Bus Transceiver
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
包装说明 | HVQCCN, |
Reach Compliance Code | compliant |
其他特性 | WITH DIRECTION CONTROL |
系列 | LVT |
JESD-30 代码 | R-PQCC-N20 |
JESD-609代码 | e4 |
长度 | 4.5 mm |
逻辑集成电路类型 | BUS TRANSCEIVER |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
传播延迟(tpd) | 4 ns |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 2.5 mm |
Base Number Matches | 1 |
935285605115 | 74LVT245BDB-T | 74LVT245BD-T | 74LVT245BPW-T | 74LVT245BBQ | 74LVT245BD | 74LVT245BDB | |
---|---|---|---|---|---|---|---|
描述 | Bus Transceiver | Bus Transceiver | Bus Transceiver | Bus Transceiver | Bus Transceiver | Bus Transceiver | Bus Transceiver |
包装说明 | HVQCCN, | SSOP, | SOP, | TSSOP, | VSSOP, | SOP, | SSOP, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
系列 | LVT | LVT | LVT | LVT | LVT | LVT | LVT |
JESD-30 代码 | R-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
长度 | 4.5 mm | 7.2 mm | 12.8 mm | 6.5 mm | 4.5 mm | 12.8 mm | 7.2 mm |
逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | SSOP | SOP | TSSOP | VSSOP | SOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
传播延迟(tpd) | 4 ns | 4 ns | 4 ns | 4 ns | 4 ns | 4 ns | 4 ns |
座面最大高度 | 1 mm | 2 mm | 2.65 mm | 1.1 mm | 1 mm | 2.65 mm | 2 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.5 mm | 1.27 mm | 0.65 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 2.5 mm | 5.3 mm | 7.5 mm | 4.4 mm | 2.5 mm | 7.5 mm | 5.3 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
JESD-609代码 | e4 | - | - | - | e4 | e4 | e4 |
湿度敏感等级 | 1 | - | - | - | 1 | 1 | 1 |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold (Ni/Pd/Au) |
厂商名称 | - | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | 30 |
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