Power Solid State Relays
i4-PAC™, ISOPLUS264, and the Power SIP Relays
Features
• Solid State Reliability
• Handle loads up to 15A
rms
• Voltage ratings from 60V - 1000V
• Low On Resistance
• Compact i4-PAC™ Package with low
thermal resistance and heat sink
• Industry Standard 4-Pin SIP
Package
• Low input control current (≤ 10mA)
• UL 508 Approval Pending
Applications
• Motor controls
• Power Supplies
• Robotics
• Medical equipment
• Transportation equipment
• Consumer appliances
• Industrial control
• Test and Measurement Equipment
• Aerospace/Defense
Description
This unique family of 1-Form-A high power Solid State Relays (SSRs) combines Clare’s proven
optical isolation with IXYS advanced power MOSFET devices to deliver the industry’s highest
power MOSFET based SSRs. The efficient MOSFET switches and photovoltaic die employ Clare’s
patented OptoMOS™ architecture which is based on an optically-coupled input controlled by a
highly efficient GaAlAs infrared LED. The combination of low on resistance and high load current
handling capabilities makes these relays suitable for a variety of high performance switching
applications. As with all Clare SSRs, they are ideal EMR replacements and offer higher reliability,
lower drive current, no contact bounce and peak performance in the harshest shock, vibration
and magnetic environments.
With the recent expansion of the power relay family, Clare provides maximum flexibility for
designers as it now offers a full range of current (up to 15A
rms
) and voltage (60V to 1000V)
options, full AC/DC or reduced cost DC-only operation in 3 different package types (Power SIP,
i4-PAC™ and the ISOPLUS264).
The SIP package offers pin for pin compatibility with other power solid state relays, allowing
designers to bring Clare’s superior reliability to existing designs without changing printed circuit
boards. What distinguishes Clare’s offerings from other power solid state relays are the unique
package options, the i4-PAC™ and the ISOPLUS264. Both are part of the IXYS family of ISOPLUS
packages. These packages feature the IXYS unique (patent pending) process where the silicon
chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper
lead frame. The DCB ceramic, the same substrate material used in high power modules, not only
provides isolation capability (2500V
rms
) but also unbeatable low thermal resistance (0.30
ºC/W
for
the ISOPLUS264) compared to conventional external mounted isolation material. Along with the
ability to attach a heat sink, these factors combine to give Clare’s new power relays unbeatable
current handling capability in a compact package.
Block Diagrams:
* i4-PAC™ and ISOPLUS264 have
both AC/DC and DC-only versions
AC/DC Version*
DC Version*
i4-PAC™, ISOPLUS264, and
the Power SIP Relays
Part
Number
Output
Type
Blocking
Voltage
(V
P
)
Load
Current
(A
rms
)
8
6
3
4
2.5
1.2
10
9
7
5
1.5
2
2.5
0.7
0.30
0.35
0.18
2
11
10
8
6
3
1.5
15
13
12
6.5
2
On
Resistance
(Ohms)
0.3
0.2
0.85
1
2.3
3
0.1
0.12
0.20
0.75
2.5
0.3
0.34
1.4
6.5
5
18
n/a
0.08
0.10
0.3
0.5
1.3
1.5
0.05
0.075
0.09
0.4
1.25
Switching
Speeds
T
ON
/T
OFF
(ms)
20/5
20/5
20/5
20/5
20/5
20/5
20/5
25/10
25/10
25/10
25/10
10/5
10/10
10/10
10/5
5/3
10/5
1/2 cycle
20/5
20/5
20/5
20/5
20/5
20/5
25/10
25/10
25/10
25/10
25/10
Package
Thermal
Resistance
R
θJC
(ºC/W)
0.35
0.35
0.35
0.35
0.35
0.35
0.3
0.3
0.3
0.3
0.3
1.5
1.5
1.5
1.5
1.5
1.5
1.5
0.35
0.35
0.35
0.35
0.35
0.35
0.3
0.3
0.3
0.3
0.3
Many electronic designs can take
advantage of the improved performance
of solid-state relays (SSRs) relative to the
electro-mechanical relays (EMRs) that
perform the same circuit function. The
advantages of solid-state relays include
the following:
• SSRs are typically smaller than EMRs,
preserving valuable real estate in printed-
circuit board applications.
• SSRs offer improved system reliability
since they have no moving parts or
contacts to degrade.
• SSRs provide state-of-the-art
performance, including no requirement
for driver electronics and bounce-free
switching.
• SSRs provide improved system life-
cycle costs, including simplified designs
with reduced power supply and heat
dissipation requirements.
• SIP style package allows for maximum
density/minimal PCB space
CPC1908J
CPC1928J
CPC1967J
CPC1977J
CPC1978J
CPC1986J
CPC1909J
CPC1918J
CPC1927J
CPC1979J
CPC1988J
CPC1906Y
CPC1916Y
CPC1926Y
CPC1972Y
CPC1973Y
CPC1981Y
CPC1976Y
CPC1708J*
CPC1728J*
CPC1767J*
CPC1777J*
CPC1778J*
CPC1786J
CPC1709J*
CPC1718J*
CPC1727J*
CPC1779J*
CPC1788J*
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC/DC
AC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
60
200
400
600
800
1000
60
100
250
600
1000
60
100
250
600
400
1000
600
60
200
400
600
800
1000
60
100
250
600
1000
i4-PAC™
i4-PAC™
i4-PAC™
i4-PAC™
i4-PAC™
i4-PAC™
ISOPLUS264
ISOPLUS264
ISOPLUS264
ISOPLUS264
ISOPLUS264
Power SIP
Power SIP
Power SIP
Power SIP
Power SIP
Power SIP
Power SIP
i4-PAC™
i4-PAC™
i4-PAC™
i4-PAC™
i4-PAC™
i4-PAC™
ISOPLUS264
ISOPLUS264
ISOPLUS264
ISOPLUS264
ISOPLUS264
Application Notes
• AN-145, “Advantages of solid state relays
over electromechanical relays.”
* In Development - Samples Available in Q1-05
Power SIP
0.770 MIN - 0.799 MAX
(19.56 MIN - 20.29 MAX)
i4-PAC™
ISOLATED HEAT SINK
0.660 MIN - 0.690 MAX
(16.76 MIN - 17.53 MAX)
0.770 MIN - 0.799 MAX
(19.56 MIN - 20.29 MAX)
ISOPLUS264
ISOLATED HEAT SINK
0.668 MIN - 0.690 MAX
(16.97 MIN - 17.53 MAX)
0.819 MIN - 0.840 MAX
(20.80 MIN - 21.34 MAX)
0.590 MIN - 0.620 MAX
(14.99 MIN - 15.75 MAX)
1.020 MIN - 1.040 MAX
(25.91 MIN - 26.42 MAX)
0.801 MIN - 0.821 MAX
(20.34 MIN - 20.85 MAX)
1
PIN 1
PIN 4
2
3
4
Dimensions:
inches
(mm)
Clare, 78 Cherry Hill Drive, Beverly, MA 01915
Tel: 978-524-6700 • Fax: 978-524-4700
Web: www.clare.com
DIMENSIONS:
INCHES
(MM)
PCB设计
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