CALIFORNIA MICRO DEVICES
PACDN1408C
PACDN2408C
ESD PROTECTION ARRAY, 8 CHANNEL, CHIP SCALE PACKAGE
Features
• 8 transient voltage suppressors in a single chip
scale wafer level package.
• Compact Chip Scale Package (CSP) format
saves board space and ease layout in space
critical applications compared to discrete
solutions and traditional wire bonded packages.
• In-system Electro Static Discharge (ESD)
protection to 20kV contact discharge per
IEC 61000-4-2 international standard.
• PACDN2408C features back-to-back zener
protection for AC signals.
Applications
• ESD protection of cellular phones, PDA, internet
appliances and PC ports.
• Protection of interface ports or IC pins which are
exposed to high levels of ESD.
• PACDN2408C can be used for ESD protection of
set-top box R,L,V ports.
Product Description
The PACDN1408C and PACDN2408C are transient
voltage suppressor arrays that provide a very high
level of protection for sensitive electronic components
that may be subjected to ESD. The back-to-back zener
connections of the PACDN2408C provides ESD
protection in cases where nodes with AC signals are
present.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard (Level 4, 8kV contact dis-
charge). All I/Os are rated at 20kV using the IEC
61000-4-2 contact discharge method. Using the MIL-
STD-883D (Method 3015) specification for Human
Body Model (HBM) ESD, all pins are protected for
contact discharges to greater than 30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards
without the use of underfill.
SCHEMATIC DIAGRAMS
B1
B2
B3
B4
B5
B1
B2
B3
B4
B5
A1
A2
A3
A4
A5
A1
A2
A3
A4
A5
PACDN1408C
PACDN2408C
S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N
Package
Style
Chip Scale
Chip Scale
© 2000 California Micro Devices Corp. All rights reserved.
6/19/2000
Ordering Part Number
Bumps
10
10
Tape & Reel
PACDN1408C/R
PACDN2408C/R
C1130600
Part Marking
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
1
CALIFORNIA MICRO DEVICES
PACDN1408C
PACDN2408C
PA C D N 1 4 0 8 C S P E C I F I C AT I O N S
(At 25°C unless specified otherwise)
Min
Reverse Stand-off Voltage, I = 10µA
Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, 10mA
In-system ESD withstand voltage*:
Human Body Model (MIL-STD-883D, method 3015
IEC 61000-4-2, contact discharge method
Clamping voltage during ESD discharge
MIL-STD-883D (Method 3015), 8kV
Capacitance at 2.5V dc, 1MHz
Temperature Range:
Operating
Storage
Positive
Negative
5.5
5.6
–1.2
6.6
–0.8
±30
±25
12
–8
30
–40
–65
85
150
8.0
–0.4
Typ
Max
Unit
V
V
V
kV
kV
V
V
pF
°C
* ESD applied between channel pin and ground, one at a time. All other channels are open. All GND pins grounded. This
parameter is guaranteed by design and characterization.
‘GND’ in this document refers to the lower supply voltage.
PA C D N 2 4 0 8 C S P E C I F I C AT I O N S
(At 25°C unless specified otherwise)
Min
Reverse Stand-off Voltage, I = 10µA
Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, 10mA
In-system ESD withstand voltage*:
Human Body Model (MIL-STD-883D, method 3015
IEC 61000-4-2, contact discharge method
Clamping voltage during ESD discharge
MIL-STD-883D (Method 3015), 8kV
Capacitance at 2.5V dc, 1MHz
Temperature Range:
Operating
Storage
Positive
Negative
±5.9
6.0
–9.2
7.6
–7.6
±30
±18
14
–14
30
–40
–65
85
150
9.2
–6.0
Typ
Max
Unit
V
V
V
kV
kV
V
V
pF
°C
* ESD applied between channel pin and common, one at a time. All other channels are open. This parameter is guaranteed by
design and characterization.
©2000 California Micro Devices Corp. All rights reserved.
2
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
6/19/2000
CALIFORNIA MICRO DEVICES
Package Diagram
0.65mm
3.104mm
0.252mm
B
A
0.35mm dia.
Bumps
1
2
3
4
5
0.65mm
PACDN1408C
PACDN2408C
0.252mm
0.381mm
0.643mm
Pin Orientation
Both parts are symmetrical, and do not require orientation to pin-1 found in conventional semiconductors. The part
may rotated 180° without affecting operation.
P R I N T E D C I R C U I T B OA R D R E C O M E N D AT I O N S
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening
Solder Flux Ratio
Solder Paste
Bond Trace Finish
0.300mm
Round
Non Solder Mask Defined Pads (NSMD)
0.350mm
0.152mm
0.360mm (sq.)
50/50
No Clean
OSP (Entek Cu Plus 106A)
Typical Solder Reflow Thermal Profile (No Clean Flux)
© 2000 California Micro Devices Corp. All rights reserved.
6/19/2000
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
1.154mm
www.calmicro.com
3
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