board eval ltc2281iup
| DC1098A-A | DC1098A-D | KHR2-T21834.8KOHMSC1% | LTC2281IUP#TRPBF | LTC2281CUP#TRPBF | LTC2281CUP#PBF | |
|---|---|---|---|---|---|---|
| 描述 | board eval ltc2281iup | board eval ltc2281iup | Fixed Resistor, Metal Glaze/thick Film, 100W, 34800ohm, 1% +/-Tol, -100,100ppm/Cel, 6118 | IC ADC DUAL 10BIT 125MSPS 64QFN | IC ADC DUAL 10BIT 125MSPS 64QFN | 输入类型：Differential, Single Ended 输入数：2 采样率（sps）：125M A/D 位数：10 |
| 是否Rohs认证 | - | - | 符合 | 符合 | 符合 | 符合 |
| Reach Compliance Code | - | - | compliant | compliant | compliant | compliant |
| ECCN代码 | - | - | EAR99 | 3A991.C.1 | 3A991.C.1 | 3A991.C.1 |
| JESD-609代码 | - | - | e3 | e3 | e3 | e3 |
| 端子数量 | - | - | 2 | 64 | 64 | 64 |
| 最高工作温度 | - | - | 155 °C | 85 °C | 70 °C | 70 °C |
| 封装形状 | - | - | RECTANGULAR PACKAGE | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | - | Radial | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 技术 | - | - | METAL GLAZE/THICK FILM | CMOS | CMOS | CMOS |
| 端子面层 | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
