IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,SOP,16PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | SOP, SOP16,.25 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最大输出低电流 | 0.006 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
DS26C32CM/A+ | DS26C32CJ/A+ | DS26C32AMW | DS26C32CN | DS26C32CJ | DS26C32CM | DS26C32CN/A+ | |
---|---|---|---|---|---|---|---|
描述 | IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,SOP,16PIN,PLASTIC | IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,DIP,16PIN,CERAMIC | IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,FP,16PIN,CERAMIC | LINE RECEIVER, PDIP16, DIP-16 | LINE RECEIVER, CDIP16, DIP-16 | LINE RECEIVER, PDSO16 | IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,DIP,16PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | SOP, SOP16,.25 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G16 | R-XDIP-T16 | R-XDFP-F16 | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 125 °C | 70 °C | 70 °C | 70 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -55 °C | - | - | - | -40 °C |
最大输出低电流 | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DFP | DIP | DIP | SOP | DIP |
封装等效代码 | SOP16,.25 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
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