, which
drives two discrete power MOSFETs. The device operates as a
solid-state replacement for single-pole, normally open (1 Form
A) relay used for general-purpose switching of signals and
loads in high reliability applications.
Selection Guide – Lead Configuration Options
Avago Technologies Part Number and Options
Commercial
HSSR-7110
MIL-PRF-38534 Class H
HSSR-7111
MIL-PRF-38534 Class E
Gold Plate
Standard Lead Finish
a
Solder Dipped
b
Butt Joint/Gold Plate
a
Gull Wing/Soldered
b
Crew Cut/Gold Plate
a
SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Joint/Gold Plate
a
Butt Joint/Soldered
b
Gull Wing/Soldered
b
Crew Cut/Gold Plate
a
Crew Cut/Soldered
b
a.
b.
Solder lead finish: Sn63/Pb37.
Broadcom
-2-
HSSR-7112
Gold Plate
Option -200
Option -100
Option -300
Option -600
5962-
9314002HPC
9314002HPA
9314002HYC
9314002HYA
9314002HXA
9314002HZC
9314002HZA
9314001EXA
5962-
9314001EPC
9314001EPA
Option -300
HSSR-711E
Gold Plate
Option -200
Option #200
Option #100
Option #300
Option #600
5962-
9314001HPC
9314001HPA
9314001HYC
9314001HYA
9314001HXA
9314001HZC
9314001HZA
Gold Plate lead finish: Maximum gold thickness of leads is <100 μin. Typical is 60 μin to 90 μin.
HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002
Data Sheet
Outline Drawing
Outline Drawing
8-Pin DIP Through Hole
10.03 (0.395)
10.29 (0.405)
1.02 (0.040)
1.52 (0.060)
4.32 (0.170 )
MAX.
0.51 (0.020)
MIN.
8.13 (0.320)
MAX.
7.16 (0.282 )
7.57 (0.298 )
Device Marking
AVAGO
DESIGNATOR
AVAGO P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
[1]
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
QML PARTS ONLY
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX
(IF NEEDED)
COUNTRY OF MFR.
AVAGO CAGE CODE
[1]
Thermal Resistance
3.81 (0.150 )
MIN.
0.20 (0.008 )
0.33 (0.013 )
Maximum Output MOSFET Junction to Case –
θJC
= 15°C/W
2.29 (0.090)
2.79 (0.110)
0.51 (0.020 )
MAX.
7.36 (0.290)
7.87 (0.310)
ESD Classification
MIL-STD-883, Method 3015
, Class 2
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Hermetic Optocoupler Options
Note: Dimensions in millimeters (inches).
Option
100
Description
Surface-mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial,
Class H and E product.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on Commercial, Class H and E product. DLA Drawing
(SMD) part numbers contain provisions for lead finish.
Surface-mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on Commercial,
Class H and E product. This option has solder dipped leads.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
1.07 (0.042)
1.31 (0.052)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5˚ MAX.
600
Surface-mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial,
Class H and E product.
3.81 (0.150)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
0.20 (0.008)
0.33 (0.013)
1.02 (0.040)
TYP.
7.36 (0.290)
7.87 (0.310)
Broadcom
-3-
HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002
Data Sheet
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Storage Temperature Range
Operating Ambient Temperature
Junction Temperature
Operating Case Temperature
a
Lead Solder Temperature
Average Input Current
Peak Repetitive Input Current
(Pulse Width < 100 ms; duty cycle < 50%)
Peak Surge Input Current
(Pulse Width < 0.2 ms; duty cycle < 0.1%)
Reverse Input Voltage
Average Output Current (See
Figure 2.)
Connection A
Connection B
Single Shot Output Current (See
Figure 3.)
Connection A (Pulse width < 10 ms)
Connection B (Pulse width < 10 ms)
Output Voltage
Connection A
Connection B
Average Output Power Dissipation
b
(See
Figure 4.)
a.
b.
Symbol
T
S
T
A
T
J
T
C
I
F
I
FPK
I
FPK surge
V
R
I
O
Min
–65
–55
—
—
—
—
—
—
—
—
—
Max
+150
+125
+150
+145
260 for 10 s
20
40
100
5
0.8
1.6
5.0
10.0
90
90
800
Unit
°C
°C
°C
°C
°C
mA
mA
mA
V
A
A
A
A
V
V
mW
I
OPK surge
—
—
V
O
–90
0
—
Maximum junction to case thermal resistance for the device is 15°C/W, where case temperature, T
C
, is measured at the center of the package bottom.
For rating, see
Figure 4.
The output power P
O
rating curve is obtained when the part is handling the maximum average output current I
O
as shown in
Figure 2.
Recommended Operating Conditions
Parameter
Input Current (on)
a
Input Current (on)
b
Input Voltage (off )
Operating Temperature
a.
b.
Applies to HSSR-7112 and 5962-9314002Hxx devices only.
Applies to HSSR-7110, HSSR-7111, HSSR-711E, 5962-9314001Hxx, and 5962-9314001Exx devices only.
Symbol
I
F(ON)
I
F(ON)
V
F(OFF)
T
A
Min
5
10
0
–55
Max
20
20
0.6
+125
Unit
mA
mA
V
°C
Broadcom
-4-
HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002
Data Sheet
Electrical Specifications
Electrical Specifications
T
A
= –55°C to +125°C, unless otherwise specified.
Parameter
Output Withstand Voltage
Output On-Resistance
Connection A
Symbol
|V
O(OFF)
|
R
(ON)
Group A
Subgroup
a
1, 2, 3
1, 2, 3
Test Conditions
V
F
= 0.6V, I
O
= 10 μA
I
F
= 10 mA, I
O
= 800 mA,
(pulse duration ≤ 30 ms)
I
F
= 5 mA, I
O
= 800 mA,
(pulse duration ≤ 30 ms)
Output On-Resistance
Connection B
R
(ON)
1, 2, 3
I
F
= 10 mA, I
O
= 1.6A,
(pulse duration ≤ 30 ms)
I
F
= 5 mA, I
O
= 1.6A,
(pulse duration ≤ 30 ms)
Output Leakage Current
Input Forward Voltage
I
O(OFF)
V
F
1, 2, 3
1, 2, 3
V
F
= 0.6V, V
O
= 90V
I
F
= 10 mA
I
F
= 5 mA
Input Reverse Breakdown
Voltage
Input-Output Insulation
Turn On Time
V
R
I
I-O
t
ON
1, 2, 3
1
9, 10, 11
I
R
= 100 μA
RH ≤ 65%, t = 5s,
V
I-O
= 1500 Vdc, T
A
= 25°C
I
F
= 10 mA, V
DD
= 28V,
I
O
= 800 mA
I
F
= 5 mA, V
DD
= 28V, I
O
= 800 mA
Turn Off Time
t
OFF
9, 10, 11
I
F
= 10 mA, V
DD
= 28V,
I
O
= 800 mA
I
F
= 5 mA, V
DD
= 28V, I
O
= 800 mA
Output Transient Rejection
dVo
---------
-
dt
dVio
----------
-
dt
9
V
PEAK
= 50V, C
M
= 1000 pF,
C
L
= 15 pF, R
M
≥ 1 MΩ
9
V
DD
= 5V, V
I-O(PEAK)
= 50V,
R
L
= 20 kΩ, C
L
= 15 pF
500
—
—
V/μs
18
Min
90
—
—
—
—
—
1.0
—
5.0
—
—
—
—
—
1000
Typ
110
0.40
—
0.12
—
10
-4
1.24
—
—
—
1.25
—
0.02
—
—
Max
—
1.0
1.0
0.25
0.25
10
1.7
—
—
1.0
6.0
6.0
0.25
0.25
—
V/μs
17
ms
1, 10,
14, 15
V
μA
ms
1, 10,
11, 12,
13
e, f
Unit
V
Ω
Figure Note
5
6, 7
b, c
b, d
Ω
6, 7
b, c
b, d
μA
V
8
9
c
d
c
d
c
d
Input-Output Transient
Rejection
a.
b.
c.
d.
e.
f.
Commercial parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD, Class H, and Class E parts receive 100% testing at 25°C, 125°C, and –55°C
(subgroups 1 and 9, 2 and 10, 3 and 11, respectively).
During the pulsed R
ON
measurement (I
O
duration <30 ms), ambient (T
A
) and case temperature (T
C
) are equal.
Applies to HSSR-7110, HSSR-7111, HSSR-711E, 5962-9314001Hxx and 5962-9314001Exx devices only.
Applies to HSSR-7112 and 5962-9314002Hxx devices only.
Device considered a two-terminal device: pins 1 through 4 shorted together and pins 5 through 8 shorted together.
This is a momentary withstand test, not an operating condition.
Broadcom
-5-
FPGA/CPLD
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