10-Bit Addressable Scan Ports Multidrop-Addressable IEEE 1149.1 24-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-GDIP-T24 |
| 长度 | 32.005 mm |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| 5962-9681201QLA | 5962-9681201QKA | 5962-9681201Q3A | SNJ54ABT8996FK | SN54ABT8996FK | SNJ54ABT8996JT | SN54ABT8996JT | SNJ54ABT8996W | SN54ABT8996W | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 10-Bit Addressable Scan Ports Multidrop-Addressable IEEE 1149.1 24-CDIP -55 to 125 | 10-Bit Addressable Scan Ports Multidrop-Addressable IEEE 1149.1 24-CFP -55 to 125 | 10-Bit Addressable Scan Ports Multidrop-Addressable IEEE 1149.1 28-LCCC -55 to 125 | 10-Bit Addressable Scan Ports Multidrop-Addressable IEEE 1149.1 28-LCCC -55 to 125 | SPECIALTY MICROPROCESSOR CIRCUIT, CQCC28, CERAMIC, LCC-28 | 10-Bit Addressable Scan Ports Multidrop-Addressable IEEE 1149.1 24-CDIP -55 to 125 | SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24 | 10-Bit Addressable Scan Ports Multidrop-Addressable IEEE 1149.1 24-CFP -55 to 125 | 10-Bit Addressable Scan Ports Multidrop-Addressable IEEE 1149.1 24-CFP |
| 零件包装代码 | DIP | DFP | QLCC | QLCC | QLCC | DIP | DIP | DFP | DFP |
| 包装说明 | DIP, DIP24,.3 | DFP, FL24,.4 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DFP, FL24,.35 | DFP, |
| 针数 | 24 | 24 | 28 | 28 | 28 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | unknown |
| JESD-30 代码 | R-GDIP-T24 | R-GDFP-F24 | S-CQCC-N28 | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | R-GDFP-F24 | R-GDFP-F24 |
| 长度 | 32.005 mm | 14.355 mm | 11.43 mm | 11.43 mm | 11.43 mm | 32.005 mm | 32.005 mm | 14.355 mm | 14.355 mm |
| 端子数量 | 24 | 24 | 28 | 28 | 28 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DFP | QCCN | QCCN | QCCN | DIP | DIP | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.29 mm | 2.03 mm | 2.03 mm | 2.03 mm | 5.08 mm | 5.08 mm | 2.29 mm | 2.29 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | NO | NO | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 9.085 mm | 11.43 mm | 11.43 mm | 11.43 mm | 7.62 mm | 7.62 mm | 9.085 mm | 9.085 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | - | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 封装等效代码 | DIP24,.3 | FL24,.4 | LCC28,.45SQ | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | FL24,.35 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 筛选级别 | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 | - | MIL-PRF-38535 | - | MIL-PRF-38535 | MIL-PRF-38535 |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 厂商名称 | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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