Metal Glaze
™
Power Pack Surface Mount
High Power Density Ceramic Package
Welwyn Components
PPS-1 Series
•
•
•
•
•
•
•
•
1 watt performance, standard 2010 footprint
Flat ceramic package
0R1 to 348K range
Low inductance
Superior surge handling capability
150°C maximum operating temperature
Flameproof
Ceramic package provides superior
temperature rise profile
Electrical Data
PPS-1
Industry footprint
Maximum power rating at 70°C
Working voltage
1
Maximum voltage
Resistance range
Tolerance
TCR
watts
volts
volts
ohms
±%
2
ppm/°C
2
2010
1
350
700
0.1 to 0.99
1.0 to 348K
1, 2, 5
1, 2, 5
100
50, 100
1
2
Not to exceed (PxR)
1
/
2
Consult factory for tighter tolerance or TCR
PPS-1 Applications
The PPS-1 will dissipate 1 watt at 70°C on a 2010 footprint.
The PPS-1 is recommended for applications where board real
estate or component/board TCE mismatch is a major concern.
It is also recommended in circuits where a standard 2010
resistor exhibits marginal or unacceptable performance due to
high power density/surge handling demands.
Physical Data
Dimensions (mm)
a
PPS-1
4.32 ±0.25
b
3.30 ±0.13
c
2.01 ±0.15
d
5.08 ±0.25
e
3.30 ±0.13
f
2.67 ±0.13
Top view
a
Side view
e
f
b
c
d
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
Issue C · 04.03
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
49
Metal Glaze
™
Power Pack Surface Mount
High Power Density Ceramic Package
PPS-1 Series
Welwyn Components
Performance Data
Test Method
Temperature coefficient
Thermal Shock
Low temperature
Short time overload
High temperature exposure
Resistance to bonding exposure
Solderability
Moisture resistance
Life test
Terminal adhesion strength
Resistance to board bending
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R55342E Par 4.7.5 (2.5 x (PxR)1/2)
MIL-R55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 sec.)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R55342E Par 4.7.8 (10 cycles, total 2240 hours)
MIL-R55342E Par 4.7.10
(2000 hours at 70°C intermittent
1200 gram push from underside
of mounted chip for 60 seconds
Chip mounted in centre of 90mm long board
deflected 5mm so as to extent pull on chip
contacts for 10 seconds
Maximum Change
As specified above
±(0.5% +0.01 ohm)
±(0.25% +0.01 ohm)
±(1.0% +0.01 ohm)
±(0.5% +0.01 ohm)
±(0.5% +0.01 ohm)
95% minimum coverage
±(0.5% +0.01 ohm)
±(1.0% +0.01 ohm)
±(1% +0.01 ohm)
+(1% +0.01 ohm)
© Welwyn Components Limited
Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
50
Issue C · 04.03
嵌入式系统
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