Field Programmable Gate Array, 16000-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, ROHS COMPLIANT, UBGA-324
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Altera (Intel) |
包装说明 | BGA, BGA324,18X18,32 |
Reach Compliance Code | compliant |
JESD-30 代码 | S-PBGA-B324 |
输入次数 | 246 |
逻辑单元数量 | 16000 |
输出次数 | 246 |
端子数量 | 324 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA324,18X18,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 1.2 V |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | Not Qualified |
标称供电电压 | 1.2 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
10M16DAU324I7G | 10M16DAU324C8G | 10M02SCU169I7G | 10M02SCM153I7G | 10M08SAE144C8G | 10M08SAE144I7G | 10M25SAE144I7G | |
---|---|---|---|---|---|---|---|
描述 | Field Programmable Gate Array, 16000-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, ROHS COMPLIANT, UBGA-324 | Field Programmable Gate Array, 16000-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, ROHS COMPLIANT, UBGA-324 | Field Programmable Gate Array, 2000-Cell, CMOS, PBGA169, 11 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, UBGA-169 | Field Programmable Gate Array, 2000-Cell, CMOS, PBGA153, 8 X 8 MM, 0.50 MM PITCH, ROHS COMPLIANT, MBGA-153 | Field Programmable Gate Array, PQFP144, 22 X 22 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, EQFP-144 | Field Programmable Gate Array, PQFP144, 22 X 22 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, EQFP-144 | Field Programmable Gate Array, PQFP144, 22 X 22 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, EQFP-144 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | BGA, BGA324,18X18,32 | BGA, BGA324,18X18,32 | BGA, BGA169,13X13,32 | BGA, BGA153,15X15,20 | QFP, | QFP, | QFP, |
Reach Compliance Code | compliant | compliant | compliant | compli | compli | compli | compli |
JESD-30 代码 | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B169 | S-PBGA-B153 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 |
端子数量 | 324 | 324 | 169 | 153 | 144 | 144 | 144 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | QFP | QFP | QFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
端子形式 | BALL | BALL | BALL | BALL | GULL WING | GULL WING | GULL WING |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | Altera (Intel) | Altera (Intel) | - | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
输入次数 | 246 | 246 | 130 | 112 | - | - | - |
逻辑单元数量 | 16000 | 16000 | 2000 | 2000 | - | - | - |
输出次数 | 246 | 246 | 130 | 112 | - | - | - |
封装等效代码 | BGA324,18X18,32 | BGA324,18X18,32 | BGA169,13X13,32 | BGA153,15X15,20 | - | - | - |
电源 | 1.2 V | 1.2 V | 3/3.3 V | 3/3.3 V | - | - | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - |
技术 | CMOS | CMOS | CMOS | CMOS | - | - | - |
Samacsys Descripti | - | - | - | FPGA - Field Programmable Gate Array non-volatile FPGA, 112 I/O, 153MBGA | FPGA - Field Programmable Gate Array | FPGA MAX 10 Family 8000 Cells 55nm Technology 3.3V 144-Pin EQFP EP | FPGA MAX 10 Family 25000 Cells 55nm Technology 1.2V 144-Pin EQFP EP Tray |
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