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AS8F512K32Q-90XT

产品描述512KX32 FLASH 5V PROM MODULE, 90ns, CQFP68, CERAMIC, QFP-68
产品类别存储    存储   
文件大小344KB,共23页
制造商Micross
官网地址https://www.micross.com
下载文档 详细参数 选型对比 全文预览

AS8F512K32Q-90XT概述

512KX32 FLASH 5V PROM MODULE, 90ns, CQFP68, CERAMIC, QFP-68

AS8F512K32Q-90XT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Micross
零件包装代码QFP
包装说明QFP,
针数68
Reach Compliance Codeunknown
最长访问时间90 ns
其他特性USER CONFIGURABLE AS 2M X 8
备用内存宽度16
JESD-30 代码S-CQFP-G68
JESD-609代码e0
长度22.352 mm
内存密度16777216 bit
内存集成电路类型FLASH MODULE
内存宽度32
功能数量1
端子数量68
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织512KX32
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QFP
封装形状SQUARE
封装形式FLATPACK
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
编程电压5 V
认证状态Not Qualified
座面最大高度5.08 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式GULL WING
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度22.352 mm
Base Number Matches1

文档预览

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FLASH
Austin Semiconductor, Inc.
512K x 32 FLASH
PIN ASSIGNMENT
FLASH MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
SMD 5962-94612
MIL-STD-883
Fast Access Times: 70, 90, 120 and 150ns
Operation with single 5V (±10%)
Theta JC= 1.00°
C
/w
User configurable as 512Kx32, 1Mx16, or 2Mx8
Eight Equal Sectors of 64K Bytes for each 512Kx8
Compatible with JEDEC EEPROM command set
Any Combination of Sectors can be Erased
Supports Full Chip Erase
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built in decoupling caps for low noise operation
Suspend Erase/Resume Function
Individual Byte Read/ Write Control
Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
AS8F512K32
(Top View)
68 Lead CQFP (Q & Q1)
FEATURES
66 Lead PGA (P)
OPTIONS
Timing
70ns
90ns
120ns
150ns
Package
Ceramic Quad Flat pack
Ceramic Quad Flatpack
Pin Grid Array
MARKINGS
-70
-90
-120
-150
Q
Q1
P
No. 702
No. 904
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8F512K32 is a 16 Megabit
CMOS FLASH Memory Module organized as 512Kx32 bits. The
AS8F512K32 achieves high speed access (70 to 150 ns), low power
consumption and high reliability by employing advanced CMOS memory
technology.
An on-chip state machine controls the program and erase func-
tions. The embedded byte-program and sector/chip erase functions are
fully automatic. Data-protection of any sector combination is accom-
plished using a hardware sector-protection feature.
The
Erase/Resume function
allows the sector erase operation to
read data from, or program to a non-erasing sector, then resume the
erase operation.
Device operations are selected by using standard commands into
the command register using standard microprocessor write timings. The
command register acts as an input to an internal state machine that
interprets the commands, controls the erase and programming opera-
tions, outputs the status of the device, and outputs data stored in the
device. On initial power-up operation, the device defaults to the read
mode.
AS8F512K32
Rev. 5.2 09/07
For more products and information
please visit our web site at
www.austinsemiconductor.com
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1

AS8F512K32Q-90XT相似产品对比

AS8F512K32Q-90XT AS8F512K32P-90XT
描述 512KX32 FLASH 5V PROM MODULE, 90ns, CQFP68, CERAMIC, QFP-68 512KX32 FLASH 5V PROM MODULE, 90ns, CPGA66, PGA-66
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
厂商名称 Micross Micross
零件包装代码 QFP PGA
包装说明 QFP, PGA,
针数 68 66
Reach Compliance Code unknown unknown
最长访问时间 90 ns 90 ns
其他特性 USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8
备用内存宽度 16 16
JESD-30 代码 S-CQFP-G68 S-CPGA-P66
JESD-609代码 e0 e0
长度 22.352 mm 27.305 mm
内存密度 16777216 bit 16777216 bit
内存集成电路类型 FLASH MODULE FLASH MODULE
内存宽度 32 32
功能数量 1 1
端子数量 68 66
字数 524288 words 524288 words
字数代码 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C
最低工作温度 -55 °C -55 °C
组织 512KX32 512KX32
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 QFP PGA
封装形状 SQUARE SQUARE
封装形式 FLATPACK GRID ARRAY
并行/串行 PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
编程电压 5 V 5 V
认证状态 Not Qualified Not Qualified
座面最大高度 5.08 mm 4.953 mm
最大供电电压 (Vsup) 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V
表面贴装 YES NO
技术 CMOS CMOS
温度等级 MILITARY MILITARY
端子面层 TIN LEAD TIN LEAD
端子形式 GULL WING PIN/PEG
端子节距 1.27 mm 2.54 mm
端子位置 QUAD PERPENDICULAR
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 22.352 mm 27.305 mm

 
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