Datasheet> 器件分类 > 存储> 存储> 71V67602S133PFGI8

71V67602S133PFGI8: 产品描述TQFP-100, Reel; 产品类别存储存储; 文件大小505KB，共24页; 制造商IDT (Integrated Device Technology); 标准

下载文档详细参数选型对比全文预览

71V67602S133PFGI8在线购买

供应商	器件名称	价格	最低购买	库存
	71V67602S133PFGI8	-	-	点击查看	点击购买

71V67602S133PFGI8概述

TQFP-100, Reel

71V67602S133PFGI8规格参数

参数名称	属性值
Brand Name	Integrated Device Technology
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	TQFP
包装说明	LQFP, QFP100,.63X.87
针数	100
制造商包装代码	PKG100
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
Samacsys Description	TQFP 14.0 X 20.0 X 1.4 MM
最长访问时间	4.2 ns
其他特性	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	133 MHz
I/O 类型	COMMON
JESD-30 代码	R-PQFP-G100
JESD-609代码	e3
长度	20 mm
内存密度	9437184 bit
内存集成电路类型	CACHE SRAM
内存宽度	36
湿度敏感等级	3
功能数量	1
端子数量	100
字数	262144 words
字数代码	256000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	256KX36
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	LQFP
封装等效代码	QFP100,.63X.87
封装形状	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
电源	2.5,3.3 V
认证状态	Not Qualified
座面最大高度	1.6 mm
最大待机电流	0.07 A
最小待机电流	3.14 V
最大压摆率	0.28 mA
最大供电电压 (Vsup)	3.465 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn) - annealed
端子形式	GULL WING
端子节距	0.65 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	30
宽度	14 mm
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

256K X 36, 512K X 18

3.3V Synchronous SRAMs

2.5V I/O, Burst Counter

Pipelined Outputs, Single Cycle Deselect

◆

IDT71V67602

IDT71V67802

Features

◆

256K x 36, 512K x 18 memory configurations

Supports high system speed:

– 166MHz 3.5ns clock access time

– 150MHz 3.8ns clock access time

– 133MHz 4.2ns clock access time

LBO

input selects interleaved or linear burst mode

Self-timed write cycle with global write control (GW), byte

write enable (BWE), and byte writes (BWx)

3.3V core power supply

Power down controlled by ZZ input

2.5V I/O supply (V

DDQ

)

Packaged in a JEDEC Standard 100-pin plastic thin quad

flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch

ball grid array.

The IDT71V67602/7802 are high-speed SRAMs organized as

256K x 36/512K x 18. The IDT71V676/78 SRAMs contain write, data,

address and control registers. Internal logic allows the SRAM to generate

a self-timed write based upon a decision which can be left until the end of

the write cycle.

The burst mode feature offers the highest level of performance to the

system designer, as the IDT71V67602/7802 can provide four cycles of

data for a single address presented to the SRAM. An internal burst address

counter accepts the first cycle address from the processor, initiating the

access sequence. The first cycle of output data will be pipelined for one

cycle before it is available on the next rising clock edge. If burst mode

operation is selected (ADV=LOW), the subsequent three cycles of output

data will be available to the user on the next three rising clock edges. The

order of these three addresses are defined by the internal burst counter

and the

LBO

input pin.

The IDT71V67602/7802 SRAMs utilize IDT’s latest high-performance

CMOS process and are packaged in a JEDEC standard 14mm x 20mm

100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array

(BGA) and 165 fine pitch ball grid array (fBGA).

Description

Pin Description Summary

-A

BWE

(1)

CLK

ADV

ADSC

ADSP

LBO

I/O

-I/O

, I/O

-I/O

, V

DDQ

Address Inputs

Chip Enable

Chip Selects

Output Enable

Global Write Enable

Byte Write Enable

Individual Byte Write Selects

Clock

Burst Address Advance

Address Status (Cache Controller)

Address Status (Processor)

Linear / Interleaved Burst Order

Sleep Mode

Data Input / Output

Core Power, I/O Power

Ground

Input

I/O

Supply

Synchronous

Asynchronous

Synchronous

N/A

Synchronous

Asynchronous

Synchronous

N/A

5311 tbl 01

NOTE:

and

are not applicable for the IDT71V67802.

FEBRUARY 2009

DSC-5311/09

71V67602S133PFGI8相似产品对比

	71V67602S133PFGI8	71V67602S166PFG8	71V67602S150PFGI8	71V67602S133PFG8	71V67602S150PFG8	71V67602S133PFGI	71V67602S150PFGI	71V67602S150PFG	71V67602S150BGG	71V67602S166BGG
描述	TQFP-100, Reel	TQFP-100, Reel	TQFP-100, Reel	TQFP-100, Reel	TQFP-100, Reel	TQFP-100, Tray	TQFP-100, Tray	TQFP-100, Tray	PBGA-119, Tray	PBGA-119, Tray
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	TQFP	TQFP	TQFP	TQFP	TQFP	TQFP	TQFP	TQFP	PBGA	PBGA
包装说明	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50
针数	100	100	100	100	100	100	100	100	119	119
制造商包装代码	PKG100	PKG100	PKG100	PKG100	PKG100	PKG100	PKG100	PKG100	BGG119	BGG119
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Samacsys Description	TQFP 14.0 X 20.0 X 1.4 MM	TQFP 14.0 X 20.0 X 1.4 MM	TQFP 14.0 X 20.0 X 1.4 MM	TQFP 14.0 X 20.0 X 1.4 MM	TQFP 14.0 X 20.0 X 1.4 MM	TQFP 14.0 X 20.0 X 1.4 MM	TQFP 14.0 X 20.0 X 1.4 MM	TQFP 14.0 X 20.0 X 1.4 MM	PBGA 14.0 X 22.0 MM X 1.27 MM PITCH	PBGA 14.0 X 22.0 MM X 1.27 MM PITCH
最长访问时间	4.2 ns	3.5 ns	3.8 ns	4.2 ns	3.8 ns	4.2 ns	3.8 ns	3.8 ns	3.8 ns	3.5 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	133 MHz	166 MHz	150 MHz	133 MHz	150 MHz	133 MHz	150 MHz	150 MHz	150 MHz	166 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PBGA-B119	R-PBGA-B119
JESD-609代码	e3	e3	e3	e3	e3	e3	e3	e3	e1	e1
长度	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	22 mm	22 mm
内存密度	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit
内存集成电路类型	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	36	36	36	36	36	36	36	36	36	36
湿度敏感等级	3	3	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	100	100	100	100	100	100	100	100	119	119
字数	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
字数代码	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C	70 °C	70 °C
组织	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	BGA	BGA
封装等效代码	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	BGA119,7X17,50	BGA119,7X17,50
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260	260
电源	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	2.36 mm	2.36 mm
最大待机电流	0.07 A	0.05 A	0.07 A	0.05 A	0.05 A	0.07 A	0.07 A	0.05 A	0.05 A	0.05 A
最小待机电流	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
最大压摆率	0.28 mA	0.34 mA	0.325 mA	0.26 mA	0.305 mA	0.28 mA	0.325 mA	0.305 mA	0.305 mA	0.34 mA
最大供电电压 (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	BALL
端子节距	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	30	30	30
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Base Number Matches	1	1	1	1	1	1	1	1	1	-

71V67602S133PFGI8

71V67602S133PFGI8在线购买

71V67602S133PFGI8概述

71V67602S133PFGI8规格参数

文档预览

71V67602S133PFGI8相似产品对比

推荐资源