Processors - Application Specialized App Processor
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | GREEN, PLASTIC, FCBGA-515 |
| 针数 | 515 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.3 |
| 地址总线宽度 | |
| 桶式移位器 | NO |
| 边界扫描 | YES |
| 最大时钟频率 | 54 MHz |
| 外部数据总线宽度 | |
| 格式 | FLOATING POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B515 |
| JESD-609代码 | e1 |
| 长度 | 12 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 515 |
| 最高工作温度 | 90 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA515,21X21,25 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.1,1.8,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.9 mm |
| 最大供电电压 | 1.89 V |
| 最小供电电压 | 1.71 V |
| 标称供电电压 | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 12 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| OMAP3515DCBC | OMAP3503DCUSA | OMAP3515DCUS | OMAP3503DCBCA | OMAP3515DCBCA | |
|---|---|---|---|---|---|
| 描述 | Processors - Application Specialized App Processor | Processors - Application Specialized Applications Proc | Processors - Application Specialized Applications Processor 423-FCBGA 0 to 90 | Processors - Application Specialized Applications Proc | Processors - Application Specialized Applications Processor 515-POP-FCBGA -40 to 105 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | GREEN, PLASTIC, FCBGA-515 | 0.65 MM, PLASTIC, FCBGA-423 | LFBGA, BGA423,24X24,25 | VFBGA, BGA515,26X26,20 | VFBGA, BGA515,26X26,20 |
| 针数 | 515 | 423 | 423 | 515 | 515 |
| Reach Compliance Code | unknown | unknow | unknow | unknow | unknown |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 桶式移位器 | NO | NO | NO | NO | NO |
| 边界扫描 | YES | YES | YES | YES | YES |
| 最大时钟频率 | 54 MHz | 59 MHz | 54 MHz | 59 MHz | 54 MHz |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 内部总线架构 | MULTIPLE | SINGLE | MULTIPLE | SINGLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B515 | S-PBGA-B423 | S-PBGA-B423 | S-PBGA-B515 | S-PBGA-B515 |
| 长度 | 12 mm | 16 mm | 16 mm | 12 mm | 12 mm |
| 低功率模式 | YES | YES | YES | YES | YES |
| 端子数量 | 515 | 423 | 423 | 515 | 515 |
| 最高工作温度 | 90 °C | 105 °C | 90 °C | 105 °C | 105 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | LFBGA | LFBGA | VFBGA | VFBGA |
| 封装等效代码 | BGA515,21X21,25 | BGA423,24X24,25 | BGA423,24X24,25 | BGA515,26X26,20 | BGA515,26X26,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| 电源 | 1.1,1.8,3.3 V | 1.1,1.2,1.8,1.8/3 V | 1.1,1.8,3.3 V | 1.1,1.8,3.3 V | 1.1,1.8,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.9 mm | 1.4 mm | 1.4 mm | 0.9 mm | 0.9 mm |
| 最大供电电压 | 1.89 V | 1.91 V | 1.89 V | 1.91 V | 1.89 V |
| 最小供电电压 | 1.71 V | 1.71 V | 1.71 V | 1.71 V | 1.71 V |
| 标称供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | INDUSTRIAL | OTHER | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.5 mm | 0.8 mm | 0.65 mm | 0.4 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 12 mm | 16 mm | 16 mm | 12 mm | 12 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| JESD-609代码 | e1 | e1 | - | e1 | e1 |
| 湿度敏感等级 | 3 | 4 | - | 3 | 3 |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
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