IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,16PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| Reach Compliance Code | unknown |
| 差分输出 | YES |
| 驱动器位数 | 2 |
| 高电平输入电流最大值 | 0.00004 A |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最小输出摆幅 | 2 V |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 最大传输延迟 | 25 ns |
| Base Number Matches | 1 |
| DS7832J/A+ | DS8831J/A+ | DS8831N/B+ | DS7832J | DS7832W | |
|---|---|---|---|---|---|
| 描述 | IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,16PIN,CERAMIC | IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,16PIN,CERAMIC | IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,16PIN,PLASTIC | IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,16PIN,CERAMIC | IC,LINE DRIVER,2 DRIVER,BIPOLAR,FP,16PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant |
| 差分输出 | YES | YES | YES | YES | YES |
| 驱动器位数 | 2 | 2 | 2 | 2 | 2 |
| 高电平输入电流最大值 | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDFP-F16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | -55 °C |
| 最小输出摆幅 | 2 V | 2 V | 2 V | 2 V | 2 V |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DFP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最大传输延迟 | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| Base Number Matches | 1 | 1 | 1 | - | - |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified |
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