• Reverse-Geometry MLCC providing Ultra low ESL and very
High Self Resonant Frequencies
• High power dissipation
• Lowest ESR in class, RF & Microwave capacitors
• Working voltage: 500V
• Sizes: 0709 and 0711
• Capacitance range: 0.5pF - 100pF
• NPO, RoHS compliant
• Operating temperature up to 175°C
• Laser Marked (optional)
ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS
Electrical specifications
Parameter
Capacitance
Tolerances
Working voltage (WV
DC
)
Temperature coefficient
Insulation Resistance
Dielectric Withstanding
(test voltage applied for 5 seconds)
Aging
Piezo Effect
Value
0.5pF - 100pF
A, B, C, D below 10pF
F, G, J, K above 10pF
500V
NPO: (0 ± 30) ppm/°C, –55°C to +175°C
10
5
MΩ min.
1,250V
none
none
APPLICATIONS
• Cellular Base Station Equipments
• Broadband Wireless Service
• Point to Point / Multipoint Radios
• Broadcasting Equipment
Parameter
Life Test
Moisture Resistance Test 1
Moisture Resistance Test 2
Environmental specifications
Value
2,000 hours, +125°C at 1,000V
1,000 hours, +175°C at 500V
240 hours, 85% relative humidity at 85°C
(ESA/SCC n°3009)
56 days, 93% relative humidity at 40°C
0V, 5V, WV
DC
CIRCUIT APPLICATIONS
• Impedance Matching
• Bypass, Feedback
• Tuning, Coupling and DC Blocking
PHYSICAL CHARACTERISTICS
Chip capacitors for surface mounting with Nickel barrier
and tinning.
HOW TO ORDER
501
Voltage code
501
= 500V
SH
Dielectric
SH
= NPO: (0±30)
ppm/°C
R
Size code
R
= 0709
D
= 0711
100
Capacitance code
Please refer to Cap.
Code given in capaci-
tance range chart
J
Tolerance code
A
= ±0.05pF
B
= ±0.1pF
C
= ±0.25pF
D
= ±0.5pF
F
= ±1%
G
= ±2%
J
= ±5%
K
= ±10%
See note
Note: For capacitance values less than 3.3pF, tolerances A, B, C and D are available. For capacitance values less than 10pF, tolerances B, C and D are available. For capacitance values of 10pF or higher, tolerances F, G, J and K are available.
Please consult us for specific requirements.
S
Termination code
S
= Standard: tin-plat-
ed nickel
All terminations are
backward compatible
and lead-free
L
Marking code
-:
no marking
L
= laser marking
E
Tape and reel
-:
no tape and reel
E
= Tape and reel
packaging
Number of compo-
nents
per reel: 1,000.
-RoHS
The RoHS tag is not part
of the reference
Tag added at the end of
P/N for information
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CERAMIC CAPACITORS
Reverse Geometry
DIMENSIONS in inches (mm)
GeneralSHR / SHD Series
characteristics
STANDARD RATINGS
Size
Size code
L
Dimensions
inches (mm)
W
T
e
Value (pF)
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
Cap. Code
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R2
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
2R4
2R7
3R0
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
0709
R
0.07 ± 0.015
(1.78 ± 0.38)
0.09 ± 0.01
(2.29 ± 0.25)
0.106 max
(2.67 max)
0.01 +0.008/-0.006
(0.25 +0.2/-0.15)
Standard
0711
D
0.07 ± 0.015
(1.78 ± 0.38)
0.105 ± 0.01
(2.67 ± 0.25)
0.09 max
(2.29 max)
0.01 +0.008/-0.006
(0.25 +0.2/-0.15)
Standard
TYPICAL ESR VERSUS FREQUENCY
ESR (Ω)
0.10
0.01
15 pF
33 pF
100 pF
100
1,000
Frequency (MHz)
TYPICAL SERIES RESONANT FREQUENCY VERSUS CAPACITANCE
3,000
500V
500V
Frequency (MHz)
2,500
2,000
1,500
1,000
10
30
Capacitance (pF)
50
70
90
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RF CAPACITORS
CERAMIC CAPACITORS
General Information
Taping : dimensions
CAPACITOR TERMINATIONS AND SOLDERING
RECOMMENDATIONS
I. TERMINATION TYPES
Our capacitors are delivered with one of the following terminations (for
technical reasons, only a limited number of termination types are available in
certain cases). All our terminations are backward compatible.
Parameter
Termination
Materials
Value
A
C
S
Comment
non-magnetic (silver-palladium)
non-magnetic (pure tin over copper barrier)
lead-free (pure tin over nickel barrier)
condition. The vapor phase and IR reflow soldering are less aggressive,
inducing more restricted thermal shocks. This is the reason why they are
preferred to the wave soldering method for reliable applications. In all cases,
proper pre-heating is essential.
The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of
the maximum soldering temperature. While multilayer ceramic capacitors can
withstand the peak soldering temperatures for short durations, they should be
minimized whenever possible.
Above precaution given for SMD types are applicable for the implementation
of large bare chips (1515 and above). But in general, large bare chips above
2225 are not recommended to be mounted on epoxy printed board due to the
thermal expansion mismatch between ceramic capacitor body and epoxy. This
is the reason why leaded components will be preferred especially for reliable
applications.
For information, the typical thermal profiles of these three soldering processes
are given hereafter. These typical diagrams are only given as an aid to SMD
users in determining specific processes linked to their instrumentations and
to their own experience.
NB: reference documents are IEC 61760-1, CECC30000 and IEC68 standards.
Please, refer to this standard for more information.
NB:
• terminations type C recommended for non magnetic applications.
• termination type A available for non magnetic applications (for historical
reason, we have also another code, the code “P”, for the same type of
termination. The parts that were designed-in before 2005 might still have
a code “P” instead of “A” in the part numbering. But both codes correspond
to the same type of termination).
II. SPECIFICATIONS
Care must be taken when using particular terminations: if the terminations are
heated up above a particular temperature and/or for too long a period of time,
there is a risk of leaching (dissolution of the termination revealing the inner
electrodes).
The chart below gives the resistance to soldering heat per termination type,
based on a SAC387 solder bath at 260°C.
Dielectric Type
CHA / SHA
CHB / SHB
CPX / CLX / CPE / CLE
CLF
SHL
SHS
SHF / SHN / SHT
5
±1s
(2)
10
±1s
(4)
10
±2s
(1)
A
C
10
±1s
(3)
30
±2s
30
±2s
On request
S
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
III.1.1. Vapour Phase Soldering
250°C
230°C
217°C
200°C
20s ... 40s
ca. 60s ... 130s
>217°C
Ramp down
rate <6K/s
150°C
100°C
Ramp up
rate <3K/s
50°C
0°C
0s
20s
40s 60s
80s 100s 120s 140s 160s 180s 200s 220s 240s
Lead free SnAgCu solders - Vapour Phase
250°C
210°C
20s ... 40s
(1): results extrapolated from 30±2s data obtained with Sn62/Pb36/Ag2 solder bath.
(2): data obtained with Sn62/Pb36/Ag2 solder bath.
(3): termination only available on CHA series.
(4): preliminary data.
200°C
180°C
150°C
ca. 60s ... 150s
<180°C
Ramp down
rate <6K/s
Ramp up
rate <3K/s
100°C
III. STANDARD SMD REQUIREMENTS
III.1. Soldering Recommendations
Regarding the soldering attachments, three methods are generally used: the
vapor phase soldering, the infrared reflow soldering and the wave soldering.
Unless particular skill about the use of the wave soldering, this method is not
recommended since the melted solder is directly in contact with the ceramic.
This can potentially crack the capacitor because the ceramic is sensible to the
thermal shocks. Moreover, this method needs to maintain the components
with an insulating resin which increases the thermo-mechanical strains
between the ceramic and the board both on soldering phase and operating
50°C
0°C
0s
20s
40s 60s
80s 100s 120s 140s 160s 180s 200s 220s 240s
SnPb solders – Infrared Soldering
NB: the lines indicate the upper and lower limits of typical process (terminal
temperature).
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CERAMIC CAPACITORS
General characteristics
General Information
III.1.2. Infrared Soldering
300°C
250°C
200°C
150°C
100°C
50°C
0°C
0s
Ramp up
rate <3K/s
Ramp down
rate <6K/s
245°C
235°C
220°C
Preheating
ca. 45s ... 90s
>220°C
III.2. Moisture Sensitivity Classification
Our standard lead-free terminations - S and C types - have been fully tested
and are compliant with the requirements mentioned in specification JEDEC STD
020 (level 1: not moisture sensitive).
III.3. Whiskers Classification
Our standard lead-free terminations - S and C types - have been fully tested
and are compliant with the requirements mentioned in specification JEDEC
STD 201. Our terminations exhibit a matte finish and receive a special heat
treatment to relieve stress inside the tin.
III.4. Pad Dimensions
The metalized pads on the end user’s substrate must be properly designed.
Improper spacing or dimensioning of the pads may result in poor solder joints
or a tombstone effect. Pad designs are given below for the most common sizes
of multilayer ceramic capacitors for both wave and reflow soldering.
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