A/D Converter, 12-Bit, 1 Func, Hybrid, MDIP32
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Data Device Corporation |
零件包装代码 | DIP |
针数 | 32 |
Reach Compliance Code | compliant |
最大模拟输入电压 | 10 V |
转换器类型 | A/D CONVERTER |
JESD-30 代码 | R-MDIP-T32 |
JESD-609代码 | e0 |
最大线性误差 (EL) | 0.012% |
位数 | 12 |
功能数量 | 1 |
端子数量 | 32 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出位码 | OFFSET BINARY |
封装主体材料 | METAL |
封装代码 | DIP |
封装等效代码 | DIP32,.9 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5,+-15 V |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | HYBRID |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
ADH-8586-12-1 | ADH-8586-12-1-883B | ADH-8586-12-3 | ADH-8585-12-1 | ADH-8585-12-1-883B | ADH-8585-12-3 | |
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描述 | A/D Converter, 12-Bit, 1 Func, Hybrid, MDIP32 | A/D Converter, 12-Bit, 1 Func, Hybrid, MDIP32 | A/D Converter, 12-Bit, 1 Func, Hybrid, MDIP32 | A/D Converter, 12-Bit, 1 Func, Hybrid, MDIP32 | A/D Converter, 12-Bit, 1 Func, Hybrid, MDIP32 | A/D Converter, 12-Bit, 1 Func, Hybrid, MDIP32 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
针数 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
最大模拟输入电压 | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
转换器类型 | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER |
JESD-30 代码 | R-MDIP-T32 | R-MDIP-T32 | R-MDIP-T32 | R-MDIP-T32 | R-MDIP-T32 | R-MDIP-T32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
最大线性误差 (EL) | 0.012% | 0.012% | 0.012% | 0.012% | 0.012% | 0.012% |
位数 | 12 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 |
最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -25 °C | -55 °C | -55 °C | -25 °C |
输出位码 | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
封装主体材料 | METAL | METAL | METAL | METAL | METAL | METAL |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP32,.9 | DIP32,.9 | DIP32,.9 | DIP32,.9 | DIP32,.9 | DIP32,.9 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
温度等级 | MILITARY | MILITARY | OTHER | MILITARY | MILITARY | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
包装说明 | - | DIP, DIP32,.9 | - | DIP, DIP32,.9 | DIP, DIP32,.9 | DIP, DIP32,.9 |
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