Multiplier Accumulator/Summer, 16-Bit, CMOS, PQFP64, PLASTIC, QFP-64
| 参数名称 | 属性值 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | QFF, |
| 针数 | 64 |
| Reach Compliance Code | unknown |
| 边界扫描 | NO |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | S-PQFP-F64 |
| JESD-609代码 | e0 |
| 长度 | 22.86 mm |
| 低功率模式 | NO |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出数据总线宽度 | 35 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFF |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.286 mm |
| 最大压摆率 | 201.43 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 22.86 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| Base Number Matches | 1 |
| IDT7210L35PQF | IDT7210L25PQF | IDT7210L55PQF | IDT7210L45PQF | IDT7210L65PQF | |
|---|---|---|---|---|---|
| 描述 | Multiplier Accumulator/Summer, 16-Bit, CMOS, PQFP64, PLASTIC, QFP-64 | Multiplier Accumulator/Summer, 16-Bit, CMOS, PQFP64, PLASTIC, QFP-64 | Multiplier Accumulator/Summer, 16-Bit, CMOS, PQFP64, PLASTIC, QFP-64 | Multiplier Accumulator/Summer, 16-Bit, CMOS, PQFP64, PLASTIC, QFP-64 | Multiplier Accumulator/Summer, 16-Bit, CMOS, PQFP64, PLASTIC, QFP-64 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | QFF, | QFF, | QFF, | QFF, | QFF, |
| 针数 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 边界扫描 | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-PQFP-F64 | S-PQFP-F64 | S-PQFP-F64 | S-PQFP-F64 | S-PQFP-F64 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 22.86 mm | 22.86 mm | 22.86 mm | 22.86 mm | 22.86 mm |
| 低功率模式 | NO | NO | NO | NO | NO |
| 端子数量 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出数据总线宽度 | 35 | 35 | 35 | 35 | 35 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFF | QFF | QFF | QFF | QFF |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm |
| 最大压摆率 | 201.43 mA | 270 mA | 139.1 mA | 163.33 mA | 122.31 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 22.86 mm | 22.86 mm | 22.86 mm | 22.86 mm | 22.86 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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