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P13X270F101GA

产品描述Ceramic Capacitor, Ceramic, 100V, -/+15ppm/Cel TC, 0.000027uF, 0101
产品类别无源元件    电容器   
文件大小179KB,共3页
制造商Capax Technologies Inc
官网地址http://www.capaxtechnologies.com/
标准  
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P13X270F101GA概述

Ceramic Capacitor, Ceramic, 100V, -/+15ppm/Cel TC, 0.000027uF, 0101

P13X270F101GA规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1213966184
包装说明, 0101
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN代码EAR99
YTEOL8.18
电容0.000027 µF
电容器类型CERAMIC CAPACITOR
自定义功能Bulk Packaging On Request
介电材料CERAMIC
高度0.178 mm
JESD-609代码e4
长度0.33 mm
安装特点SURFACE MOUNT
多层No
负容差1%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法Waffle Pack
正容差1%
额定(直流)电压(URdc)100 V
尺寸代码0101
表面贴装YES
温度特性代码X
温度系数15% ppm/°C
端子面层Gold (Au) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度0.33 mm

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Technologies, Inc
Ceramic Single-Layer
Microwave Capacitors
Parallel Plate Ceramic Single Layer Microwave Capacitors (SLCs)
are ideally suited for applications such as GaAs integrated
circuits, microwave integrated circuits, DC block, bypass, and tuning,
and RF/microwave components. The SLC design offers
increased capacitance for additional bandwidth, increased stability in
capacitance over various temperatures, and more capacitance in
smaller case sizes for greater board density.
SLCs are suitable solutions for applications that require:
Through 40 GHz with minimum insertion loss.
Specified material from a selection of fourteen standard
dielectric options.
Imperviousness to electrostatic discharge and more ruggedness than MOS/MNS capacitors.
Gold plated electrode termination, which is compatible with solder, eutectic, epoxy and wire
bonding production methods.
General Specifications
M
ECHANICAL
H
IGH
R
ELIABILITY
T
ESTING
Bond Strength: Exceeds MIL-STD-883,
Method 2011 Destructive Bond Pull Test
Die Shear Strength: Exceeds applicable
MIL-STD-883 requirements.
Low Voltage Humidity: Paragraph 3.17, MIL-C-49464
Burn-in/Life Test: MIL-STD-202, Method 108, Condition A/F
Solderability: MIL-STD-202, Method 208
Group A: 100 Hour burn-in, 100% screening.
Group B: Group A tests, solderability, bond strength,
die shear strength, and temperature coefficient.
Group C: Group B tests, thermal shock, resistance to
soldering heat, low voltage humidity, and life test.
E
NVIRONMENTAL
S
TRIPLINE
T
HICKNESS
C
AP
L
W
C
ASE
D
IMENSIONS
in
Case Size
Width (W)
Length (L)
Thickness
(50V)
Thickness
(100V)
P10
.010
(.254)
.010
(.254)
.005
(.127)
.007
(.178)
Inches (mm)
P13
.013
(.330)
.013
(.330)
.005
(.127)
.007
(.178)
P15
.015
(.381)
.015
(.381)
.005
(.127)
.007
(.178)
P20
.020
(.508)
.020
(.508)
.005
(.127)
.007
(.178)
P25
.025
(.635)
.025
(.635)
.005
(.127)
.007
(.178)
P30
.030
(.762)
.030
(.762)
.005
(.127)
.007
(.178)
P35
.035
(.889)
.035
(.889)
.005
(.127)
.007
(.178)
P40
.040
(1.02)
.040
(1.02)
.005
(.127)
.007
(.178)
P50
.050
(1.27)
.050
(1.27)
.008
(.203)
P70
.070
(1.78)
.070
(1.78)
.008
(.203)
P90
.90
(2.29)
.100
(2.54)
.009
(.229)
PA0
.100
(2.54)
.100
(2.54)
.010
(.254)
** Tolerance: ±.002 (.050) or 10%
C
APAX
T
ECHNOLOGIES
, I
NC
º
24842 A
VE
T
IBBITTS
º
V
ALENCIA
, C
A
º
91355
º
661.257.7666
º
F
AX
: 661.257.4819
WWW
.C
APAX
T
ECHNOLOGIES
.C
OM
º
P
AGE
1
º

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