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MX23L51212MC-20: 产品描述MASK ROM, 32MX16, 150ns, CMOS, PDSO70, 0.500 INCH, SSOP-70; 产品类别存储存储; 文件大小431KB，共10页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx

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MX23L51212MC-20概述

MASK ROM, 32MX16, 150ns, CMOS, PDSO70, 0.500 INCH, SSOP-70

MX23L51212MC-20规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Macronix
零件包装代码	SSOP
包装说明	SSOP, SOP70,.63,32
针数	70
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	150 ns
JESD-30 代码	R-PDSO-G70
JESD-609代码	e0
长度	28.5 mm
内存密度	536870912 bit
内存集成电路类型	MASK ROM
内存宽度	16
功能数量	1
端子数量	70
字数	33554432 words
字数代码	32000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	32MX16
封装主体材料	PLASTIC/EPOXY
封装代码	SSOP
封装等效代码	SOP70,.63,32
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3.3 V
认证状态	Not Qualified
座面最大高度	3.05 mm
最大待机电流	0.00004 A
最大压摆率	0.025 mA
最大供电电压 (Vsup)	3.63 V
最小供电电压 (Vsup)	2.97 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.8 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	12.6 mm
Base Number Matches	1

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MX23L51212

SEQUENTIAL 512M-BIT MASK ROM

FEATURES

• Bit organization

- 32M x 16 (word mode only)

- 256 words/page

- Total 128K pages

• Sequential access at 200ns cycle time in a page

• Asynchronous chip enable input (ALEH, ALEL)

• Access time

- Read latency time : 1000ns

- Read cycle time : 200ns

- RD access time : 150ns

• Current

- Operating : 25mA(max.)

- Address input : 2mA(max.)

- Standby : 40uA(max.)

• Supply voltage

- 3.0V~3.6V

• Package

- 70 pin SSOP

- 86 pin TSOP(II)

ORDER INFORMATION

Part No.

MX23L51212YC-20

MX23L51212MC-20

Read Cycle Time

200ns

Package

86 pin TSOP

70 pin SSOP

GENERAL DESCRIPTION

The product is a 512M bits (32M x 16) mask ROM

composed of 128K pages, and each consists of 256

words memory cell array. This mask ROM has a 16 bit

address input / data output bus (AD0~AD15), two address

latch enable pins (high : ALEH, low : ALEL), a read

strobe (RD).

There are 3 modes, Stand-by mode, Active mode, and

Address input mode. Stand-by mode is a non-operating

state, and has the smallest current dissipation. Active

mode is an operating state, and data output is possible.

Address input mode is a state of address input.

Address input is through AD bus when ALEL is high.

The high and low 16 bit addresses are latched at

ALEH’sand ALEL falling edges. As for high 16 bit ad-

dress, A0~A9 are through 10 bit address register,

A10~A15 are not used internally. As for low 16 bit ad-

dress, A1~A8 are through 8 bit address counter, A9~A15

are through 7 bit address register, and A0 are not used

internally. High address input must be done before low

address input, and both address inputs are needed for

page change or address change in a same page. After

address inputs, CE goes high at ALEH falling edge and

RD doesn't toggle, the ROM is in stand-by mode.

After ROM turned into Active mode from Address input

mode, it takes tL time to read. In a page, sequential

read access is possible at tCYC cycle time. Sequential

read operation (increment of internal address counter) is

done at every falling edge of RD. At the end of a page,

internal address counter raps around to the beginning of

the page.

P/N:PM0906

REV. 1.3, OCT. 06, 2004

MX23L51212MC-20相似产品对比

	MX23L51212MC-20	MX23L51212YC-20
描述	MASK ROM, 32MX16, 150ns, CMOS, PDSO70, 0.500 INCH, SSOP-70	MASK ROM, 32MX16, 150ns, CMOS, PDSO86, 0.400 INCH, MS-024, TSOP2-86
是否Rohs认证	不符合	不符合
厂商名称	Macronix	Macronix
零件包装代码	SSOP	TSSOP2
包装说明	SSOP, SOP70,.63,32	TSSOP, TSSOP86,.46,20
针数	70	86
Reach Compliance Code	unknown	unknown
ECCN代码	EAR99	EAR99
最长访问时间	150 ns	150 ns
JESD-30 代码	R-PDSO-G70	R-PDSO-G86
JESD-609代码	e0	e0
长度	28.5 mm	22.22 mm
内存密度	536870912 bit	536870912 bit
内存集成电路类型	MASK ROM	MASK ROM
内存宽度	16	16
功能数量	1	1
端子数量	70	86
字数	33554432 words	33554432 words
字数代码	32000000	32000000
工作模式	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C
组织	32MX16	32MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SSOP	TSSOP
封装等效代码	SOP70,.63,32	TSSOP86,.46,20
封装形状	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED
电源	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified
座面最大高度	3.05 mm	1.2 mm
最大待机电流	0.00004 A	0.00004 A
最大压摆率	0.025 mA	0.025 mA
最大供电电压 (Vsup)	3.63 V	3.63 V
最小供电电压 (Vsup)	2.97 V	2.97 V
标称供电电压 (Vsup)	3.3 V	3.3 V
表面贴装	YES	YES
技术	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING
端子节距	0.8 mm	0.5 mm
端子位置	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED
宽度	12.6 mm	10.16 mm
Base Number Matches	1	1

MX23L51212MC-20

MX23L51212MC-20概述

MX23L51212MC-20规格参数

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