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IS61VF25636B-7.5B2I

产品描述Cache SRAM, 256KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028, BGA-119
产品类别存储    存储   
文件大小824KB,共33页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
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IS61VF25636B-7.5B2I概述

Cache SRAM, 256KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028, BGA-119

IS61VF25636B-7.5B2I规格参数

参数名称属性值
Objectid8141454106
包装说明BGA,
Reach Compliance Codeunknown
Country Of OriginMainland China, Taiwan
ECCN代码3A991.B.2.A
YTEOL5.55
最长访问时间7.5 ns
JESD-30 代码R-PBGA-B119
长度22 mm
内存密度9437184 bit
内存集成电路类型CACHE SRAM
内存宽度36
功能数量1
端子数量119
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX36
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
座面最大高度3.5 mm
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
宽度14 mm

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IS61(64)LF25636B, IS61VF/VVF25636B
IS61(64)LF51218B, IS61VF/VVF51218B
256K x 36, 512K x 18
9 Mb SYNCHRONOUS
FLOW-THROUGH
STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth expan-
sion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for BGA package
• Power Supply
LF: Vdd
3.3V (+
5%), Vddq
3.3V/2.5V (+
5%)
VF: Vdd
2.5V (+
5%), Vddq
2.5V (+
5%)
VVF: Vdd
1.8V (+
5%), Vddq
1.8V (+
5%)
• JEDEC 100-Pin QFP, 119-pin BGA, and 165-pin
BGA packages
• Lead-free available
MARCH 2020
DESCRIPTION
The 9Mb product family features high-speed, low-power
synchronous static RAMs designed to provide burstable,
high-performance memory for communication and network-
ing applications. The IS61(64)LF/VF25636B
is organized
as 262,144 words by 36 bits. The IS61(64)LF/VF51218B
is organized as 524,288 words by 18 bits. Fabricated with
ISSI
's advanced CMOS technology, the device integrates
a 2-bit burst counter, high-speed SRAM core, and high-
drive capability outputs into a single monolithic circuit. All
synchronous inputs pass through registers controlled by
a positive-edge-triggered single clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be one to
four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be writ-
ten. Byte write operation is performed by using byte write
enable (BWE)
input combined with one or more individual
byte write signals (BWx). In addition, Global Write (GW)
is available for writing all bytes at one time, regardless of
the byte write controls.
Bursts can be initiated with either
ADSP
(Address Status
Processor) or
ADSC
(Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the
ADV
(burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW. Inter-
leave burst is achieved when this pin is tied HIGH or left
floating.
FAST ACCESS TIME
Symbol
tkq
tkc
Parameter
Clock Access Time
Cycle Time
Frequency
-6.5
6.5
7.5
133
-7.5
7.5
8.5
117
Units
ns
ns
MHz
Copyright © 2020 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause
failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written
assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B2
03/04/2020
1
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