MF3ICD(H)Q1
MIFARE DESFire EV1 256B contactless smartcard IC
Rev. 3.0 — 5 November 2015
351330
Product short data sheet
COMPANY PUBLIC
1. General description
MIFARE DESFire EV1 256B (MF3ICD(H)Q1), is the future proof entry level product of the
well-established MIFARE DESFire family and is addressing applications with low memory
but high security and data integrity needs.
The MIFARE DESFire EV1 256B offers the same security and file creation features as the
higher memory family members (Ref.
1),
but the number of applications and related files
on this product is limited due to its small memory plot.
This addresses the needs of account based systems and environments requiring only a
limited set of applications.
These applications include but are not limited to access management, public transport
ticketing, loyalty schemes and closed-loop payment.
It is fully compatible to all other members of the MIFARE DESFire EV1 family, offering the
same fast and highly secure data transmission, and is fully interoperable with existing
MIFARE DESFire infrastructure.
All MIFARE DESFire products are based on open global standards for both air interface
and implemented cryptographic methods. It is compliant to all 4 levels of ISO/IEC 14443A
and uses optional ISO/IEC 7816-4 commands, features an on-chip backup management
system and mutual three-pass authentication as well as encrypted communication.
The size of each file is defined at the moment of its creation, provides an automatic
anti-tear mechanism for all file types, guaranteeing transaction-oriented data integrity.
Data transfer rates from up to 848 Kbit/s can be achieved, allowing for fast data
transmission.
The main characteristics of the MIFARE DESFire family are denoted by the name
“DESFire”: “DES” indicates the high level of security using a hardware crypto
co-processor for either 3DES or AES-based data processing. “Fire” indicates its
outstanding position as a fast, innovative and highly reliable IC ideally suited to enable a
wide variety of different applications.
NXP Semiconductors
MF3ICD(H)Q1
MIFARE DESFire EV1 256B contactless smartcard IC
2. Features and benefits
2.1 RF interface: ISO/IEC 14443 Type A
Contactless transmission of data and powered by the RF-field (no battery needed)
Operating distance: up to 100 mm (depending on power provided by the PCD and
antenna geometry)
Operating frequency: 13.56 MHz
Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s
High data integrity: 16/32 bit CRC, parity, bit coding, bit counting
True deterministic anticollision
7 bytes unique identifier (cascade level 2 according to ISO/IEC 14443-3 and option for
random ID)
Uses ISO/IEC 14443-4 protocol
2.2 ISO/IEC 7816 compatibility
Supports ISO/IEC 7816-3 APDU message structure
Supports ISO/IEC 7816-4 INS code ‘A4’ for SELECT FILE
Supports ISO/IEC 7816-4 INS code ‘B0’ for READ BINARY
Supports ISO/IEC 7816-4 INS code ‘D6’ for UPDATE BINARY
Supports ISO/IEC 7816-4 INS code ‘B2’ for READ RECORDS
Supports ISO/IEC 7816-4 INS code ‘E2’ for APPEND RECORD
Supports ISO/IEC 7816-4 INS code ‘84’ for GET CHALLENGE
Supports ISO/IEC 7816-4 INS code ‘88’ for INTERNAL AUTHENTICATE
Supports ISO/IEC 7816-4 INS code ‘82’ for EXTERNAL AUTHENTICATE
2.3 Non-volatile memory
256 bytes application memory
1, 2
Data retention of 10 years
Write endurance typical 500 000 cycles
2.4 NV-memory organization
Flexible file system
Number of applications and files per application depending on available memory
File types supported: standard data file, back-up data file, value file, linear record file
and cyclic record file
File size is determined during creation
1.
2.
User application example: 1 Application, 2 AES keys, 1 Data file (256 bytes)
Also available in 2 KB, 4 KB and 8 KB. Refer to
Ref. 1.
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
MF3ICD(H)Q1
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 5 November 2015
351330
2 of 18
NXP Semiconductors
MF3ICD(H)Q1
MIFARE DESFire EV1 256B contactless smartcard IC
2.5 Security
Based on the same Common Criteria EAL4+ certified MIFARE DESFire EV1 platform
Unique 7 bytes serial number for each device
Optional “RANDOM” ID for enhance security and privacy
Mutual three-pass authentication
Mutual authentication according to ISO/IEC 7816-4
1 card master key and up to 14 keys per application
Hardware DES using 56/112/168 bit keys featuring key version, data authenticity by
8 byte CMAC
Hardware AES using 128-bit keys featuring key version, data authenticity by 8 byte
CMAC
Data encryption on RF-channel
Authentication on application level
Hardware exception sensors
Self-securing file system
Backward compatibility to MF3ICD40: 4 byte MAC, CRC 16
2.6 Special features
Transaction-oriented automatic anti-tear mechanism
Configurable ATS information for card personalization
Backward compatibility mode to MF3ICD40
Optional high input capacitance (70 pF) for small form factor design (MF3ICDHQ1)
3. Applications
Public transport ticketing: Account based or Single Journey ticketing
High secure access management
Hospitality
Event ticketing
Loyalty
Gift cards
Smart Visitor Badges (SVB)
MF3ICD(H)Q1
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 5 November 2015
351330
3 of 18
NXP Semiconductors
MF3ICD(H)Q1
MIFARE DESFire EV1 256B contactless smartcard IC
4. Quick reference data
Table 1.
Symbol
f
i
C
i
Quick reference data
[1][2]
Parameter
input frequency
input capacitance
MF3ICDQ1
MF3ICDHQ1
EEPROM characteristics
t
ret
N
endu(W)
t
cy(W)
[1]
[2]
[3]
[4]
[3][4]
[3][4]
Conditions
Min
-
14.96
64.00
10
200000
-
Typ
13.56
17.0
69.0
-
500000
2.9
Max
-
19.04
74.00
-
-
-
Unit
MHz
pF
pF
year
cycle
ms
retention time
write endurance
write cycle time
T
amb
= 22
C
T
amb
= 22
C
T
amb
= 22
C
Stresses above one or more of the values may cause permanent damage to the device.
Exposure to limiting values for extended periods may affect device reliability.
Measured with LCR meter.
T
amb
= 22
C;
f
i
= 13.56 MHz; 2.8 V RMS
5. Ordering information
Table 2.
Ordering information
Package
Name
MF3ICDQ101DUD/06
FFC
Description
8 inch wafer (sawn; 120
m
thickness, on film
frame carrier; electronic fail die marking
according to SECSII format); see
Ref. 4,
256B EEPROM, 17 pF
MF3ICDHQ101DUD/06
FFC
8 inch wafer (sawn; 120
m
thickness, on film
frame carrier; electronic fail die marking
according to SECSII format); see
Ref. 4,
256B EEPROM, 70 pF
MF3ICDQ101DUF/06
FFC
8 inch wafer (sawn; 75
m
thickness, on film
frame carrier; electronic fail die marking
according to SECSII format); see
Ref. 4,
256B EEPROM, 17 pF
MF3ICDHQ101DUF/06
FFC
8 inch wafer (sawn; 75
m
thickness, on film
frame carrier; electronic fail die marking
according to SECSII format); see
Ref. 4,
256B EEPROM, 70 pF
MF3MODQ101DA8/06
PLLMC
[1]
plastic leadless module carrier package; 35 mm
wide tape; see
Ref. 5,
256B EEPROM, 17 pF
MF3MODHQ101DA8/06 PLLMC
[1]
plastic leadless module carrier package; 35 mm
wide tape; see
Ref. 5,
256B EEPROM, 70 pF
[1]
This package is also known as MOA8.
Type number
Version
-
-
-
-
SOT500-4
SOT500-4
MF3ICD(H)Q1
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 5 November 2015
351330
4 of 18
NXP Semiconductors
MF3ICD(H)Q1
MIFARE DESFire EV1 256B contactless smartcard IC
6. Block diagram
RF
INTERFACE
SECURITY
SENSORS
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
UART
ISO/IEC
14443A
CRYPTO
CO-PROCESSOR
TRUE RANDOM
NUMBER
GENERATOR
CPU
CRC
ROM
RAM
EEPROM
001aah878
Fig 1.
Block diagram of MF3ICD(H)Q1
7. Limiting values
Table 3.
Limiting values
[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
I
I
P
tot
/pack
T
stg
T
amb
V
ESD
I
lu
[1]
[2]
[3]
Parameter
input current
total power dissipation per
package
storage temperature
ambient temperature
electrostatic discharge voltage
latch-up current
Conditions
Min
-
-
55
25
[3]
Max
30
200
125
70
-
-
Unit
mA
mW
C
C
kV
mA
2
100
Stresses above one or more of the limiting values may cause permanent damage to the device.
Exposure to limiting values for extended periods may affect device reliability.
MIL Standard 883-C method 3015; human body model: C = 100 pF, R = 1.5 k.
MF3ICD(H)Q1
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 5 November 2015
351330
5 of 18
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