microtech GmbH electronic Teltow
Chip resistors - Made in Germany
ISO/TS 16949:2009
Thin film series - Automotive variant, AEC Q200 qualified
Type: AMF
Sizes: 0402, 0603, 0805, 1206
Characteristics:
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•
•
•
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•
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Chip resistors in thin film technology
High-precision resistor layers
Resistance area coated with surface passivation
AEC Q200 qualified
Very tight tolerances (≥0,05%) - low temperature coefficient (≥10ppm/K)
Low current noise, good pulse strength
R-Value-Matching available
RoHS-conform
Order quantities from 1000 pieces for <1% and <TC50 available by extra charge
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
⇒
Electroplated alloy resistant tinned
⇒
Contact with low rest permeability -N
⇒
Epoxy bondable contact -K
Size
L
Length
Min
Max
Dimensions (in mm):
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
Front
Min
Max
H
t
0402
0603
0805
1206
0,95
1,50
1,85
2,90
1,10
1,70
2,15
3,35
0,45
0,75
1,10
1,45
0,60
0,95
1,40
1,75
0,25
0,35
0,35
0,35
0,40
0,55
0,65
0,65
0,10
0,10
0,15
0,25
0,35
0,50
0,60
0,75
0,05
0,10
0,15
0,15
0,35
0,50
0,60
0,75
T
L
W
Packaging units:
Reel
Ø
180 mm
330 mm
Card tape
acc. EN 60286-3
5 T pcs.
10 T pcs. for size 0402
10 T pcs.
20 T pcs.
Samples by bulk into plastic bags up to 50 pcs./value
Ordering information:
AMF
Type
AMF
-N
Contact
Standard (without
add.)
-N (non magnetic)
0603
Size
0402
.
to
.
1206
10k
R-
Value
100R
.
to
.
180k
0,1%
Tolerance
0,05
0,1
0,25
0,5
1
10ppm/K
TC
10
15
25
50
K
Marking
N- without
K- with
(from size 0603)
P
Packaging
P- Card tape
S- Bulk
(optional)
5
Pcs. / Reel
(T Pcs.)
Depends
on size
and
packaging
unit
Stand:
May
2013
Catalog microtech GmbH electronic
microtech GmbH electronic Teltow
ISO/TS 16949:2009
Chip resistors - Made in Germany
Thin film series - Automotive variant, AEC Q200 qualified
Type: AMF
Sizes: 0402, 0603, 0805, 1206
Technical data – depending on size:
Size
U
max
(V)
P
70
(W)
R-Range
R-Tolerance
(%)
from TC
(ppm/K)
15
25
50
10
15
25
50
10
15
25
50
10
15
25
50
P
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Packaging
B
S
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
0402
50
0,063
100R – 20k
0,1 / 0,25 / 0,5 / 1
0603
75
0,100
100R – 56k
0,05 / 0,1 / 0,25 / 0,5 /1
0805
150
0,125
100R – 130k
0,05 / 0,1 / 0,25 / 0,5 /1
1206
200
0,250
100R – 180k
0,05 / 0,1 / 0,25 / 0,5 /1
Technical data - general:
Technical data
Operating temperature range
Climatic category acc. EN 60068
Solderability acc. EN 60068-2-58
Soldering heat resistance acc. EN 60068-2-58
Long time stability
Storage 155°C / 1000 h
Endurance P
70
/ 70°C / 1000 h
Biased humidity (1000h / 85°C / 85%)
Automotive variant
-55°C … +155°C
55 / 155 / 56
245°C 3s
± (0,05% +0,01R) at 260°C 10s
± (0,25% +0,05R)
± (0,25% +0,05R)
± (0,5% +0,05R)
Data, unless specified, acc. EN 140401-801.
Catalog microtech GmbH electronic
Stand: May 2013
NXP MCU
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